METHOD OF DETERMING A VALUE OF A PARAMETER OF INTEREST OF A PATTERNING PROCESS, DEVICE MANUFACTURING METHOD

    公开(公告)号:EP3647871A1

    公开(公告)日:2020-05-06

    申请号:EP18203837.2

    申请日:2018-10-31

    Abstract: The disclosure relates to determining a value of a parameter of interest of a patterning process. A plurality of calibration data units is obtained from targets in a metrology process. Each of at least two of the calibration data units represents detected radiation obtained using different respective polarization settings in the metrology process, each polarization setting defining a polarization property of incident radiation of the metrology process and a polarization property of detected radiation of the metrology process. The calibration data units are used to obtain calibration information about the metrology process. A measurement data unit representing detected radiation scattered from a further target is obtained, the further target comprising a structure formed using the patterning process on the substrate or on a further substrate. The value of the parameter of interest is determined using the measurement data unit and the obtained calibration information.

    COMPUTATIONAL METROLOGY
    44.
    发明公开

    公开(公告)号:EP3441819A1

    公开(公告)日:2019-02-13

    申请号:EP17185116.5

    申请日:2017-08-07

    Abstract: A method, includes obtaining, for each particular feature of a plurality of features of a device pattern of a substrate being created using a patterning process, a modelled or simulated relation of a parameter of the patterning process between a measurement target for the substrate and the particular feature; and based on the relation and measured values of the parameter from the metrology target, generating a distribution of the parameter across at least part of the substrate for each of the features, the distributions for use in design, control or modification of the patterning process.

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