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    System for heat treating a sapphire component
    41.
    发明授权
    System for heat treating a sapphire component 有权

    公开(公告)号：US10222123B2

    公开(公告)日：2019-03-05

    申请号：US14744893

    申请日：2015-06-19

    Applicant: APPLE INC.

    Inventor： Matthew S. Rogers ,  Christopher D. Jones ,  Dale N. Memering ,  Alexander M. Hoffman ,  Ping Chung Chen ,  Chien-Wei Huang

    IPC: F27B17/00 ,  C30B29/20 ,  C30B33/02 ,  F27D5/00

    Abstract: A system for heat treating sapphire components to increase strength while maintaining the optical finish and/or transparency of the component. The system may include a fixture positioned in a furnace and configured to suspend an array or group of sapphire components. The fixture may include notches or other features to assist in locating and positioning the sapphire components. Shield elements or enclosures may also be interspersed with the sapphire components and may help produce a more uniform heat distribution and protect the sapphire components from emissions or deposits. Some aspects are directed to a sleeve tool and fixture jig that can be used to assemble the sapphire components onto the fixture in a way that reduces the risk of marring or otherwise damaging the sapphire components.

    Localized strengthening of features for a sapphire component
    42.
    发明授权
    Localized strengthening of features for a sapphire component 有权

    公开(公告)号：US10126061B1

    公开(公告)日：2018-11-13

    申请号：US14628969

    申请日：2015-02-23

    Applicant: APPLE INC.

    Inventor： Christopher D. Jones ,  Dale N. Memering ,  Matthew S. Rogers

    IPC: C03C25/62 ,  F27D5/00

    Abstract: Methods and systems for localized strengthening of features of a component formed from a sapphire material include a combination of holistic heating and localized surface heating. In one example, the localized heating may occur via laser thermal, flame polishing, hot wire heating, plasma etching, or chemical treatment. By combining the localized surface heating with holistic heating, near-melt or melt processing in a localized area can be achieved while avoiding overheating of well-polished areas, and therefore minimizing defects that would otherwise be caused by excessive heating. This may be used for strengthening features of components formed from sapphire material that are difficult to polish, such as non-planar features.

    LAMINATING SAPPHIRE AND GLASS USING INTERMOLECULAR FORCE ADHESION
    44.
    发明申请
    LAMINATING SAPPHIRE AND GLASS USING INTERMOLECULAR FORCE ADHESION 审中-公开
    使用分子力粘合层压椴树和玻璃

    公开(公告)号：US20160270247A1

    公开(公告)日：2016-09-15

    申请号：US15059216

    申请日：2016-03-02

    Applicant: Apple Inc.

    Inventor： Christopher D. Jones ,  Dale N. Memering

    IPC: H05K5/03 ,  H05K5/00

    Abstract: An electronic device comprises a housing, a display coupled to the housing, and a protective cover coupled to the housing and covering the display. The protective cover comprises a transparent layer having a first surface facing the display and a second surface opposite the first surface. The protective cover also comprises a sapphire layer having a third surface corresponding to an exterior surface of the electronic device. The sapphire layer also has a fourth surface opposite the third surface and bonded to the second surface of the transparent layer via intermolecular forces.

    Abstract translation: 电子设备包括壳体，联接到壳体的显示器和联接到壳体并覆盖显示器的保护盖。 保护罩包括具有面向显示器的第一表面和与第一表面相对的第二表面的透明层。 保护盖还包括具有对应于电子设备的外表面的第三表面的蓝宝石层。 蓝宝石层还具有与第三表面相对的第四表面，并且通过分子间力与透明层的第二表面结合。

    Electronic devices with chemically strengthened coherent fiber bundles
    46.
    发明授权
    Electronic devices with chemically strengthened coherent fiber bundles 有权

    公开(公告)号：US11573450B1

    公开(公告)日：2023-02-07

    申请号：US17408294

    申请日：2021-08-20

    Applicant: Apple Inc.

    Inventor： Christopher D. Jones ,  Dale N. Memering ,  Daniel J. Barrett ,  Erik G. de Jong ,  Sameer Pandya ,  Tyler A. Marshall

    IPC: G02F1/1335 ,  G02B6/08 ,  F21V8/00 ,  G02F1/1333 ,  G02B6/02 ,  G06F1/16

    Abstract: An electronic device may have a display and other optical components such as optical sensors. The display and other components may be overlapped by chemically strengthened glass coherent fiber bundles. The surfaces of a coherent fiber bundle may include ion-exchanged glass that places theses surfaces under compressive stress. In some configurations, the coherent fiber bundle is symmetrically stressed and has equal amounts of compressive stress on opposing surfaces. In other configurations, the coherent fiber bundle is asymmetrically stressed and has more compressive stress on one surface than the other. The coherent fiber bundle may have areas with curved cross-sectional profiles, planar areas, and/or areas with compound curvature. Sensor windows may be formed in the coherent fiber bundle that are surrounded by an opaque area. When overlapping a display, the coherent fiber bundle may serve as a display cover glass layer.

    Systems with adjustable windows
    47.
    发明授权
    Systems with adjustable windows 有权

    公开(公告)号：US11498397B2

    公开(公告)日：2022-11-15

    申请号：US16815898

    申请日：2020-03-11

    Applicant: Apple Inc.

    Inventor： Christopher D. Jones ,  Ibuki Kamei ,  James R. Wilson ,  Clarisse Mazuir ,  John Raff ,  Budhadipta Dan ,  David E. Kingman ,  Martin Melcher

    IPC: B60J3/04 ,  G02F1/01 ,  B60J3/00 ,  E06B3/67

    Abstract: A system such as a vehicle may have adjustable structures such as adjustable windows. Adjustable windows may have adjustable layers such as adjustable tint layers, adjustable reflectivity layers, and adjustable haze layers. Adjustable window layers may be incorporated into a window with one or more transparent structural layers such as a pair of glass window layers. Adjustable components such as adjustable reflectivity layers, adjustable haze layers, and adjustable tint layers may be interposed between the pair of glass window layers. Fixed partially reflective mirrors, fixed tint layers, and/or fixed haze layers may be used in place of adjustable tint, haze, and reflectivity layers and/or may be incorporated into windows in addition to adjustable tint, haze, and reflectivity layers.

    OPTICAL COMPONENTS FOR ELECTRONIC DEVICES
    48.
    发明申请
    OPTICAL COMPONENTS FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20220342163A1

    公开(公告)日：2022-10-27

    申请号：US17456614

    申请日：2021-11-26

    Applicant: Apple Inc.

    Inventor： Vivek Venugopal ,  Jacky G. Ko ,  Ueyn L. Block ,  James R. Wilson ,  Christopher D. Jones

    IPC: G02B6/42 ,  G02B6/08 ,  H01L31/0232

    Abstract: An electronic device can include a housing defining an aperture, and an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the housing. An optical component can be disposed in the aperture and can include a first region of a first material having a first index of refraction, the first region aligned with the electromagnetic radiation emitter, a second region of the first material, the second region aligned with the electromagnetic radiation detector, and a bulk region surrounding a periphery of the first region and a periphery of the second region, the bulk region including a second material having a second index of refraction that is lower than the first index of refraction.

    Localized control of bulk material properties
    50.
    发明授权
    Localized control of bulk material properties 有权

    公开(公告)号：US11420900B2

    公开(公告)日：2022-08-23

    申请号：US16396208

    申请日：2019-04-26

    Applicant: Apple Inc.

    Inventor： Tyler A. Marshall ,  Christopher D. Jones

    IPC: C03C10/00 ,  G02F1/055

    Abstract: Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.

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