公开(公告)号：WO2007079077A2

公开(公告)日：2007-07-12

申请号：PCT/US2006049272

申请日：2006-12-22

Applicant: CORNING INC ,  DANIELSON PAUL S ,  DEJNEKA MATTHEW J ,  GADKAREE KISHOR P ,  LAPP JOSEF C ,  PINCKNEY LINDA R

Inventor： DANIELSON PAUL S ,  DEJNEKA MATTHEW J ,  GADKAREE KISHOR P ,  LAPP JOSEF C ,  PINCKNEY LINDA R

CPC classification number: H01L21/76254 ,  C03C3/062 ,  C03C3/068 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/095 ,  C03C27/00 ,  H01L27/1214 ,  H01L29/78603 ,  H01L29/78684

Abstract: A semiconductor-on-insulator structure including first and second layers which are attached to one another either directly or through one or more intermediate layers. The first layer includes a substantially single crystal germanium semiconductor material while the second layer comprises a glass or a glass-ceramic material having a linear coefficient thermal of expansion (25-300°C) which is within the range of +/- 20x10 -7 /°C of the linear coefficient thermal of expansion of the germanium first layer.

Abstract translation: 一种绝缘体上半导体结构，其包括直接或通过一个或多个中间层彼此附接的第一和第二层。 第一层包括基本上单晶锗半导体材料，而第二层包括玻璃或具有线性系数热膨胀系数（25-300℃）的玻璃 - 陶瓷材料，其温度范围为+/- 20×10 ^{-7 /°C。}

公开(公告)号：WO2011149807A2

公开(公告)日：2011-12-01

申请号：PCT/US2011037499

申请日：2011-05-23

Applicant: CORNING INC ,  GADKAREE KISHOR P ,  LIM JAMES R ,  REDDY KAMJULA P

Inventor： GADKAREE KISHOR P ,  LIM JAMES R ,  REDDY KAMJULA P

IPC: H01G9/058 ,  B05D5/12 ,  H01G9/042 ,  H01G9/048 ,  H01G9/155

CPC classification number: H01G11/86 ,  H01G11/26 ,  H01G11/28 ,  H01G11/38 ,  H01G11/70 ,  Y02E60/13 ,  Y02T10/7022

Abstract: A multi-layer electrode includes a current collector having opposing first and second major surfaces, a fused carbon layer formed over one or both of the major surfaces, a conductive adhesion layer formed over each fused carbon layer, and an activated carbon layer formed over each conductive adhesive layer. The multi-layer electrode can be incorporated into a high energy density, high power density device such as an electric double layer capacitor.

Abstract translation: 多层电极包括具有相对的第一和第二主表面的集电器，在一个或两个主表面上形成的熔融碳层，在每个熔融碳层上形成的导电粘合层，以及在每个熔融碳层上形成的活性炭层 导电胶层。 多层电极可以结合到高能量密度的高功率密度器件中，例如双电层电容器。

公开(公告)号：WO2011090993A3

公开(公告)日：2011-11-17

申请号：PCT/US2011021661

申请日：2011-01-19

Applicant: CORNING INC ,  GADKAREE KISHOR P ,  LIU JIA

Inventor： GADKAREE KISHOR P ,  LIU JIA

IPC: C01B31/08 ,  C01B31/12 ,  H01M4/133

CPC classification number: H01G11/34 ,  C01B32/30 ,  C01B32/342 ,  H01G11/44 ,  H01M4/625 ,  H01M4/8673 ,  Y02E60/13

Abstract: A method for producing a low oxygen content activated carbon material includes heating a natural, non-lignocellulosic carbon precursor in an inert or reducing atmosphere to form a first carbon material, mixing the first carbon material with an inorganic compound to form an aqueous mixture, heating the aqueous mixture in an inert or reducing atmosphere to incorporate the inorganic compound into the first carbon material, removing the inorganic compound from the first carbon material to produce a second carbon material, and heating the second carbon material in an inert or reducing atmosphere to form the low oxygen content activated carbon material. The activated carbon material is suitable to form improved carbon-based electrodes for use in high energy density devices.

Abstract translation: 生产低氧含量活性炭材料的方法包括在惰性或还原气氛中加热天然非木质纤维素碳前体以形成第一碳材料，将第一碳材料与无机化合物混合以形成含水混合物，加热 所述含水混合物在惰性或还原气氛中以将所述无机化合物结合到所述第一碳材料中，从所述第一碳材料除去所述无机化合物以产生第二碳材料，并且在惰性或还原气氛中加热所述第二碳材料以形成 低氧含量的活性炭材料。 活性炭材料适合形成用于高能量密度装置的改进的碳基电极。

公开(公告)号：WO2010099208A3

公开(公告)日：2010-10-21

申请号：PCT/US2010025244

申请日：2010-02-24

Applicant: CORNING INC ,  GADKAREE KISHOR P ,  SHI YOUCHUN

Inventor： GADKAREE KISHOR P ,  SHI YOUCHUN

IPC: B01D53/04 ,  B01J20/20 ,  B01J20/22 ,  B01J20/28

CPC classification number: B01D53/02 ,  B01D53/0446 ,  B01D53/0462 ,  B01D2253/102 ,  B01D2253/342 ,  B01D2257/504 ,  B01D2259/40096 ,  B01D2259/402 ,  B01J20/20 ,  B01J20/28004 ,  B01J20/2803 ,  B01J20/28045 ,  B01J20/28057 ,  B01J20/3204 ,  B01J20/3248 ,  B01J20/3416 ,  B01J20/3441 ,  B01J20/3483 ,  Y02C10/04 ,  Y02C10/06 ,  Y02C10/08

Abstract: A sorbent structure comprising a continuous activated carbon body in the form of a flow-through substrate; and an additive provided on the flow-through substrate, wherein the additive is capable of enhancing the sorption of CO2 on the sorbent structure. Methods of making the sorbent structure, its use for CO2 capture, and methods for regenerating the structure for further use.

Abstract translation: 一种吸附剂结构，包括呈流过基底形式的连续活性炭体; 以及设置在流通基材上的添加剂，其中添加剂能够增强吸附剂结构上的CO 2的吸附。 制备吸附剂结构的方法，其用于二氧化碳捕集的方法，以及用于再生该结构以供进一步使用的方法。

公开(公告)号：WO2009017688A3

公开(公告)日：2009-08-06

申请号：PCT/US2008009074

申请日：2008-07-25

Applicant: CORNING INC ,  ADDIEGO WILLIAM P ,  DAWES STEVEN B ,  GADKAREE KISHOR P ,  SHI YOUCHUN ,  SQUIER GARY G ,  VILENO ELIZABETH M

Inventor： ADDIEGO WILLIAM P ,  DAWES STEVEN B ,  GADKAREE KISHOR P ,  SHI YOUCHUN ,  SQUIER GARY G ,  VILENO ELIZABETH M

IPC: C04B38/00 ,  B01D46/24 ,  F01N3/022

CPC classification number: C04B38/0615 ,  C04B35/111 ,  C04B35/14 ,  C04B35/195 ,  C04B35/478 ,  C04B2111/00793 ,  C04B2235/42 ,  C04B2235/5436 ,  C04B2235/606 ,  F01N3/022 ,  F26B1/00 ,  F26B3/347 ,  F26B2210/02 ,  Y02T10/20 ,  C04B38/0006 ,  C04B38/0054 ,  C04B38/0074 ,  C04B35/10

Abstract: This invention describes a composition and article for a honeycomb body using dielectric drying. The composition comprises a refractory material and a pore former comprising activated carbon. The activated carbon pore former improves efficiency of dielectric drying, increases penetration depth, accelerates volatilization of the pore former, and reduces cracking of the green body.

Abstract translation: 本发明描述了一种使用电介质干燥的蜂窝体的组合物和制品。 组合物包含耐火材料和包含活性炭的成孔剂。 活性炭成孔剂提高介电干燥效率，增加渗透深度，加速造孔剂挥发，减少生坯开裂。

公开(公告)号：WO2008013719A3

公开(公告)日：2008-03-27

申请号：PCT/US2007016295

申请日：2007-07-18

Applicant: CORNING INC ,  BUSH ROBERT L ,  DAWES STEVEN B ,  FEHLNER FRANCIS P ,  GADKAREE KISHOR P ,  GARNER SEAN M ,  QUESADA MARK A

Inventor： BUSH ROBERT L ,  DAWES STEVEN B ,  FEHLNER FRANCIS P ,  GADKAREE KISHOR P ,  GARNER SEAN M ,  QUESADA MARK A

IPC: B32B5/02

CPC classification number: D21H17/68 ,  D21H13/40 ,  D21H13/44 ,  D21H13/50 ,  G02F1/133305 ,  Y10T428/24355 ,  Y10T428/4935

Abstract: A flexible substrate is described herein which is made from a freestanding inorganic material (e.g., mica paper, carbon paper, glass fiber paper) with pores/interstices that have been impregnated with a special impregnating material (e.g., silsesquioxane, alkali silicate glass with weight ratio of SiO 2 /X 2 O (X is alkali Na, K etc.) between 1.6-3.5). In one embodiment, the flexible substrate is made by: (1) providing a freestanding inorganic material; (2) providing an impregnating material; (3) impregnating the pores/interstices within the freestanding inorganic material with the impregnating material; and (4) curing the freestanding inorganic material with the impregnated pores/interstices to form the flexible substrate. The flexible substrate is typically used to make a flexible display or a flexible electronic.

Abstract translation: 本文描述了由独立的无机材料（例如，云母纸，碳纸，玻璃纤维纸）制成的柔性基底，其具有用特殊浸渍材料浸渍的孔隙/间隙（例如，倍半硅氧烷，具有重量的碱性硅酸盐玻璃 SiO 2 / X 2 O（X是碱Na，K等）的比例在1.6-3.5之间）。 在一个实施例中，柔性基底由以下制成：（1）提供独立的无机材料; （2）提供浸渍材料; （3）用浸渍材料浸渍在独立无机材料内的孔/间隙; 和（4）用浸渍的孔/间隙固化独立的无机材料以形成柔性基材。 柔性基板通常用于制造柔性显示器或柔性电子元件。

公开(公告)号：WO2007142910A2

公开(公告)日：2007-12-13

申请号：PCT/US2007012602

申请日：2007-05-24

Applicant: CORNING INC ,  CITES JEFFREY S ,  GADKAREE KISHOR P ,  MASCHMEYER RICHARD O

Inventor： CITES JEFFREY S ,  GADKAREE KISHOR P ,  MASCHMEYER RICHARD O

IPC: H01L21/762 ,  H01L21/265 ,  H01L27/12

CPC classification number: H01L21/76254 ,  H01L21/26506

Abstract: Disclosed are methods for making SOI and SOG structures using purified ion shower for implanting ions to the donor substrate. The purified ion shower provides expedient, efficient, low-cost and effective ion implantation while minimizing damage to the exfoliation film.

Abstract translation: 公开了使用纯化离子淋浴制备SOI和SOG结构以将离子注入给体衬底的方法。 纯化的离子淋浴提供方便，高效，低成本和有效的离子注入，同时最小化对剥离膜的损害。

公开(公告)号：WO2006023594A3

公开(公告)日：2007-05-10

申请号：PCT/US2005029314

申请日：2005-08-17

Applicant: CORNING INC ,  AITKEN BRUCE G ,  DEJNEKA MATTHEW J ,  GADKAREE KISHOR P ,  PINCKNEY LINDA R

Inventor： AITKEN BRUCE G ,  DEJNEKA MATTHEW J ,  GADKAREE KISHOR P ,  PINCKNEY LINDA R

IPC: H01L27/01 ,  H01L23/58

CPC classification number: H01L29/78603 ,  C03C3/06 ,  C03C3/085 ,  C03C3/095 ,  C03C3/097 ,  C03C3/11 ,  C03C10/00 ,  C03C10/0009 ,  C03C10/0018 ,  C03C10/0027 ,  C03C10/0036 ,  C03C10/0045 ,  H01L21/76254 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1214 ,  H01L27/1266 ,  H01L29/7842

Abstract: The present invention relates to semiconductor-on-insulator structures having strained semiconductor layers According to one embodiment of the invention, a semiconductor-on- insulator structure has a first layer including a semiconductor material (110), attached to a second layer including a glass or glass-ceramic (120), with the strain point of the glass or glass-ceramic equal to or greater than about 8000C.

Abstract translation: 本发明涉及具有应变半导体层的绝缘体上半导体结构。根据本发明的一个实施例，绝缘体上半导体结构具有包括半导体材料（110）的第一层，其附着到包括玻璃 或玻璃 - 陶瓷（120），玻璃或玻璃陶瓷的应变点等于或大于约8000℃。

公开(公告)号：EP2054900A4

公开(公告)日：2012-06-27

申请号：EP07796920

申请日：2007-07-18

Applicant: CORNING INC

Inventor： GADKAREE KISHOR P ,  MACH JOSEPH F

IPC: H01G9/058

CPC classification number: H01G11/38 ,  H01G11/34 ,  Y02E60/13 ,  Y10T29/417

公开(公告)号：EP2020022A4

公开(公告)日：2011-04-27

申请号：EP07755456

申请日：2007-04-16

Applicant: CORNING INC

Inventor： FENG JIANGWEI ,  GADKAREE KISHOR P ,  MACH JOSEPH F ,  MOORE MICHAEL J ,  STOCKER MARK ANDREW

IPC: H01L21/762

CPC classification number: H01L21/76254 ,  H01L21/30604 ,  H01L21/30608