Abstract:
PROBLEM TO BE SOLVED: To seal a light-emitting device well.SOLUTION: In an electroluminescence (EL) panel 1, a substrate 10 of which a light-emitting region R including a plurality of arranged EL elements 8 is provided on the upper surface, and a sealing substrate 22 that faces the upper surface side of the substrate 10 are adhered to each other by a sealing member 15; and the light-emitting region R is sealed between the substrate 10 and the sealing substrate 22. The substrate 10 and the sealing substrate 22 are adhered to each other by the sealing member 15 in which a second adhesive surface 152 having relatively strong adhesive force faces the sealing substrate 22 side, and a first adhesive surface 151 having relatively small adhesive force faces the upper surface side of the substrate 10.
Abstract:
PROBLEM TO BE SOLVED: To maintain a fuel battery cell housed in a heat insulation container at an appropriate operation temperature. SOLUTION: The fuel cell device is provided with a fuel battery cell 8 to take out electric power by electrochemical reaction of fuel, a heat exchanger 22 to heat a fluid used in the fuel battery cell 8 by the heat of the fuel battery cell 8, and a heat insulation container 20 to house the fuel battery cell 8 and the heat exchanger 22. Since the excess heat generated in the fuel battery cell is used to heat the fluid by the heat exchanger 22, it can be prevented that the temperature of the fuel battery cell increases to an appropriate operation temperature or more, and the fuel battery cell 8 housed in the heat insulation container 20 can be maintained at an appropriate operation temperature. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide mobile electronic equipment capable of enhancing heat radiation from a housing. SOLUTION: The mobile electronic equipment 1 comprises a heat source 10 for generating heat during production, storage, or consumption of electric power, a housing base material 21 for internally housing the heat source 10, and a radiating film 22 provided on the external surface of the housing base material 21 and having a higher radiating coefficient than that of the housing base material 21. The radiating film 22 having the higher radiating coefficient than that of the housing base material 21 can be provided on the external surface of the housing base material 21 to enhance the heat radiation from the housing 20 of the mobile electronic equipment 1. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal inkjet print head with a heating resistor which is superior in cavitation resistance and has good heating efficiency. SOLUTION: A heating resistor 30 comprises a lower layer 31 which contacts the substrate surface of a chip substrate 21, an intermediate layer 32 yielded by the annealing treatment of the lower layer 31, and a heat generating resistor layer 33 sticking to this. The lower layer 31 is formed by any of Ta-Si-O, Ta-Si-O-N, Ta-Si-Al-O, or Ta-Si-Al-O-N, and the heat generating resistor layer 33 is also formed by the same composition. A resistance R2 of the lower layer 31 has a relation of R2≥R1×10 with a resistance R1 of the heat generating resistor layer 33 and current hardly flows, and since only the thin heat generating resistor layer 33 generates heat, heating efficiency is excellent. In addition, since both compositions of them are the same, adhesion force is strong, and since a thickness adding both thicknesses d2 and d1 is made to become d1+d2≥4000Å, the heating resistor excels in cavitation resistance. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a reaction device capable of making the whole device compact compared with the current one; and to provide a power generation device and electronic equipment. SOLUTION: The reaction device 12 is equipped with a reaction device main body 2 in which a reformer 20 forming hydrogen from fuel and a carbon monoxide removing device 21 forming carbon dioxide from carbon monoxide are installed so as to communicate with each other and a heat reflection membrane 33 installed so as to face the outer surface of the reaction device main body and reflecting heat rays radiated from the reaction device main body 2 side to the reaction device main body 2 side, and the heat reflection membrane 3 has an opening part 34 in at least one part. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new device using a hydrogen storage material as a hydrogen supply source. SOLUTION: A hydrogen storing and discharging device 7 includes a vessel 21 forming an inner space 21a. The vessel 21 is formed by anode junction of a sealing base plate 23 on a plane base plate 22, a recess part is formed on a junction surface of the sealing based plate 23 and the plane base plate 22, and the recess part becomes the inner space 21a. Hydrogen storing membrane 24 is formed on the base plate 22 in the inner space 21a and diffusion prevention membrane 25 is formed on the hydrogen storing membrane 24, and hydrogen permselective membrane 26 is formed on the diffusion prevention membrane 25. A membrane heater 27 is formed on a reverse surface of the base plate 22. Hydrogen is discharged from the hydrogen storing membrane 24 when the membrane heater 27 generates heat, and hydrogen is stored in the hydrogen storing membrane 24 when the membrane heater 27 does not generates heat. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a stack structure constituted by stacking a plurality of substrates and having high joining strength, and its manufacturing method. SOLUTION: A buffer film 3 comprising a Ta-Si-O system material is formed on one side 2a of the glass substrate 2 and a connecting film 4 comprising Ta is formed on the buffer film 3. A plurality of the glass substrates 2 thus produced are prepared. Then, the connecting film 4 of the new glass substrate 2 is brought into contact with the other surface 2b of the glass substrates 2 to apply voltage so that the voltage of the connecting film 4 of the previous glass substrate 2 becomes higher than that of the connecting film 4 of the new glass substrate 2 to perform anodic connection. The stack structure 1 is manufactured by subjecting a plurality of the glass substrates 2 to anodic connection. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem wherein voltage at the time of connection of an anode becomes high in a case that a glass substrate containing sodium is used to manufacture a stack structure type microreactor. SOLUTION: A buffer film 3 comprising a Ta-Si-O system material is formed on one side 2a of the glass substrate 2 and a conductive film 4 comprising Ta is formed on the buffer film 3. A plurality of the glass substrates 3 thus produced are prepared. Then, the conductive film 4 of the new glass substrate 2 is brought into contact with the other surface 2b of the glass substrates 2 to apply voltage so that the voltage of the conductive film 4 of the previous glass substrate 2 becomes higher than that of the conductive film 4 of the new glass substrate 2 to perform anodic connection. The stack structure 1 is manufactured by subjecting a plurality of the glass substrates 2 to anodic connection but a glass substrate containing lithium is used in any glass substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To prevent open air from leaking into a glass vessel through a gap between a lead wire and the glass vessel. SOLUTION: A heat treating furnace 40 of a vaporizer 31 has a structure where substrates 41, 42 are superposed and joined to each other, and a micro flow passage 43 folded in a switchback way is formed at a joint portion between the substrates 41, 42. The furnace 40 is disposed in a glass vessel 53. A heater resistance film 47 is formed along the flow passage 43 on the substrate 42, and lead wires 48, 49 made of Ni or a Ni alloy are connected to the resistance film 47. An oxide film 50 formed by a Ni oxide is formed on the surfaces of the lead wires 48, 49. The lead wires 48, 49 are led to the outside through the glass vessel 53, and the oxide film 50 is adhered to the lead wires 48, 49 and the glass vessel 53. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a heating resistor having high resistivity and a low rate of temperature change, and to provide its manufacturing method which ensures the high resistivity reliably in terms of time. SOLUTION: The heating resistor includes at least Ta, Si, O, N, and H as component elements. Preferably, the ratio of the component elements are as the following: the mol% M2 of N falls within the range of 5≤M2≤25, the molar ratio Si/Ta of Si and Ta falls within the range of 0.35