公开(公告)号：US20050191906A1

公开(公告)日：2005-09-01

申请号：US11076779

申请日：2005-03-10

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01L23/48 ,  H01L23/498 ,  H01R13/33 ,  H05K3/32 ,  H01R13/648

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2464 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact. An electrical contact may also be formed by folding a portion of the unitary structure so as to form one or more pleats, annealing the pleated unitary structure, and then cutting the pleated unitary structure so as to release one or more electrical contacts. The precursor material may also be formed by photo-etching a sheet of conductive material so as to form a mesh, and then annealing the mesh. A connector system may be formed including a housing defining a plurality of openings that are each filled with an electrical contact comprising a plurality of interlaced and annealed wires that have been previously either rolled or pleated.

Abstract translation: 通过将电线编织或编织在一起以形成网格，退火网格和切割退火的网格以形成多个单独的电触点，由多个交织和退火的线形成的电接触。 还提供了一种用于形成用于制造电触点的前体材料的方法，其包括操作多条导线以将导线交织成单一结构。 然后将整体结构退火。 然后可以通过弹性地滚动一体结构的一部分来形成电子接触，从而形成管，退火管，然后切割整体结构，从而释放管，从而形成电接触。 还可以通过折叠一体结构的一部分以形成一个或多个褶皱，退绕折叠的整体结构，然后切割褶皱的整体结构以便释放一个或多个电触点，来形成电接触。 前体材料也可以通过光刻蚀导电材料片以形成网格，然后对网格进行退火而形成。 可以形成连接器系统，其包括限定多个开口的壳体，每个开口填充有包括先前已经被卷起或打褶的多个隔行和退火的电线的电接触。

公开(公告)号：US20050164534A1

公开(公告)日：2005-07-28

申请号：US11082364

申请日：2005-03-17

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01L23/48 ,  H01L23/498 ,  H01R13/33 ,  H05K3/32 ,  H01R4/66

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2464 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

Abstract translation: 一种连接器系统，包括具有第一集管的第一壳体，所述第一集管包括与导体电连通的一个或多个导电焊盘。 第二壳体，其可与第一壳体配合并且包括位于配合面上的第二头部。 第二标头包括一个或多个导电焊盘，其与导体电接合并且与第一集管的一个或多个导电焊盘相对定位。 位于第一集管和第二集管之间的插入件，其具有连接穿过插入件的编织接触件朝向第一和第二集管上的导电焊盘。 所述插入件可在第一位置和第二位置之间移动，所述第一位置与所述至少一个所述导电焊盘间隔开所述编织接触部，以及第二位置，其中编织接触件电接合所述导电焊盘之一。

公开(公告)号：US06659778B2

公开(公告)日：2003-12-09

申请号：US10210300

申请日：2002-08-01

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R1200

CPC classification number: H01R13/2407 ,  G01R1/06722 ,  H01R12/52 ,  H01R12/57 ,  H01R13/2421 ,  H01R13/2492

Abstract: The present invention provides an electrical contact comprising a first member having spring properties and a second member wrapped around at least a portion of the first member wherein the second member has a greater electrical conductivity than the first member. In one embodiment, a conductor is wrapped around at least a portion of a spring. In another embodiment, the spring is formed into a coil or helix with a wire wrapped around at least a portion of the helical spring. In one form of this embodiment, the spring has a plurality of turns and the wire is wrapped around at least two of the turns. In another form of this embodiment, the spring has a plurality of turns and the wire is wrapped around all of the turns. An interposer connector is also provided having a frame including a top surface and a bottom surface and a plurality of apertures arranged in a pattern and opening onto the top and bottom surfaces of the frame. A plurality of springs are provided with each spring having a conductor wrapped around at least a portion of the spring where the conductor has a greater electrical conductivity than the spring. One of the springs is positioned within each of the apertures so that at least a portion of each of the conductors is exposed above the top and bottom surfaces of the frame.

公开(公告)号：US06590159B2

公开(公告)日：2003-07-08

申请号：US09775991

申请日：2001-02-05

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01L2302

CPC classification number: H05K7/1061 ,  H05K7/023

Abstract: The present invention provides an electronic package for high speed, high performance semiconductors. It includes a plurality of devices, circuit members and short interconnections between the circuit members for maintaining high electrical performance. Suitable applications requiring high speed, impedance-controlled transmission line buses throughout the entire package include microprocessor and digital signal processor data buses, and high speed memory buses for products such as laptop and handheld computing and telecommunications devices. Circuit members include printed circuit boards and circuit modules, and may be formed from a wide variety of materials with unpacked or packed semiconductors attached directly to the circuit members. Through the use of clamps the package is at least factory reworkable and can be field separable. Thermal management structures may be included to maintain the high density devices within a reliable range of operating temperatures.

公开(公告)号：US06496380B1

公开(公告)日：2002-12-17

申请号：US09645859

申请日：2000-08-24

Applicant: Che-Yu Li ,  David A. Lysack ,  Thomas L. Sly

Inventor： Che-Yu Li ,  David A. Lysack ,  Thomas L. Sly

IPC: H05K702

CPC classification number: G11C5/06 ,  G11C5/04 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0246 ,  H05K1/14 ,  H05K1/141 ,  H05K2201/044 ,  H05K2201/10022

Abstract: The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.

Abstract translation: 本发明的特征在于与高速，阻抗控制的总线一起使用的存储器模块。 每个存储卡可以是具有与其直接连接的存储芯片的常规印刷电路卡。 或者，可以使用由可插拔子模块组装的高密度存储器模块。 这些子模块可以临时组装用于测试和/或老化。 直接安装在存储卡或存储器模块上的总线终端消除了对总线出口连接的需要，允许释放连接容量来解决模块上的额外存储容量。 创新的针孔接触系统用于将子模块连接到存储器模块，并且可选地将存储器模块连接到主板或类似结构。 可以将热控制结构放置在存储器模块中，冷却更多数量的存储器芯片以防止过多的热量积聚并确保可靠的存储器操作。

公开(公告)号：US5867236A

公开(公告)日：1999-02-02

申请号：US652032

申请日：1996-05-21

Applicant: Robert Babuka ,  Raymond G. Greene ,  John P. Koons ,  J. Peter Krusius ,  Che-Yu Li ,  Donald P. Seraphim

Inventor： Robert Babuka ,  Raymond G. Greene ,  John P. Koons ,  J. Peter Krusius ,  Che-Yu Li ,  Donald P. Seraphim

IPC: G02F1/1333 ,  G02F1/1339 ,  G02F1/133

CPC classification number: G02F1/1339 ,  G09F9/3026 ,  G02F1/13336

Abstract: The present invention features methods and apparatuses for sealing tiled, flat-panel displays (FPDs). Tile edges corresponding with the display's perimeter edges are designed with a wide seal. Interior edges, however, have narrow seals in order to maintain the desired, constant, pixel pitch across tile boundaries. In some cases, this invention applies specifically to arrays of tiles 2.times.2 or less, and, in other cases, to N.times.M arrays, where N and M are any integer numbers. The tiles are enclosed with top and bottom glass plates, which are sealed with an adhesive bond to the tiles on the outside perimeter of the tiled display. Vertical seams (where tiles meet at the perimeter of the FPD) are sealed with a small amount of polymer. The seal may be constructed between a cover plate and a back plate, sandwiching the tiles. The AMLCD edges may be coated with either a non-permeable material or a polymer having an extremely low permeability (for example, Parylene.TM.). Alternatively, the edge sealing of individual tiles can be achieved by using a metallized film adhesive that is bonded to the tile edges. A low-temperature, sintered Solgel can be used to achieve extremely narrow, yet mechanically strong, seals for individual tiles. Still another enhancement employs a metallurgical seal outside a narrow, polymer seal.

Abstract translation: 本发明的特征在于用于密封平铺平板显示器（FPD）的方法和装置。 对应于显示器周边边缘的平铺边缘设计有广泛的密封。 然而，内部边缘具有窄的密封，以便在瓦片边界上保持所需的恒定的像素间距。 在某些情况下，本发明特别适用于2×2以下的瓦片阵列，在其他情况下，适用于N×M阵列，其中N和M是任何整数。 瓷砖用顶部和底部玻璃板封闭，玻璃板通过粘合剂粘结在瓷砖显示器的外周边上的瓷砖上。 垂直接缝（其中瓷砖在FPD周边相遇）用少量聚合物密封。 密封件可以构造在盖板和背板之间，夹住瓦片。 AMLCD边缘可以涂覆有非渗透性材料或具有极低渗透性的聚合物（例如，Parylene TM）。 或者，各个瓦片的边缘密封可以通过使用结合到瓦片边缘的金属化膜粘合剂来实现。 低温烧结的Solgel可用于为单个瓷砖获得极窄但机械强度的密封。 另一个改进是在窄的聚合物密封之外采用冶金密封。

公开(公告)号：US5693170A

公开(公告)日：1997-12-02

申请号：US727227

申请日：1996-10-08

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: G09F9/33 ,  H01J9/18 ,  H01J29/02 ,  H01J29/92 ,  H01J31/12 ,  H01L27/32 ,  H01J1/62

CPC classification number: H01J9/185 ,  G09F9/33 ,  H01J29/028 ,  H01J29/92 ,  H01J31/125 ,  H01J2201/304 ,  H01J2329/863 ,  H01L27/3293 ,  Y10T156/1092 ,  Y10T29/49002

Abstract: A panel display includes a common substrate on which a plurality of small display tiles are mounted in an array and electrically interconnected to replicate a large area panel. Each tile includes a plurality of contact pads which are aligned with corresponding contact pads on the substrate. Solder joints between corresponding contact pads mechanically align and secure the tiles on the substrate, and provide electrical connections therebetween. Selected substrate contact pads are electrically interconnected to provide electrical connections between adjacent tiles.

Abstract translation: 面板显示器包括公共基板，多个小显示瓦片安装在阵列上并电互连以复制大面积面板。 每个瓦片包括与衬底上的相应接触焊盘对准的多个接触焊盘。 相应接触垫之间的焊接接头将衬垫上的瓷砖机械地对准和固定，并在其间提供电连接。 所选择的衬底接触垫电互连以提供相邻瓷砖之间的电连接。