PROCESS FOR THE DIMERIZATION OF A CONJUGATED DIENE
    42.
    发明申请
    PROCESS FOR THE DIMERIZATION OF A CONJUGATED DIENE 审中-公开
    连接二极管的二次方法

    公开(公告)号:WO1994010110A1

    公开(公告)日:1994-05-11

    申请号:PCT/NL1993000211

    申请日:1993-10-21

    Inventor: DSM N.V.

    CPC classification number: C07C2/52 C07C2531/18 C07C2601/16 C07C13/20

    Abstract: The invention relates to a process for the dimerization of a conjugated diene using an iron triad metal nitrosyl halide, in combination with a reducing agent, as catalyst. The process is characterized in that the dimerization is carried out in the presence of nitrogen monoxide (NO). The invention is of interest in particular for the dimerization of butadiene to 4-vinyl cyclohexene.

    Abstract translation: 本发明涉及一种使用铁三联体金属亚硝酰基卤化物与还原剂组合作为催化剂将共轭二烯二聚的方法。 该方法的特征在于二聚反应在一氧化氮(NO)存在下进行。 本发明特别用于将丁二烯二聚成4-乙烯基环己烯。

    THERMOPLASTIC POLYMER COMPOSITION
    45.
    发明申请
    THERMOPLASTIC POLYMER COMPOSITION 审中-公开
    热塑性聚合物组合物

    公开(公告)号:WO1993018088A1

    公开(公告)日:1993-09-16

    申请号:PCT/NL1993000058

    申请日:1993-03-12

    Inventor: DSM N.V.

    CPC classification number: C08L35/06 C08L67/02 C08L2666/14 C08L35/00

    Abstract: A thermoplastic polymer composition comprising a thermoplastic polyester and a polymer containing vinylaromatic monomer units and dicarboxylic acid anhydride monomer units and/or imide compounds derived therefrom, having a molecular weight of 30,000 - 200,000 g/mol, which contains at least 1 % by weight of spirodilactone monomer units. The polymer composition has improved impact strength.

    Abstract translation: 一种热塑性聚合物组合物,其包含热塑性聚酯和含有乙烯基芳族单体单元的聚合物和衍生自其的二羧酸酐单体单元和/或其衍生的酰亚胺化合物,其分子量为30,000-200,000g / mol,其含有至少1重量% 螺内酯单体单元。 聚合物组合物具有改善的冲击强度。

    IONIC DISPERSING AGENT WHICH CAN BE USED IN AQUEOUS DISPERSIONS
    46.
    发明申请
    IONIC DISPERSING AGENT WHICH CAN BE USED IN AQUEOUS DISPERSIONS 审中-公开
    离子分散剂可以在水性分散体中使用

    公开(公告)号:WO1993014864A1

    公开(公告)日:1993-08-05

    申请号:PCT/NL1993000028

    申请日:1993-01-28

    Inventor: DSM N.V.

    Abstract: The invention relates to an ionic dispersing agent which can be used in aqueous dispersions. The dispersing agent is an oblong molecular structure chosen from the group consisting of fatty acid derivatives, polymers or oligomers. The dispersing agent is based on a polymer or an oligomer having a molecular weight (Mn) of between 100 and 5000. The dispersions which are obtained using the dispersing agent are used in coating compositions.

    Abstract translation: 本发明涉及一种可用于水性分散体的离子分散剂。 分散剂是选自脂肪酸衍生物,聚合物或低聚物的长方形分子结构。 分散剂基于分子量(Mn)为100-5000的聚合物或低聚物。使用分散剂获得的分散体用于涂料组合物中。

    COPOLYMER OF LACTONE AND CARBONATE AND PROCESS FOR THE PREPARATION OF SUCH A COPOLYMER
    47.
    发明申请
    COPOLYMER OF LACTONE AND CARBONATE AND PROCESS FOR THE PREPARATION OF SUCH A COPOLYMER 审中-公开
    柠檬酸和碳酸酯的共聚物和这种共聚物的制备方法

    公开(公告)号:WO1993013154A1

    公开(公告)日:1993-07-08

    申请号:PCT/NL1992000234

    申请日:1992-12-21

    Inventor: DSM N.V.

    Abstract: The invention relates to a copolymer of at least one lactone and at least one cyclic carbonate, the carbonate being polycyclic. This makes it possible to obtain cross-linked copolymers. The mechanical properties of objects obtained with these are considerably better than the mechanical properties of objects on the basis of non-cross-linked copolymers. The material is tough - in particular the tensile strength is higher -, impact resistant, less crystalline than non-cross-linked copolymer and it is biodegradable.

    Abstract translation: 本发明涉及至少一种内酯和至少一种环状碳酸酯的共聚物,碳酸酯是多环的。 这使得可以获得交联共聚物。 用这些物质获得的物体的机械性能比基于非交联共聚物的物体的机械性能好得多。 该材料是坚韧的 - 特别是拉伸强度更高 - 耐冲击,比非交联共聚物结晶少,并且是可生物降解的。

    THERMOSETTING PLASTIC AND CELLULOSE FIBRES COMPOSITION
    48.
    发明申请
    THERMOSETTING PLASTIC AND CELLULOSE FIBRES COMPOSITION 审中-公开
    热塑性和纤维素纤维组合物

    公开(公告)号:WO1993010172A1

    公开(公告)日:1993-05-27

    申请号:PCT/NL1992000206

    申请日:1992-11-17

    Inventor: DSM N.V.

    CPC classification number: C08J5/045 C08L1/02 C08L61/28 C08L2666/26

    Abstract: Composition based on a thermosetting resin and cellulose fibres, whereby the cellulose fibres consist of microfibrils with a length/diameter ratio (aspect ratio) of at least 50, a length of at least 0.5 mu m and a crystallinity of at least 60 %, which fibres comprise large crystalline zones. Compounds according to the invention can be used to produce objects for applications in for example the automotive, aerospace, telematics and acoustics industries, in interiors, sanitary equipment etc.

    Abstract translation: 基于热固性树脂和纤维素纤维的组合物,由此纤维素纤维由长度/直径比(纵横比)至少为50,长度至少为0.5μm,结晶度为至少60%的微原纤维组成,其中 纤维包含大的结晶区域。 根据本发明的化合物可用于生产用于例如汽车,航空航天,远程信息处理和声学工业,内部,卫生设备等中的应用。

    PACKAGE FOR INCORPORATING AN INTEGRATED CIRCUIT AND A PROCESS FOR THE PRODUCTION OF THE PACKAGE
    49.
    发明申请
    PACKAGE FOR INCORPORATING AN INTEGRATED CIRCUIT AND A PROCESS FOR THE PRODUCTION OF THE PACKAGE 审中-公开
    整合集成电路的包装和生产包装的流程

    公开(公告)号:WO1992002040A1

    公开(公告)日:1992-02-06

    申请号:PCT/NL1991000132

    申请日:1991-07-22

    Inventor: DSM N.V.

    Abstract: The invention relates to a package for incorporating an integrated circuit comprising a plate (1) substantially consisting of a plastic and of electrically conductive material, which plate is at least partly provided with an upright side with at least one contact point, characterized in that the upright side contains a plastic, while the electrically conductive material is applied in the form of layers (3, 4) on the plate and on the upright sides. Such a package no longer has a separate lead frame, so that the pin count is no longer limited by the lead frame. Further, owing to the design of the package, thermal fatigue is no longer critical. The packages are suited for incorporating integrated circuits and other discrete parts and/or electronic components. The packages are highly suited for stacked applications such as memory modules. The invention also relates to the process for producing such packages. The packages can be produced using an injection moulding technique, or using a mechanical and/or thermal/mechanical moulding technique in combination with a technique for applying the electrically conductive material.

    Abstract translation: 本发明涉及一种用于结合集成电路的封装,该集成电路包括基本由塑料和导电材料组成的板(1),该板至少部分地具有至少一个接触点的直立侧,其特征在于, 直立侧包含塑料,而导电材料以板(3,4)的形式施加在板上和直立侧上。 这种包装不再具有单独的引线框架,使得引脚数不再受引线框限制。 此外,由于封装的设计,热疲劳不再重要。 这些封装适用于集成电路和其他分立部件和/或电子部件。 这些软件包非常适合堆叠应用,如内存模块。 本发明还涉及生产这种包装的方法。 可以使用注射成型技术或使用机械和/或热/机械模制技术与用于施加导电材料的技术组合来制造包装。

    PROCESS FOR THE PREPARATION OF 2-N-ACYLAMINOPYRIDINES AND 2-AMINOPYRIDINES FROM 5-OXOALKANENITRILE OXIMES
    50.
    发明申请
    PROCESS FOR THE PREPARATION OF 2-N-ACYLAMINOPYRIDINES AND 2-AMINOPYRIDINES FROM 5-OXOALKANENITRILE OXIMES 审中-公开
    2-N-酰氨基吡啶和2-氨基吡啶的制备方法来自5-氧杂环己烷氧化物

    公开(公告)号:WO1991017979A1

    公开(公告)日:1991-11-28

    申请号:PCT/NL1991000081

    申请日:1991-05-16

    Inventor: DSM N.V.

    CPC classification number: C07D213/75 C07C255/64 C07D213/74 C07D215/38

    Abstract: The invention relates to a process for the preparation of 2-N-acylaminopyridines of formula (1), where R1 and R5 = an alkyl group, a cycloalkyl group, an aryl group or a heteroaryl group, R2, R3 and R4 = hydrogen, an alkoxy group, an aryl group, a heteroaryl group, an alkyl group or a cycloalkyl group and R1 and R2 can together form a cycloalkyl group, which are prepared by treating a 5-oxoalkanenitrile oxime of formula (2), where R1 through R4 have the meanings given above, in the presence of a strong acid, with an acylating agent that contains at least on R5 group with the meaning given above. The invention moreover relates to a process for the preparation of 2-aminopyridines of formula (3), where R1 through R4 have the meanings given above, from said 2-N-acylaminopyridines. The invention moreover relates to the 5-oxoalkanenitrile oximes of formula (2), including those where R1 = H and R2 is an acyl group, the 2-N-acylaminopyridines of formula (1), and the 2-aminopyridines of formula (3).

    Abstract translation: 本发明涉及制备式(1)的2-N-酰基氨基吡啶的方法,其中R 1和R 5 =烷基,环烷基,芳基或杂芳基,R 2,R 3和R 4 =氢, 烷氧基,芳基,杂芳基,烷基或环烷基,R 1和R 2可以一起形成环烷基,它们通过处理式(2)的5-氧代链烷腈肟制备,其中R1至R4 具有上面给出的含义,在强酸存在下,使用至少含有上述含义的R5基团的酰化剂。 本发明还涉及从所述2-N-酰基氨基吡啶制备式(3)的2-氨基吡啶的方法,其中R1至R4具有上述含义。 本发明还涉及式(2)的5-氧代链烷腈肟,包括其中R1 = H和R2是酰基的那些,式(1)的2-N-酰基氨基吡啶和式(3)的2-氨基吡啶 )。

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