Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method, a chemically amplified resist composition and a resist film which satisfy high sensitivity, high resolution, excellent roughness performance and excellent dry etching resistance, and further have excellent developing time dependency.SOLUTION: The negative pattern forming method includes: (1) a step of forming a film from a chemically amplified resist composition containing (A) a fullerene derivative having an acid decomposable group, (B) a compound which generates an acid by irradiation of active rays or radiation and (C) a solvent; (2) a step of exposing the film; and (3) a step of developing the film using a developer containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method excellent in sensitivity, limit resolution, roughness properties, exposure latitude (EL), post exposure bake (PEB) temperature dependency and depth of focus (DOF), and a resist composition.SOLUTION: A pattern forming method of the invention comprises: (A) forming a film using a resin-containing resist composition, which includes a repeating unit with a group that is decomposed by an action of an acid to produce an alcoholic hydroxy group and in which its solubility in a developer containing an organic solvent decreases by an action of an acid; (B) exposing the film; and (C) developing the exposed film using a developer containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method with the excellent exposure latitude (EL) and focus margin (DOF) capable of reducing the line width irregularity (LWR) and residual defect, a chemically amplified resist composition and a resist film.SOLUTION: The pattern forming method includes: (α) a step of forming a film with a substantially alkaline-insoluble resin (A) with a polarity increased by action of an acid for reducing the solubility to a developing solution including an organic solvent, a nonionic compound (B) for generating an acid by radiation of an active ray or a radioactive, and a chemically amplified resist composition (C) including a solvent; (β) a step of exposing the film; and (γ) a step of developing the film with a developing solution including an organic solvent. Also, a chemically amplified resist composition used for the pattern forming method, and a resist film formed with the chemically amplified resist composition are provided.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition having good pitch dependence and coverage dependence of CD and a resist pattern forming method using the same. SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin increasing the solubility in an alkali developer by the action of an acid, the resin containing a repeating unit (a) having a cyano group and a group decomposing by the action of an acid to be made alkali-soluble; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a resin having at least either a fluorine atom or a silicon atom and a group decomposing by the action of an alkali developer to increase the solubility in an alkali developer. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition allowing formation of a resist pattern, which is improved in elution of an acid, line edge roughness, reduction of development defects and scum generation, shows good followability for an immersion liquid in liquid immersion exposure, and further has various favorable performances in terms of particle suppression, a pattern profile and bubble defect prevention, and to provide a method of forming a pattern by using the actinic ray-sensitive or radiation-sensitive resin composition. SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition contains: resin (A) capable of increasing the solubility with an alkali developing solution by an action of an acid; and resin (C) having at least either a fluorine atom or a silicon atom and containing repeating unit (c) having at least two polarity conversion groups. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray- or radiation-sensitive resin composition useful to form a fine pattern in semiconductor manufacturing and remarkably reducing pattern collapse, development defects, liquid immersion defects (residual water defects, bubble defects) and scum, and a pattern forming method using the same. SOLUTION: The actinic ray- or radiation-sensitive resin composition is characterized in that a receding contact angle of water at a surface of a film formed of the actinic ray- or radiation-sensitive resin composition is ≥65°, and a receding contact angle of water at a surface of the film processed with an alkali developer is ≤35°. The pattern forming method using the same is also provided. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition, capable of forming a resist pattern improved in the elution of a generated acid, line edge roughness, development defects and generation of scums, less liable to profile degradation, and having proper conformability with an immersion liquid in immersion exposure, and to provide a pattern forming method that uses the composition.SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin, capable of increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin which contains (c) a repeating unit, having at least one polarity conversion group and has at least either a fluorine atom or a silicon atom. The pattern forming method that uses the composition is also provided.
Abstract:
PROBLEM TO BE SOLVED: To provide an active ray sensitive or radiation sensitive resin composition which allows formation of a pattern having good properties of PEBS (post exposure bake sensitivity), MEEF (mask error enhancement factor), coverage dependence and bridge defects, and to provide a method for forming a pattern by using the composition. SOLUTION: The composition includes (A) a resin the solubility of which with an alkali developing solution is increased by an action of an acid, (B) a compound generating an acid by irradiation with active rays or radiation, and (C) a resin, which contains a repeating unit having a polarity converting group that is decomposed by an action of an alkali developing solution to increase the solubility with an alkali developing solution, and which contains at least either a fluorine atom or a silicon atom, wherein the composition contains as the compound (B), a compound that generates an acid expressed by general formula (I) by irradiation with active rays or radiation. In general formula (I), each Xf independently represents a fluorine atom or an alkyl group substituted with at least one fluorine atom; R 1 and R 2 each independently represent a hydrogen atom, a fluorine atom, an alkyl group or a group selected from alkyl groups substituted with at least one fluorine atom, and when a plurality of R 1 or R 2 are present, the respective groups may be identical or different from one another; L represents a divalent linking group and when a plurality of L are present, they may be identical or different from one another; A represents a group having a cyclic structure; x represents an integer of 1 to 20; y represents an integer of 0 to 10; and z represents an integer of 0 to 10. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film forming composition (coating liquid) can form an insulated film with a low dielectric constant, the excellent mechanical strength and a good surface property, and an electronic device using the composition. SOLUTION: The film forming composition includes a polymer of a substituted styrene derivative represented by formula (1), (wherein R 1 is a hydrogen atom, an alkyl group or an aryl group, R 2 is a hydrogen atom, an alkyl group or an aryl group, R 3 is an alkyl group, an aryl group, an alkoxy group, an acyloxy group, an aryloxy group, a hydroxy group, a carboxyl group, an alkoxy carbonyl group, an aryloxycarbonyl group, a trialkylsilyl group or a triarylsilyl group, in the case R 3 is present by plurality, they may be either same or different, and they may be coupled with each other to form a ring structure, and n is an integer or 0-4). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a film capable of forming a film that exhibits high heat resistance, high mechanical strengths, a low dielectric constant and good preservation stability with time, a film obtained using the composition for forming a film, and an electronic device comprising the film. SOLUTION: The composition for forming a film comprises a compound represented by formula (1) and/or a polymer obtained by polymerizing at least the compound represented by formula (1). The film is formed using the composition for forming a film. The electronic device comprises the film. In formula (1), A 1 is a bivalent to tetravalent organic group; A 2 is an alkenyl group or an alkynyl group; Ar is a (2+a1)-valent aryl group; R is a hydrogen atom or a 1-30C alkyl group; a1 is an integer of 1-4; and a2 is an integer of 2-4. COPYRIGHT: (C)2009,JPO&INPIT