公开(公告)号：JP2007270216A

公开(公告)日：2007-10-18

申请号：JP2006095804

申请日：2006-03-30

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI ,  NAKAMURA TAKEMARE

IPC: C23C18/30 ,  C23C18/31 ,  C23C28/00 ,  H05K3/00 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming metallic film capable of forming a metallic film excellent in adhesiveness with a flat and smooth substrate by a simple process without requiring a large amount of energy, to provide a metallic film obtained by using the method of forming metallic film, and to provide a substrate used for forming the metallic film. SOLUTION: The method of forming metallic film comprises: a polymer layer forming process (a) of forming a polymer having functional groups which are directly chemically-bonded to the substrate and interact with plating catalyst or the precursor of the catalyst, and a crosslinking group precursor; a catalyst giving process (b) of giving the plating catalyst or the precursor of the catalyst onto the polymer layer; a plating process (c) of performing plating to the plating catalyst or the precursor of the plating catalyst; and a crosslinking process (d) of crosslinking the polymer layer. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种形成金属膜的方法，该方法能够通过简单的工艺形成与平坦且光滑的基底的粘合性优异的金属膜，而不需要大量的能量，从而提供由 使用形成金属膜的方法，并提供用于形成金属膜的基板。 形成金属膜的方法包括：形成具有官能团的聚合物的聚合物层形成方法（a），其具有直接化学键合到基底上并与电镀催化剂或催化剂前体相互作用，以及 交联基团前体; 将催化剂或催化剂前体赋予聚合物层的催化剂制备方法（b）; 对电镀催化剂或电镀催化剂的前体进行电镀的电镀工序（c） 和交联聚合物层的交联方法（d）。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007262542A

公开(公告)日：2007-10-11

申请号：JP2006092494

申请日：2006-03-29

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI

IPC: C23C28/00 ,  C08J7/04 ,  C23C18/30 ,  H05K3/18 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a metal film and a method for forming a metal pattern by which a metal film or a metal pattern having excellent adhesiveness with a smooth substrate can be formed in an easy process without requiring much energy, to provide a metal film laminate and a metal pattern material excellent in adhesiveness with a smooth substrate obtained by the above methods, and to provide a substrate for forming a metal film and a substrate for forming a metal pattern preferably used for forming the metal film laminate and the metal pattern material, and a coating liquid composition for forming a polymer precursor layer. SOLUTION: The method for forming a metal film includes: a polymer layer forming step of forming a polymer layer by directly chemically bonding a polymer to a substrate, the polymer having a polymerizable group and a functional group which interacts with a plating catalyst or its precursor and causing no hydrolysis at a pH of 12 or higher; a catalyst imparting step of imparting a plating catalyst or its precursor onto the polymer layer; and a plating step of plating the polymer layer with the plating catalyst or its precursor imparted thereon. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种形成金属膜的方法和形成金属图案的方法，通过该方法可以容易地形成具有与光滑基底的粘合性优异的金属膜或金属图案，而不需要 能够提供与通过上述方法获得的光滑基板的粘合性优异的金属膜层压体和金属图案材料，并且提供用于形成金属膜的基板和用于形成优选用于形成金属膜的金属图案的基板 金属膜层压体和金属图案材料，以及用于形成聚合物前体层的涂布液组合物。 解决方案：用于形成金属膜的方法包括：聚合物层形成步骤，通过将聚合物直接化学键合到基底上形成聚合物层，所述聚合物具有可聚合基团和与电镀催化剂相互作用的官能团 或其前体，并且在pH为12或更高时不引起水解; 将催化剂或其前体赋予聚合物层的催化剂赋予步骤; 以及电镀步骤，用赋予其的镀催化剂或其前体镀覆聚合物层。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2014192014A

公开(公告)日：2014-10-06

申请号：JP2013066926

申请日：2013-03-27

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KARIYA TOSHIHIRO ,  HAYATA YUICHI ,  KANO TAKEYOSHI

IPC: H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D139/06 ,  C09D171/02 ,  C09D179/02 ,  H01B1/00 ,  H01B5/14

Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming an electroconductive film capable of forming an electroconductive film excellent in terms of frictional scratch resistance and electroconductivity.SOLUTION: The provided electroconductive film includes: (A) copper particles having diameters of 0.1 μm or above and 1.2 μm or below; (B) metal nanoparticles having diameters of less than 0.1 μm; (C) a trivalent or higher polyalcohol compound; (D) an amino group-containing basic polymer; and (E) a thixotropic agent in a state where the content of the metal nanoparticles (B) is 30 mass% or less and where the content of the basic polymer (D) with respect to 100 pts.mass of the copper particles (A) is 2-20 pts.mass.

Abstract translation: 要解决的问题：提供一种能够形成导电膜的组合物，该导电膜能够形成摩擦耐擦伤性和导电性优异的导电膜。解决方案：所提供的导电膜包括：（A）直径为0.1μm以上的铜颗粒 和1.2μm以下; （B）直径小于0.1μm的金属纳米粒子; （C）三价以上多元醇化合物; （D）含氨基的碱性聚合物; 和（E）金属纳米粒子（B）的含量为30质量％以下的状态下的触变剂，其中，碱性聚合物（D）的含量相对于铜颗粒（A）的100质量份 ）是2-20磅。

公开(公告)号：JP2014071963A

公开(公告)日：2014-04-21

申请号：JP2012215257

申请日：2012-09-27

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： TSUYAMA HIROAKI ,  KANO TAKEYOSHI

IPC: H01B1/22 ,  H01B13/00 ,  H05K1/09

CPC classification number: H05K1/095 ,  C09D11/52 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To provide a conductive film forming composition capable of forming a conductive film which exhibits excellent conductivity and is excellent in adhesion to a base material.SOLUTION: The conductive film forming composition contains a copper-containing polymer, metal copper particles and/or copper oxide particles, and a solvent. The copper-containing polymer contains copper ions and/or a copper salt, and a polymer having a functional group interacting with the copper ions or the copper salt. The copper ions or the copper salt is linked to the polymer via the functional group. The functional group contains at least one selected from the group consisting of an amino group, an amide group, a pyridyl group, a hydroxyl group, and a carboxyl group.

Abstract translation: 要解决的问题：提供一种导电膜形成组合物，其能够形成导电性优异且导电性优异且对基材的密合性优异。导电膜形成组合物含有含铜聚合物，金属铜颗粒和 /或氧化铜颗粒和溶剂。 含铜聚合物含有铜离子和/或铜盐，以及具有与铜离子或铜盐相互作用的官能团的聚合物。 铜离子或铜盐通过官能团与聚合物连接。 官能团含有选自氨基，酰胺基，吡啶基，羟基和羧基中的至少一种。

公开(公告)号：JP2013203067A

公开(公告)日：2013-10-07

申请号：JP2012078220

申请日：2012-03-29

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI

IPC: B41M5/00 ,  B41J2/01

Abstract: PROBLEM TO BE SOLVED: To provide an image forming method which can form an image excellent in friction resistance and blocking resistance and to provide a printed matter which contains the image formed to be excellent in friction resistance and blocking resistance by the image forming method.SOLUTION: An image forming method includes an application process of applying a curable composition on a base material by an inkjet method and a curing process of curing the curable composition applied on the base material by using atmospheric pressure plasma treatment and UV exposure treatment.

Abstract translation: 要解决的问题：提供一种可以形成耐摩擦性和抗粘连性优异的图像的图像形成方法，并且通过图像形成方法提供包含形成为具有优异的摩擦阻力和抗粘连性的图像的印刷品。 ：图像形成方法包括通过喷墨法将固化性组合物涂布在基材上的施加方法以及通过使用大气压等离子体处理和UV曝光处理固化涂布在基材上的固化性组合物的固化方法。

公开(公告)号：JP2013203066A

公开(公告)日：2013-10-07

申请号：JP2012078219

申请日：2012-03-29

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI

IPC: B41M5/00 ,  B41J2/01

Abstract: PROBLEM TO BE SOLVED: To provide an image forming method which can form an image of high image quality without cissing and bleeding when a curable composition hits a recording medium surface and which is excellent in processing suitability for an obtained printed matter and to provide a printed matter excellent in processing suitability.SOLUTION: An image forming method includes (A) a base material surface treatment process of surface-treating a nonpolar base material under a nitrogen ambience by an atmospheric pressure plasma, (B) a curable composition layer formation process of forming a curable composition layer by ejecting the curable composition which includes a polymerizable monomer, a polymerization initiator, and a pigment to the surface-treated nonpolar base material surface by an inkjet method, and (C) an image formation process of forming the image through curing by impressing energy to the formed curable composition layer.

Abstract translation: 要解决的问题：提供一种图像形成方法，其可以在可固化组合物撞击记录介质表面时形成高图像质量的图像而不会产生裂缝和渗色，并且对于所获得的印刷品，加工适应性优异并且提供印刷 处理适用性优异。解决方案：一种成像方法包括（A）在大气压等离子体下在氮气环境下对非极性基材进行表面处理的基材表面处理工艺，（B）可固化组合物层形成工艺 通过喷墨方法将包含可聚合单体，聚合引发剂和颜料的可固化组合物喷射到经表面处理的非极性基材表面上形成可固化组合物层，以及（C）通过形成图像的图像形成过程 通过向形成的可固化组合物层施加能量来固化。

公开(公告)号：JP2012174758A

公开(公告)日：2012-09-10

申请号：JP2011032915

申请日：2011-02-18

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： UEKI YUKITAKA ,  HAMA IFUMI ,  KANO TAKEYOSHI

IPC: H05K3/42

CPC classification number: H05K3/4685 ,  H05K3/108 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4652 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate having excellent adhesion of metal layers to be formed and excellent pattern high definition, and having high connection reliability between the metal layers via a hole, and providing satisfactory yield.SOLUTION: A method of manufacturing a multilayer substrate includes: a substrate preprocessing step of performing two steps of hole formation step and metal attachment step in no particular order, in which the hole formation step includes drilling of a core base material having at least an insulating layer and a first metal layer, and forming in the insulating layer a hole extending from the other surface of the insulating layer to the first metal layer, and the metal attachment step includes allowing predetermined metal or metal ions to be attached to the other surface of the insulating layer; a desmear step of performing desmear processing by plasma etching after the substrate preprocessing step; a cleaning step of cleaning the core base material with an acid solution after the desmear step; and a plating step of performing plating treatment by applying a plating catalyst or its precursor to the insulating layer, and forming on the insulating layer a second metal layer that conducts with the first metal layer via the hole.

Abstract translation: 解决问题的方案：提供一种制造具有优异的金属层粘附性的多层基板的方法，并且具有优异的图案高清晰度，并且通过孔在金属层之间具有高连接可靠性，并且提供令人满意的产率。 解决方案：一种制造多层基板的方法包括：基板预处理步骤，其以不同的顺序执行孔形成步骤和金属附着步骤的两个步骤，其中所述孔形成步骤包括钻出具有 至少绝缘层和第一金属层，并且在所述绝缘层中形成从所述绝缘层的另一表面延伸到所述第一金属层的孔，并且所述金属附着步骤包括使预定的金属或金属离子附着到所述绝缘层上 绝缘层的其他表面; 在基板预处理步骤之后通过等离子体蚀刻进行去污处理的去污步骤; 清洁步骤，在去污步骤之后用酸溶液清洗芯基材; 以及电镀步骤，通过将镀催化剂或其前体施加到所述绝缘层进行电镀处理，以及在所述绝缘层上形成经由所述孔与所述第一金属层导通的第二金属层。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011213782A

公开(公告)日：2011-10-27

申请号：JP2010081193

申请日：2010-03-31

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI ,  SATO MASATAKA

IPC: C08F6/06 ,  G03F7/038

Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a polymer solution which is applicable in an industrial scale, ensures high removability of a hydrophilic organic solvent and hydrophilic compounds such as a hydrophilic reaction byproduct generated in polymer synthesis, also ensures a high polymer recovery rate, and can be used also as a coating liquid, and a method for purifying a polymer.SOLUTION: The method for producing a polymer solution, which contains a polymer containing a unit represented by general formula (A) and a unit represented by general formula (B) and an alcohol having a ratio of the number of carbon atoms to the number of OH groups of 4-7, includes: an addition step of adding the alcohol to a polymer solution A containing the polymer and an organic solvent which dissolves the polymer and is compatible with the alcohol to obtain a polymer solution B, and an extraction step of subjecting the polymer solution B to an extraction treatment with water.

Abstract translation: 要解决的问题：为了提供可应用于工业规模的聚合物溶液的制造方法，确保亲水性有机溶剂的高度去除性和亲水性化合物如聚合物合成中产生的亲水性反应副产物，还确保高聚合物回收率 速率，也可以用作涂布液，以及聚合物的纯化方法。溶液：聚合物溶液的制造方法，其含有含有通式（A）表示的单元的聚合物和由通式（A）表示的单元 式（B）和碳原子数与OH基数之比为4-7的醇包括：将醇加入含聚合物和溶解有机溶剂的聚合物溶液A中的添加步骤 该聚合物与醇相容以获得聚合物溶液B，以及将聚合物溶液B用水进行萃取处理的萃取步骤。

公开(公告)号：JP2011094192A

公开(公告)日：2011-05-12

申请号：JP2009249382

申请日：2009-10-29

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KONO TAKATSUGU ,  KANO TAKEYOSHI

IPC: C23C18/18 ,  C25D5/56 ,  H05K3/18

CPC classification number: G03F7/0388 ,  C08F8/26 ,  C08F220/06 ,  C08F220/34 ,  C08F2800/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/204 ,  C23C18/2086 ,  Y10T428/24802 ,  C08F2220/283

Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a layer to be plated, which is cured by applying energy at high sensitivity, and can form a pattern of the layer to be plated, which has superior adsorptivity to a catalyst for plating or its precursor and has high resolution, by developing the layer with an aqueous solution; a method for producing a metal pattern material which can easily form a metal pattern having high resolution and superior adhesiveness with a substrate; and the metal pattern material obtained thereby. SOLUTION: The composition for forming the layer to be plated is prepared by dissolving a functional group which interacts with the catalyst for plating or the precursor thereof, 1-20 mass% of a polymer having a radical polymerizable group and a water-insoluble photoinitiator, in a mixture solvent which contains 20-99 mass% of a water-soluble flammable liquid and water. The method for producing the metal pattern material includes using the composition for forming the layer to be plated. The metal pattern material is obtained by the production method. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于形成被镀层的组合物，其通过以高灵敏度施加能量而固化，并且可以形成对催化剂具有优异吸附性的该镀层的图案， 电镀或其前体，并通过用水溶液显影层具有高分辨率; 一种金属图案材料的制造方法，其可以容易地形成具有高分辨率和与基材的优异粘附性的金属图案; 和由此获得的金属图案材料。 ＆lt; P＆gt;解决方案：用于形成待镀层的组合物是通过溶解与镀覆催化剂或其前体相互作用的官能团，1-20质量％的具有自由基聚合性基团和水溶性聚合物的聚合物， 不溶性光引发剂，在含有20-99质量％水溶性易燃液体和水的混合溶剂中。 制造金属图案材料的方法包括使用用于形成被镀层的组合物。 通过制造方法得到金属图案材料。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010239080A

公开(公告)日：2010-10-21

申请号：JP2009088161

申请日：2009-03-31

Applicant: Fujifilm Corp ,  富士フイルム株式会社

Inventor： KANO TAKEYOSHI ,  KONO TAKATSUGU

IPC: H05K3/38 ,  B32B15/08 ,  C08F290/12 ,  C08F299/00 ,  C23C18/20 ,  H01B5/14 ,  H01B13/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a conductive film excellent in flexibility and thermal shock resistance of a resin layer contributing to adhesiveness between the conductive film and a substrate, to provide a method of manufacturing a printed wiring board including the conductive film forming method in a step, and to provide a material of the conductive film.
SOLUTION: The method of forming conductive film including (a) the step of forming the resin layer containing a compound having a radical polymerizable group and a thermoplastic resin on an organic resin base material, (b) the step of forming a resin layer adsorbing an electroless plating catalyst or a precursor thereof containing a resin having a functional group interacting with the electroless plating catalyst or the precursor thereof and a compound having a radial polymerizable group, (c) the step of applying the electroless plating catalyst or the precursor thereof to the layer adsorbing the electroless plating catalyst or the precursor thereof, and (d) the step of forming an electroless plated film by performing electroless plating.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种形成导电膜和基板之间的粘附性的树脂层的柔性和耐热冲击性优异的导电膜的方法，提供一种制造印刷线路板的方法，包括 导电膜形成方法，并提供导电膜的材料。 ＆lt;解决方案＆gt;形成导电膜的方法包括（a）在有机树脂基材上形成含有具有自由基聚合性基团和热塑性树脂的化合物的树脂层的步骤，（b）形成树脂的步骤 吸附化学镀催化剂或其含有具有与化学镀催化剂或其前体相互作用的官能团的树脂的前体，以及具有径向聚合性基团的化合物，（c）将化学镀催化剂或前体 以及（d）通过进行无电解电镀形成无电解电镀膜的工序。 版权所有（C）2011，JPO＆INPIT