Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method and a resist composition from which a pattern having fewer development defects can be formed.SOLUTION: The resist composition is used for a specified pattern forming method and comprises the following resin, a hydrophobic resin having a fluorine atom or a silicon atom, and a solvent comprising a specified component. The resin contains a repeating unit (P) having a group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group, contains neither a fluorine atom nor a silicon atom, and shows decrease in the solubility with a developing solution containing an organic solvent by an action of an acid; and in the resin, the repeating unit (P) contains no lactone structure, and the group that is decomposed by an action of an acid to generate an alcoholic hydroxyl group is a group expressed by at least one of specified general formulae. The compounding rate of the resin showing decrease in the solubility with a developing solution containing an organic solvent by an action of an acid is 60 to 95 mass% in the total solid content.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method which suppresses generation of standing waves, which allows formation of a pattern with high rectangularity while minimizing scum in patterning on a stepped substrate, which can achieve excellent exposure latitude and which is particularly suitable for KrF exposure, and to provide an active ray-sensitive or radiation-sensitive resin composition used for the method, a resist film, a method for manufacturing an electronic device, and an electronic device.SOLUTION: The pattern forming method includes steps of: (1) forming a film by using an active ray-sensitive or radiation-sensitive resin composition comprising a resin (A) having a repeating unit having a group that is decomposed by an action of an acid to generate a polar group and a repeating unit having a carboxyl group, a compound (B) that generates an acid by irradiation with active rays or radiation, and a solvent (C); (2) exposing the film to KrF excimer laser light, extreme ultraviolet rays or an electron beam; and (3) forming a negative pattern by developing the exposed film by using a developing solution containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition satisfying all demands for reducing pattern collapse, improving exposure latitude and pattern roughness characteristics such as LWR (line width roughness), and achieving excellent stability with time, and to provide a resist film and a pattern forming method using the composition, and a method for manufacturing an electronic device and an electronic device.SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition includes a compound expressed by general formula (1). In the formula, Rrepresents a polycyclic aromatic group or a polycyclic heterocyclic aromatic group; Q represents a connecting group including a heteroatom; n and m each independently represent an integer of 0 to 12, and when n is 2 or more, Rmay be the same or different from each other or a plurality of Rmay be connected to each other to form a non-aromatic ring together with R, and when m is 2 or more, Rmay be the same or different from each other or the plurality of Rmay be connected to each other to form a non-aromatic ring together with R; and Xrepresents a non-nucleophilic anion.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method which suppresses generation of a remarkable standing wave, can form a pattern having high rectangularity and a fine trench pattern, has excellent exposure latitude and LWR, can reduce a development defect, and is particularly suitable for KrF exposure, in a negative pattern forming method by organic solvent development, and to provide an actinic ray-sensitive resin composition and the like used for the same, a resist film, a method for manufacturing an electronic device, and an electronic device.SOLUTION: The pattern forming method includes: (1) a film-forming step by an actinic ray-sensitive resin composition and the like containing a resin (A) having a repeating unit having a group which is decomposed by an acid and forms a polar group and a repeating unit having an aromatic group, an acid generating compound (B) by active rays and the like and a solvent (C); (2) an exposure step; and (3) a negative pattern forming step by an organic solvent-containing developer. The resin (A) is at least one of a resin having a naphthyl group and the like as an aromatic group, and a resin containing a compound (D) having a naphthalene ring and the like.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method that prevents reduction in resolution and rectangularity caused by unintentional dissolution of a pattern part during organic solvent development and is excellent in dry etching durability and particularly suitable for KrF exposure, and to provide an actinic ray sensitive or radiation sensitive resin composition used therefor.SOLUTION: A pattern forming method includes the steps of: (1) forming a film by using an actinic ray sensitive or radiation sensitive resin composition containing a resin (A) having a repeating unit that is decomposed by an action of an acid to produce a polar group, a compound (B) that generates an acid by irradiation with actinic rays or radiation, and a solvent (C); (2) exposing the film; and (3) developing the exposed film by using a developing solution containing an organic solvent to form a negative pattern. The resin (A) contains a repeating unit represented by general formula (I) of less than 20 mol% based on the whole repeating units in the resin (A), and contains a repeating unit having a non-phenolic aromatic group other than the unit of general formula (I).
Abstract:
PROBLEM TO BE SOLVED: To provide a negative pattern forming method for improving removability of a film, reducing scum on a substrate generating after development, reducing scum defects and achieving excellent resolution, in a pattern forming method which includes forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, and exposing and developing the film, so as to stably form a fine pattern with high accuracy for manufacturing a high-integration and high-accuracy electronic device.SOLUTION: The negative pattern forming method includes steps of: (1) forming a film having a film thickness of 200 nm or more from a chemically amplified resist composition, which contains (A) a resin showing increase in its polarity by an action of an acid to decrease solubility with a developing solution containing an organic solvent, (B) a compound generating an acid by irradiation with actinic rays or radiation, and (C) a solvent; (2) exposing the film; and (3) developing the exposed film with a developing solution containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method capable of attaining both CDU (Critical Dimension Uniformity) performance and defect performance at high levels.SOLUTION: In the pattern forming method which includes (a) forming a film using a chemically amplified resist composition, (b) exposing the film, and (c) developing the exposed film using a developer containing an organic solvent, the developer contains an ester and ketone having a carbon number of 7 or more.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern having excellent exposure latitude (EL) and a large depth of focus (DOF), and a resist composition.SOLUTION: A pattern forming method of the present invention includes (A) forming a film with a resist composition; (B) exposing the film to light; and (C) developing the exposed film with a developer containing an organic solvent. The resist composition contains (a) a resin which is decomposed by the action of an acid and ΔSP represented by the following equation (1) is equal or more than 2.5(MPa); (b) a compound which generates an acid upon irradiation with actinic rays or radiation; and (c) a solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide an active ray-sensitive or radiation-sensitive resin composition which is excellent in stability with time, a development defect performance and a roughness characteristic, and also to provide a pattern forming method using the composition.SOLUTION: This active ray-sensitive or radiation-sensitive resin composition contains: a resin containing a repeated unit including a group generating an alcoholic hydroxy group by being decomposed by action of an acid, whose solubility to a developing solution containing an organic solvent is reduced by action of the acid; a compound generating an acid by irradiation of an active ray or a radiation; and a solvent. The moisture content rate measured by the Karl Fischer's method is ≤1.0 mass%.