Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray- or radiation-sensitive resin composition which simultaneously satisfies sensitivity, resolution, pattern shape, line edge roughness and dry etching resistance, in lithography especially using an electron beam, an X-ray or an EUV ray, and to provide a resist-film and pattern formation method utilizing the same.SOLUTION: The actinic ray- or radiation-sensitive resin composition includes a resin (P) containing: a repeating unit (A) represented by the following general formula (I) or (II) which is decomposed by exposure to an actinic or radioactive ray to generate an acid anion at a side chain of the resin; a repeating unit (B) which is decomposed by the effect of an acid to generate an alkali soluble group; and a repeating unit (F) represented by the following general formula (X).
Abstract:
PROBLEM TO BE SOLVED: To provide a novel compound used for a photosensitive composition forming a good-profile pattern improved in pattern collapse even in formation of a fine pattern of ≤100 nm.SOLUTION: The compound is an arylsulfonium salt represented by formula (I) (wherein Xand Xeach independently denote an aryl group or the like; Ardenotes an aryl group; Ydenotes a single bond or a divalent linking group; Ydenotes a polycyclic hydrocarbon group; mand mdenote an integer of 0 to 2; mdenotes 1 or 2; here, m+m+m=3; mdenotes an integer of 1 to 3; and X- denotes a counter anion).
Abstract translation:待解决的问题:为了提供一种用于感光组合物的新型化合物,即使在形成≤100nm的精细图案时也能形成改善图案塌陷的良好轮廓图案。 解决方案:化合物是由式(I)表示的芳基锍盐(其中X 1 SB>和X 2 SB> 表示芳基等; Ar 1表示芳基; Y 1 SB>表示单键或二价连接基团 ; Y 2 SB>表示多环烃基; m 1 SB>,m 2 SB> 表示0〜2的整数; m 3表示1或2;这里,m 1 SB> + m 2 SB> + m 3 SB> = 3; m 4 SB>表示1〜3的整数; X - 表示抗衡阴离子)。 版权所有(C)2012,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic-ray- or radiation-sensitive resin composition that is satisfactory with respect to high sensitivity, high resolution of a dense pattern and an isolated line, sufficient exposure latitude, proper line width roughness, proper bridge margin and high resolution of isolated space, and to provide a method for forming a pattern using the composition.SOLUTION: The actinic-ray- or radiation-sensitive resin composition includes a resin (A), whose solubility in an alkali developer is increased by the action of an acid; the resin containing a monocyclic acid-dissociable cycloalkyl (meth)acrylate unit having 5 to 8 carbon atoms and a substituted styrene unit; and a compound (B) which, when exposed to actinic rays or radiation, generates sulfonic acid having a structure of an aromatic ring that has a substituent, including a hydrocarbon group having 3 or more carbon atoms.
Abstract:
PROBLEM TO BE SOLVED: To provide a new surface treating agent for a freezing process, with which, in a freezing process, the height of a first resist pattern does not change upon surface treatment and the formation of a second resist pattern, and the line width roughness (LWR) of the first resist pattern does not change even after surface treatment and the formation of the second resist pattern, and to provide a pattern forming method using the same. SOLUTION: The surface treating agent for pattern formation contains a compound having an aziridinyl group. The pattern forming method uses the surface treating agent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method using a positive resist composition suitable for multiple exposures, ensuring that in the multiple exposure process of performing exposure a plurality of times on the same resist film, the pattern is reduced in the film loss. SOLUTION: The pattern forming method performs a multiple exposure process comprising exposing a resist film a plurality of times, wherein a contact angle of the resist film for water is ≥75°. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a pattern with a desirous pattern resolution and line width roughness (LWR) using a positive resist composition suitable for multiple exposure in a multiple exposure process of exposing the same photo-resist film two or more times. SOLUTION: The method of forming a pattern is characterized by steps of exposing the same resist film two or more times and heating the resist film during at least one period between two exposures. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for pattern formation that can form a pattern which renders the dimension of a trench pattern or a hole pattern, effectively fine, without producing any scum. SOLUTION: The method is characterized by comprising (α) the step of coating a resist composition, which contains a resin capable of increasing its polarity due to the action of an acid and, upon exposure to an active light or a radiation, undergoes an increase in solubility to a positive developer and undergoes a decrease in solubility to a negative developer; (β) the step of exposure; (γ) the step of conducting development with a negative developer to form a resist pattern; and (δ) the step of allowing a crosslinked layer forming material to act on the resist pattern to crosslink the resin constituting the resist pattern and the corsslinked layer forming material to form a crosslinked layer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a pattern for stably forming an accurate fine pattern to be used in semiconductor manufacturing process such as IC or the like, manufacturing of a circuit board for a liquid crystal, thermal head or the like, and other photo fabrication processes. SOLUTION: The method of forming a pattern includes steps of: (α) coating a substrate with a specific resist composition for negative development which contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an active ray or radiation; (β) exposing the resist film via an immersion medium; and (γ) performing development with a negative developer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably forming a high-accuracy fine pattern to be used in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, a resist composition to be used in the method, a developing solution to be used in the method and a rinsing solution to be used in the method. SOLUTION: The pattern forming method includes: (α) coating a resist composition including a resin that includes a specific repeating unit, and, by the action of an acid, increases the polarity and decreases the solubility in a negative developing solution; (β) exposing; and (γ) developing with a negative developing solution. There are also provided the resist composition to be used in the method, the developing solution to be used in the method and the rinsing solution to be used in the method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which solves the problems of pattern collapse and film thickness reduction of an isolated pattern even in the formation of a fine pattern of ≤100 nm and forms a pattern of a good profile, and a pattern forming method using the same. SOLUTION: The positive photosensitive composition comprises (A) a resin which is decomposed by the action of an acid to increase solubility in an alkali developer, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a specific non-polymer compound having an alicyclic group and an ester group. The pattern forming method using the same is also provided. COPYRIGHT: (C)2008,JPO&INPIT