Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray sensitive or radiation sensitive resin composition having an ultrafine pore diameter (for instance, 60 nm or smaller), and capable of forming a hole pattern excellent in rectangularity of a cross sectional shape, in an excellent uniformity in local pattern dimensions, and to provide a resist film, a pattern forming method, a method for manufacturing an electronic device, and an electronic device using the same.SOLUTION: There is provided an actinic ray sensitive or radiation sensitive resin composition including: a resin (P) including a repeating unit (a) represented by the following general formula (I); and 1 mass% or more of a resin (C) including a compound (B) that generates an organic acid by irradiation with an actinic ray or radiation, and also including at least one of a fluorine atom and a silicon atom, the resin (C) different from the resin (P) based on the total solid amount of the actinic ray sensitive or radiation sensitive resin composition. In the general formula (I), Rrepresents a hydrogen atom or a methyl group. R, Rand Reach independently represent a linear or branched alkyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition capable of decreasing elution of an acid from an exposed portion of a resist film into an immersion liquid in an immersion exposure process and suppressing watermark defects and development defects, and to provide a resist film and a pattern forming method using the composition.SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition contains: (A) a resin the solubility of which with an alkali developing solution is increased by an action of an acid; (B) a compound generating an acid by irradiation with actinic rays or radiation; (C) a hydrophobic resin having a sulfonamide structure; and (D) a mixture solvent comprising two or more kinds of solvents and having a boiling point of 200°C or more. The resist film and the pattern forming method are obtained by using the composition.
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition capable of reducing a watermark defect and forming an excellently shaped resist pattern, and to provide a resist film using the same and a patterning method.SOLUTION: A resist composition contains: (A) a resin that dissolves by an action of acid whose solubility in an alkaline developer increases; an onium salt that is a compound generating acid by irradiation of activated ray or radioactive ray and that includes the general formula (I), or a bis (alkylsulfonyl) imide anion and a tris (alkylsulfonyl) methide anion; (C) a resin that includes at least one of a fluorine atom and a silicon atom; and a combined solvent that includes a first solvent and a second solvent at least one of which has a standard boiling point of 200°C or higher.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition which reduces coating defects and enables provision of an excellent pattern even in immersion exposure, and a pattern forming method using the same. SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin which is decomposed by the action of an acid and exhibits increased solubility in an alkali developer; (B) a compound which generates an acid upon irradiation with actinic rays or radiation; (C) a resin having at least either a fluorine atom or a silicon atom and a polarity conversion group which is decomposed by the action of an alkali developer and exhibits increased solubility in the alkali developer; and (D) a mixed solvent containing at least one solvent selected from the group represented by general formulae (S1)-(S3), wherein the total content of the solvent is 3-20 mass% in all solvents. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition which is improved in pattern profile in ordinary exposure and liquid immersion lithography and excels in followability of water in liquid immersion lithography and a pattern forming method using the same, with respect to a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern forming method using the same. SOLUTION: The positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under the action of an acid, (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation, (C) a resin having a fluorine atom-containing repeating unit of a specific structure and being stable to an acid and insoluble in an alkali developer, and (D) a solvent. The pattern forming method using the same is also provided. COPYRIGHT: (C)2008,JPO&INPIT