公开(公告)号：EP2577571A1

公开(公告)日：2013-04-10

申请号：EP11721065.8

申请日：2011-05-24

Applicant: Gemalto SA

Inventor： FIDALGO, Jean-Christophe ,  LEIBENGUTH, Joseph

IPC: G06K19/077

CPC classification number: H05K7/02 ,  G06K19/0718 ,  G06K19/07703 ,  G06K19/07745 ,  G06K19/07747 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K13/00 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to a method for creating a multi-component device, including the following steps, creating a module (1) having a multilayer structure comprising electrical/electronic components (C10, C20) arranged on at least one substrate in stacked layers, the components each having a main surface (F1, F2) exposed to the outside, characterized in that the components are arranged such that the respective main surfaces (F1, F2) thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.

Abstract translation: 该方法包括制造多层结构模块（1），其包括以叠加层布置在柔性基板（2）上的电气/电子部件，其中电气/电子部件分别包括暴露于外侧的主面（10,11）。 电气/电子部件布置成使相应的主面相互朝向相反的方向。 对于包括多层结构模块的多功能设备，还包括独立权利要求。

公开(公告)号：EP2335186A1

公开(公告)日：2011-06-22

申请号：EP09781617.7

申请日：2009-08-07

Applicant: Gemalto SA

Inventor： FIDALGO, Jean-Christophe

IPC: G06K7/12 ,  G06K19/077 ,  G06K19/14

CPC classification number: G06K19/077 ,  G06K7/12 ,  G06K19/07716 ,  G06K19/14

Abstract: The present invention relates to an electronic device manufacturing method, said method comprising the following steps: reading (A) information marking laid out or displayed on the device, operating (B) a manufacturing step according to this information, The method is characterized in that said information (7) is made visible upon activation. The invention relates also to corresponding device.

公开(公告)号：EP2220597A1

公开(公告)日：2010-08-25

申请号：EP08857935.4

申请日：2008-12-02

Applicant: Gemalto SA

Inventor： THILL, Michel ,  LEIBENGUTH, Joseph ,  FIDALGO, Jean-Christophe

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  G06K19/072 ,  G06K19/07741 ,  G06K19/07775 ,  G06K19/07779

Abstract: The invention relates to a system with a dual integrated circuit for a communication terminal, wherein said system includes: an integrated circuit smart card including a substrate (20); a first integrated circuit (μP1) in the substrate and a first integrated-circuit communication interface (24), said first integrated circuit being adapted for communication with the device; a second portable integrated circuit (μP2) including a third communication (48, 49, 51) / interconnection (28) interface. The system is characterised in that the first integrated circuit includes a second communication (40, 55)/ interconnection (30) interface coupled to/in contact with said third interface (48, 49, 51, 28) of the second portable integrated circuit. The invention also relates to a smart card, to a method and to the use of the system for implementing any application via a communication.