公开(公告)号：US20200368750A1

公开(公告)日：2020-11-26

申请号：US16768881

申请日：2018-10-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Hilary ELY ,  Michael W. CUMBIE ,  Adam HIGGINS ,  Rachel M. WHITE ,  Erik D. TORNIAINEN

IPC: B01L7/00 ,  C12P19/34

Abstract: A fluid thermal processing device may include a substrate, a platform projecting from the substrate, a fluid heating element supported by the platform, a temperature sensing element, distinct from the fluid heating element, supported by the platform and an enclosure supported by and cooperating with the substrate to form a fluid chamber about the platform. The fluid chamber forms a volume of uniform thickness conforming to and about the platform.

公开(公告)号：US20190134977A1

公开(公告)日：2019-05-09

申请号：US16096019

申请日：2016-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Michael W. CUMBIE

IPC: B41J2/14 ,  B41J2/145 ,  B41J2/16

Abstract: According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers.