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公开(公告)号:US20230114933A1
公开(公告)日:2023-04-13
申请号:US17958653
申请日:2022-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changhyun KIM , Kyung-Eun BYUN , Keunwook SHIN , Changseok LEE , Baekwon PARK
IPC: H01L21/02 , H01L23/532 , C23C16/40 , C23C16/455 , H01L21/768
Abstract: Provided are a graphene interconnect structure, an electronic device including the graphene interconnect structure, and a method of manufacturing the graphene interconnect structure. The graphene interconnect structure may include: a first oxide dielectric material layer; a second oxide dielectric material layer on a surface of the first oxide dielectric material layer and having a dielectric constant greater than that of the first oxide dielectric material layer; and a graphene layer on a surface of the second oxide dielectric material layer opposite to the surface on which the first oxide dielectric material layer is located.
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公开(公告)号:US20230078018A1
公开(公告)日:2023-03-16
申请号:US17945534
申请日:2022-09-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changseok LEE , Sangwon KIM , Kyung-Eun BYUN , Minseok YOO
IPC: H01L21/265 , H01L21/02 , C23C16/02 , C23C16/26
Abstract: Provided are a layer structure including a carbon-based material, a method of manufacturing the layer structure, an electronic device including the layer structure, and an electronic apparatus including the electronic device. The layer structure may include a lower layer, an ion implantation layer in the lower layer, and a carbon-based material layer on the ion implantation layer, wherein the ion implantation layer includes carbon. The ion implantation layer may include a trench, and the carbon-based material layer may be provided in the trench. The carbon-based material layer may be formed to coat an inner surface of the trench. The carbon-based material layer may fill at least a portion of the trench. The ion implantation concentration of the ion implantation layer may be uniform as a whole. The ion implantation layer may have an ion implantation concentration gradient in a given direction.
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公开(公告)号:US20230072229A1
公开(公告)日:2023-03-09
申请号:US17668004
申请日:2022-02-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changseok LEE , Sangwon KIM , Changhyun KIM , Kyung-Eun BYUN , Eunkyu LEE
IPC: H01L27/108 , H01L29/16 , H01L29/20 , H01L29/24 , H01L29/76 , H01L29/786
Abstract: Provided are a vertical-channel cell array transistor structure and a dynamic random-access memory (DRAM) device including the same. The vertical-channel cell array transistor structure includes a semiconductor substrate, a plurality of channels arranged in an array on the semiconductor substrate and each extending perpendicularly from the semiconductor substrate, a gate insulating layer on the plurality of channels, a plurality of word lines on the semiconductor substrate and extending in a first direction, and a two-dimensional (2D) material layer on at least one surface of each of the plurality of word lines.
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公开(公告)号:US20220319602A1
公开(公告)日:2022-10-06
申请号:US17708362
申请日:2022-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minhyun LEE , Taein KIM , Youngtek OH , Hyeonjin SHIN , Changseok LEE
IPC: G11C16/04 , H01L27/1157 , H01L27/11524 , H01L27/11551 , H01L27/11578
Abstract: Provided is a vertical nonvolatile memory device in which a thickness of one memory cell is reduced to reduce an entire thickness of a memory cell string and increase the number of stacked memory cells. The nonvolatile memory device includes a plurality of memory cell strings. Each of the memory cell strings may include a plurality of insulating spacers each extending in a first direction, a plurality of gate electrodes each extending in the first direction and alternately arranged with the plurality of insulating spacers in a second direction perpendicular to the first direction, and a plurality of contacts respectively arranged to contact a side surface of the plurality of gate electrodes respectively corresponding to the plurality of contacts.
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公开(公告)号:US20220302319A1
公开(公告)日:2022-09-22
申请号:US17495457
申请日:2021-10-06
Applicant: Samsung Electronics Co., Ltd. , UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Inventor: Changseok LEE , Soonyong KWON , Junghwa KIM , Seungwoo SON , Seunguk SONG , Hyeonjin SHIN , Zonghoon LEE , Yeonchoo CHO
IPC: H01L29/786 , H01L29/16 , H01L29/66 , H01L29/06
Abstract: Provided is a thin-film structure including a substrate, a nanocrystalline graphene layer provided on the substrate, and a two-dimensional material layer provided on the nanocrystalline graphene layer. The nucleation density of the two-dimensional material layer is 109 ea/cm2 or more according to the nanocrystalline graphene layer, and accordingly, a two-dimensional material layer having an improved uniformity may be formed and a time duration for forming the two-dimensional material layer may be greatly decreased.
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公开(公告)号:US20210210346A1
公开(公告)日:2021-07-08
申请号:US16923478
申请日:2020-07-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Keunwook SHIN , Kyungeun BYUN , Hyeonjin SHIN , Soyoung LEE , Changseok LEE
Abstract: A graphene structure and a method of forming the graphene structure are provided. The graphene structure includes directly grown graphene that is directly grown on a surface of a substrate and has controlled surface energy.
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公开(公告)号:US20210159183A1
公开(公告)日:2021-05-27
申请号:US17165246
申请日:2021-02-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Eun BYUN , Keunwook SHIN , Yonghoon KIM , Hyeonjin SHIN , Hyunjae SONG , Changseok LEE , Changhyun KIM , Yeonchoo CHO
IPC: H01L23/532 , H01L21/768 , H01L23/522
Abstract: Provided are an interconnect structure and an electronic device including the interconnect structure. The interconnect structure includes a dielectric layer including at least one trench, a conductive wiring filling an inside of the at least one trench, and a cap layer on at least one surface of the conductive wiring. The cap layer includes nanocrystalline graphene. The nanocrystalline includes nano-sized crystals.
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公开(公告)号:US20210125929A1
公开(公告)日:2021-04-29
申请号:US17082494
申请日:2020-10-28
Applicant: Samsung Electronics Co., Ltd. , UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Inventor: Hyeonjin SHIN , Minhyun LEE , Changseok LEE , Hyeonsuk SHIN , Seokmo HONG
IPC: H01L23/532 , H01L23/522
Abstract: An interconnect structure and an electronic apparatus including the interconnect structure are provided. The interconnect structure includes a conductive layer; a dielectric layer configured to surround at least a part of the conductive layer; and a diffusion barrier layer disposed between the conductive layer and the dielectric layer and configured to limit and/or prevent a conductive material of the conductive layer from diffusing into the dielectric layer, and at least one of the dielectric layer and the diffusion barrier layer includes a boron nitride layer of a low dielectric constant.
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49.
公开(公告)号:US20200035611A1
公开(公告)日:2020-01-30
申请号:US16215899
申请日:2018-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Eun Byun , Keunwook SHIN , Yonghoon KIM , Hyeonjin SHIN , Hyunjae SONG , Changseok LEE , Changhyun KIM , Yeonchoo CHO
IPC: H01L23/532 , H01L23/522 , H01L21/768
Abstract: Provided are an interconnect structure and an electronic device including the interconnect structure. The interconnect structure includes a dielectric layer including at least one trench, a conductive wiring filling an inside of the at least one trench, and a cap layer on at least one surface of the conductive wiring. The cap layer includes nanocrystalline graphene. The nanocrystalline includes nano-sized crystals.
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50.
公开(公告)号:US20180149966A1
公开(公告)日:2018-05-31
申请号:US15807106
申请日:2017-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeonjin SHIN , Hyunjae SONG , Seongjun PARK , Keunwook SHIN , Changseok LEE
CPC classification number: G03F1/64 , G03F1/22 , G03F1/62 , G03F7/7015 , G03F7/70883
Abstract: A pellicle for a photomask, a reticle including the same, and an exposure apparatus for lithography are provided. The pellicle may include a pellicle membrane, and the pellicle membrane may include nanocrystalline graphene. The nanocrystalline graphene may have defects. The nanocrystalline graphene may include a plurality of nanoscale crystal grains, and the nanoscale crystal grains may include a two-dimensional (2D) carbon structure having an aromatic ring structure. The defects of the nanocrystalline graphene may include at least one of an sp3 carbon atom, an oxygen atom, a nitrogen atom, or a carbon vacancy.
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