公开(公告)号：US20180331765A1

公开(公告)日：2018-11-15

申请号：US15947555

申请日：2018-04-06

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/556 ,  H04B10/50 ,  H04L27/20 ,  H04B10/564 ,  H04B10/079 ,  H04J14/02

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

公开(公告)号：US20170201325A1

公开(公告)日：2017-07-13

申请号：US15274714

申请日：2016-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi ,  Robert J. Stone

IPC: H04B10/556 ,  H04B10/50 ,  H04B10/564 ,  H04J14/02 ,  H04L27/20 ,  H04B10/079

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

公开(公告)号：US20160274319A1

公开(公告)日：2016-09-22

申请号：US15073957

申请日：2016-03-18

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/42 ,  H01S5/022 ,  G02B6/12

CPC classification number: G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/14

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 该芯片，材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层将芯片密封在平台上。

公开(公告)号：US09268096B1

公开(公告)日：2016-02-23

申请号：US14049053

申请日：2013-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena ,  Kumar Satya Harinadh Potluri ,  Amit Mizrahi

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/26 ,  B23K1/00 ,  G02B6/14 ,  G02B6/122

CPC classification number: G02B6/30 ,  B23K1/0004 ,  G02B6/1228 ,  G02B6/14 ,  G02B6/305

Abstract: An optical system includes a substrate and a first waveguide embedded on the substrate. The first waveguide has a first end. The optical system also includes an optical fiber optically coupled to the first waveguide and bounded to the substrate. The optical fiber has a first end with a flat portion forming a D-shaped cross section. The flat portion of the first end of the optical fiber is disposed adjacent to the first end of the first waveguide, thereby facilitating optical coupling between the first waveguide and the optical fiber.

Abstract translation: 光学系统包括衬底和嵌入在衬底上的第一波导。 第一波导具有第一端。 光学系统还包括光学耦合到第一波导并且限定于衬底的光纤。 光纤具有形成D形横截面的平坦部分的第一端。 光纤的第一端的平坦部分邻近第一波导的第一端设置，从而有助于第一波导和光纤之间的光耦合。

公开(公告)号：US09268088B2

公开(公告)日：2016-02-23

申请号：US14755545

申请日：2015-06-30

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  Derek Van Orden ,  Stephen B. Krasulick

IPC: G02B6/26 ,  G02B6/42 ,  G02B6/122 ,  G02B6/28

CPC classification number: G02B6/4206 ,  G02B6/122 ,  G02B6/14 ,  G02B6/26 ,  G02B6/2804 ,  G02B2006/12097 ,  G02B2006/12147 ,  H01S5/026 ,  H01S5/3013

Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

公开(公告)号：US20150099318A1

公开(公告)日：2015-04-09

申请号：US14509975

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01S5/022 ,  H01S5/02 ,  H01S5/30 ,  H01S5/026

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

Abstract translation: 一种用于制造用于跨材料分离功能的光子复合装置的方法包括提供具有平台和结合在平台中的芯片的复合装置。 芯片被处理包括图案化，蚀刻，沉积和/或其他处理步骤，同时芯片被结合到平台。 芯片用作增益介质，平台至少部分由硅制成。