公开(公告)号：US20200301069A1

公开(公告)日：2020-09-24

申请号：US16690523

申请日：2019-11-21

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Stephen B. Krasulick ,  Samir Desai

IPC: G02B6/12 ,  H01S5/022 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/028 ,  H01S5/22 ,  H01S5/343 ,  H01S5/40 ,  H01S5/30 ,  H04B10/50 ,  H04J14/02

Abstract: A 400 Gb/s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb/s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb/s to produce a 400 Gb/s transmitter. Other variations are also described.

公开(公告)号：US10678073B2

公开(公告)日：2020-06-09

申请号：US15656137

申请日：2017-07-21

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Damien Lambert ,  Andrew Bonthron ,  Guoliang Li

IPC: G02B6/26 ,  G02F1/01 ,  G02F1/017 ,  H03H7/38 ,  G02F1/015

Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.

公开(公告)号：US20200041732A1

公开(公告)日：2020-02-06

申请号：US16377824

申请日：2019-04-08

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  Derek Van Orden ,  Stephen B. Krasulick

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/28 ,  G02B6/14 ,  G02B6/122 ,  G02B6/26 ,  H01S5/026 ,  H01S5/30

Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

公开(公告)号：US10209448B2

公开(公告)日：2019-02-19

申请号：US15246925

申请日：2016-08-25

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/27 ,  G02B6/26 ,  G02B6/10 ,  G02B5/30 ,  G02B6/126 ,  G02F1/00 ,  G02F1/09 ,  G02B6/12

Abstract: An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.

公开(公告)号：US10151627B2

公开(公告)日：2018-12-11

申请号：US14964144

申请日：2015-12-09

Applicant: Skorpios Technologies, Inc.

Inventor： Robert J. Stone ,  Stephen B. Krasulick

IPC: G01R31/02 ,  G01J1/08 ,  G01R31/3187 ,  H04B10/073 ,  H04B17/00 ,  H04B10/035 ,  H04B10/077 ,  G01J1/42

Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

公开(公告)号：US10126501B2

公开(公告)日：2018-11-13

申请号：US15797871

申请日：2017-10-30

Applicant: Skorpios Technologies, Inc.

Inventor： Derek Van Orden ,  Amit Mizrahi ,  Timothy Creazzo ,  Stephen B. Krasulick

IPC: G02B6/293 ,  G02B6/125 ,  G02F1/01 ,  G02F1/225 ,  H01S3/063 ,  H01S3/08 ,  H01S5/40 ,  G02B6/26 ,  G02B6/12 ,  G02F1/21

Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.

公开(公告)号：US09709735B2

公开(公告)日：2017-07-18

申请号：US14880936

申请日：2015-10-12

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/00 ,  G02B6/122 ,  G02B6/12 ,  G02B6/136 ,  H01S5/022 ,  H01L25/16 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/167 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US09686015B2

公开(公告)日：2017-06-20

申请号：US15096017

申请日：2016-04-11

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Robert J. Stone ,  Stephen B. Krasulick ,  Timothy Creazzo

IPC: H04B10/00 ,  H04B10/12 ,  H04B10/40 ,  H04B10/272 ,  H04J14/02 ,  H04J14/06 ,  H04B10/25 ,  H04B10/50

CPC classification number: H04B10/40 ,  H04B10/2504 ,  H04B10/272 ,  H04B10/503 ,  H04J14/02 ,  H04J14/0282 ,  H04J14/06

Abstract: An optical network unit includes a transmit/receive port and a silicon waveguide optically coupled to the transmit/receive port. The optical network unit also includes a tunable filter coupled to the silicon waveguide and providing a first output for a first frequency band and a second output for a second frequency band. The optical network unit further includes a polarization diverse receiver coupled to the tunable filter and a laser coupled to the tunable filter.

公开(公告)号：US09568750B2

公开(公告)日：2017-02-14

申请号：US13861564

申请日：2013-04-12

Applicant: Skorpios Technologies, Inc.

Inventor： John Y. Spann ,  Derek Van Orden ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  Robert J. Stone ,  Stephen B. Krasulick

IPC: G02F1/035 ,  G02F1/025 ,  H01L21/02 ,  H01L29/20 ,  G02F1/225

CPC classification number: G02F1/025 ,  G02F1/2257 ,  G02F2202/102 ,  G02F2202/105 ,  H01L21/02538 ,  H01L29/20

Abstract: An optical modulator includes an input port, a first waveguide region comprising silicon and optically coupled to the input port, and a waveguide splitter optically coupled to the first waveguide region and having a first output and a second output. The optical modulator also includes a first phase adjustment section optically coupled to the first output and comprising a first III-V diode and a second phase adjustment section optically coupled to the second output and comprising a second III-V diode. The optical modulator further includes a waveguide coupler optically coupled to the first phase adjustment section and the second phase adjustment section, a second waveguide region comprising silicon and optically coupled to the waveguide coupler, and an output port optically coupled to the second waveguide region.

Abstract translation: 光调制器包括输入端口，包括硅并且光耦合到输入端口的第一波导区域，以及光耦合到第一波导区域并具有第一输出和第二输出的波导分配器。 光调制器还包括光耦合到第一输出并包括第一III-V二极管的第一相位调整部分和与第二输出光耦合并包括第二III-V二极管的第二相位调整部分。 光调制器还包括光耦合到第一相位调整部分和第二相位调整部分的波导耦合器，包括硅并光耦合到波导耦合器的第二波导区域以及光耦合到第二波导区域的输出端口。

公开(公告)号：US09496431B2

公开(公告)日：2016-11-15

申请号：US14509971

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L21/00 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/026 ,  H01S5/30 ,  H01S5/02

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.

Abstract translation: 一种制造复合器件的方法包括提供平台，提供芯片，以及将芯片粘合到平台上。 该平台具有基层和基层之上的器件层。 设备层中的开口露出基层的一部分。 芯片通过器件层中的开口暴露在基底层的部分上。 芯片的一部分在平台上方延伸并被移除。