公开(公告)号：US20150179574A1

公开(公告)日：2015-06-25

申请号：US14618837

申请日：2015-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jay-Bok CHOI ,  Jiyoung KIM ,  Hyun-Woo CHUNG ,  Sungkwan CHOI ,  Yoosang HWANG

IPC: H01L23/528 ,  H01L29/06

CPC classification number: H01L23/5283 ,  H01L21/3086 ,  H01L21/76224 ,  H01L27/10891 ,  H01L29/0649 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to a method of fabricating a semiconductor device, a first mask pattern is used to etch first device isolation layers and active lines or form grooves, in which word lines will be provided. Thereafter, the active lines are etched in a self-alignment manner by using the first mask pattern as an etch mask. As a result, it is possible to suppress mask misalignment from occurring.

Abstract translation: 根据制造半导体器件的方法，使用第一掩模图案来蚀刻第一器件隔离层和有源线或形成凹槽，其中将提供字线。 此后，通过使用第一掩模图案作为蚀刻掩模，以自对准方式蚀刻有源线。 结果，可以抑制掩模未对准的发生。