Abstract:
PROBLEM TO BE SOLVED: To provide an imprint method capable of suitably transferring a portion surrounded by a projecting portion of an uneven pattern.SOLUTION: In the imprint method, since the uneven pattern of a mold is formed after an imprint mold is brought into contact with a material to be transferred, compared to the case when the mold having the uneven pattern previously formed is brought into contact with the material to be transferred, the frequency of defective transferring caused by interposing the air between the mold and the material to be transferred can be decreased and the portion surrounded by the projecting portion of the uneven pattern can be preferably transferred.
Abstract:
PROBLEM TO BE SOLVED: To provide an imprint mold capable of easily changing its uneven pattern. SOLUTION: Since the imprint mold has an array of a plurality of pins which move up and down, a shape of an uneven pattern formed on the imprint mold can be easily changed by changing a projection amount of each pin. Consequently, the uneven pattern can be suitably changed in accordance with a desired three-dimensional pattern structure, thereby suppressing the number of imprint molds needed to form the desired three-dimensional pattern structure. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a reflection type photomask blank by which contrast between a pattern opened part and a pattern non-opened part of a reflection type photomask can be increased, and a pattern can be inspected easily, and to provide the reflection type photomask, and an inspection method and an inspection device of the same. SOLUTION: The reflection type photomask blank includes a substrate, a reflection film formed on the substrate, a luminescent layer formed on the reflection film and emitting light when a voltage is applied, an absorber formed on the luminescent layer and absorbing exposure light. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide: a reflective mask blank having a substrate, a multilayered reflective film reflecting exposure light, and an absorber absorbing the exposure light, and improved in contrast for inspection light by reducing the film thickness of the absorber and preventing degradation of resolution of a pattern peripheral part in exposure; and a reflective mask. SOLUTION: In this reflective mask blank, the absorber is composed of a first absorber 205 and a second absorber 204, and has a structure where the first absorber 205 is stacked on the second absorber 204 to be set on the exposure light side; the value of an extinction coefficient to the exposure light possessed by the first absorber 205 is larger than or equal to that possessed by the second absorber 204; the value of an extinction coefficient, possessed by the first absorber 205, to the inspection light having a wavelength larger than that of the exposure light is smaller than that possessed by the second absorber 204. This reflective mask is also provided. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To etch source/drain electrode layers without damaging an active layer due to over etching, or the like including the scraping of the active layer in patterning by one etching in a state where the electrodes are in contact with the active layer. SOLUTION: A material having resistance against alkali is adopted for the active layer, a material having properties dissolved to alkali is adopted for the source/drain electrodes, and etching is made by alkali etchant when patterning the source/drain electrodes, thus patterning the source/drain electrodes on an upper layer by etching without damaging the lower-layer active layer. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film transistor which can prevent erasure of a channel even if an etching method is used without using a lift-off method. SOLUTION: The method of manufacturing the thin-film transistor includes at least a first step of forming a gate electrode pattern on an insulating substrate, a second step of forming a gate insulating film on the gate electrode pattern, a third step of forming an oxide semiconductor film pattern on the gate insulating film, and a fourth step of forming a source electrode and a drain electrode on the gate insulating film. In the manufacturing method, the fourth step of forming the source and drain electrodes on the gate insulating film is a step of forming the source and drain electrodes by etching using an etchant having (electrode film thickness÷electrode etching rate) is smaller than (film thickness of oxide semiconductor film pattern÷etching rate of oxide semiconductor film pattern) after forming the electrode layer. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thin film transistor which is excellent in stability, is high in mobility and suitable for a pixel portion and a drive portion of a flexible display. SOLUTION: In a thin film transistor device, wherein a gate electrode is included on an insulating substrate, a drain electrode and a source electrode are arranged on a gate insulating film formed on these, and an oxide semiconductor pattern is arranged so that it may include a gap between the source electrode and the drain electrode, a sealing layer is included on the oxide semiconductor pattern. The sealing layer is an inorganic insulating film, for example it is oxidized silicon nitride or fluorinated resin. Moreover, the sealing layer is not included at least on a pixel electrode. Furthermore, an interlayer dielectric having an opening at a pixel electrode portion is included on the sealing layer, and an upper pixel electrode connected with the pixel electrode at the opening is included on the interlayer dielectric. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a display device and a manufacturing method of the display device which facilitates the positioning of substrates formed of a color filter and a semiconductor circuit. SOLUTION: A second substrate formed of a transparent semiconductor circuit is located between a reflection type display element and a first substrate formed of a color filter layer. The use of the transparent semiconductor circuit assures the visualization, makes the disposition of the semiconductor circuit between the color filter and a reflection type display element possible and facilitates the positioning of the color filter and the semiconductor circuit. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a stable thin-film transistor and a manufacturing method thereof by preventing oxygen deficiency of an oxide semiconductor in which oxygen deficiency easily occurs, thereby improving the flexibility in transistor design. SOLUTION: A laminate is used as an active layer, the laminate in which an oxide semiconductor A used as a substrate and consisting of any one kind of ZnO, SnO2, In2O3 and Zn2SnO4; and an intermediate oxide layer material B having a thickness not more than a film thickness causing a tunnel effect and having oxygen atoms are laminated. Thus, the problem is solved. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To pattern each of layers without using a lift-off process, and to provide a thin-film transistor to be manufactured using such a process. SOLUTION: In the thin-film transistor in which an InGaZnO4 thin film is used as an active layer and an ITO thin film is used as source-drain electrodes, this method has a process of patterning the ITO thin film provided on a substrate by etching, wherein the InGaZnO4 thin film provided on the patterned ITO thin film is patterned by etching. In this case, the two kinds of thin films are etched so that the etching is performed at different etching times while using etching liquids or etching gases of the same kind and same density, or while changing the density and not changing the other conditions. COPYRIGHT: (C)2007,JPO&INPIT