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    MULTI-DIMENSIONAL COMPONENT BUILD SYSTEM AND PROCESS
    41.
    发明申请
    MULTI-DIMENSIONAL COMPONENT BUILD SYSTEM AND PROCESS 审中-公开
    多维组件构建系统与过程

    公开(公告)号：US20150069668A1

    公开(公告)日：2015-03-12

    申请号：US14541184

    申请日：2014-11-14

    Applicant: United Technologies Corporation

    Inventor： Sergey Mironets ,  Agnes Klucha ,  Wendell V. Twelves, JR. ,  Benjamin T. Fisk

    IPC: B28B11/00 ,  B23K26/34 ,  B23K15/00 ,  F02C7/00

    CPC classification number: B29C64/153 ,  B22F3/1055 ,  B23K15/0086 ,  B28B11/00 ,  B29C64/371 ,  B29C2035/0838 ,  B33Y10/00 ,  B33Y30/00 ,  F02C7/00 ,  F05D2230/00 ,  F05D2230/31 ,  Y02P10/295

    Abstract: An example multi-dimensional component building system includes a first chamber having at least one base disposed therein, a second chamber adjacent to and in fluid communication with the first chamber through a first door, and a third chamber adjacent to and in fluid communication with the second chamber through a second door. The second chamber is fluidly sealed from the first chamber if the first door is in a closed position. The second chamber is configured to receive the at least one base via a first transfer mechanism if the fluid parameters of the first chamber are approximately equal to the fluid parameters of the second chamber. The second chamber includes a directed heat source and a build-up material configured to form a component on the at least one base by melting or sintering. The third chamber is fluidly sealed from the second chamber if the first door is in a closed position. The third chamber is configured to receive the at least one base, having a formed component disposed thereon, via a second transfer mechanism if the second door is in an open position. The fluid parameters of the second chamber are not substantially affected by fluid communication with the first chamber or the third chamber.

    Abstract translation: 示例性多维部件构建系统包括具有设置在其中的至少一个基座的第一腔室，与第一腔室相邻并与第一腔室流体连通的第二腔室，以及与第一腔室相邻并与其流体连通的第三腔室 第二室通过第二扇门。 如果第一个门处于关闭位置，第二个室与第一个室流体密封。 如果第一室的流体参数近似等于第二室的流体参数，则第二室被构造成经由第一传送机构接纳至少一个底座。 第二室包括定向热源和构建成通过熔化或烧结在至少一个基底上形成组分的积聚材料。 如果第一个门处于关闭位置，则第三个室与第二个室流体密封。 如果第二门处于打开位置，则第三室被构造成经由第二传送机构接收具有设置在其上的成形部件的至少一个基座。 第二室的流体参数基本上不受与第一室或第三室的流体连通的影响。

    Additive manufacturing system for minimizing thermal stresses
    45.
    发明授权
    Additive manufacturing system for minimizing thermal stresses 有权

    公开(公告)号：US10556270B2

    公开(公告)日：2020-02-11

    申请号：US14689845

    申请日：2015-04-17

    Applicant: United Technologies Corporation

    Inventor： Sergey Mironets ,  Alexander Staroselsky

    IPC: B29C67/00 ,  B22F3/105 ,  B22F3/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

    Abstract: A build plate for an additive manufacturing system is disclosed. The build plate includes a support structure, a sub-plate, and one or more transducers. The support structure is configured to support a stack of sintered layers of a pulverant material. Further, the support structure extends orthogonally to a build direction. The sub-plate is arranged along the support structure, and defines a transducer cavity. One or more transducers are arranged in the transducer cavities. The one or more transducers are operable to cause vibration of the support structure and the stack parallel to the build direction. Such vibration relieves internal stresses caused by sintering of the stack.

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