Abstract:
A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystems platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.
Abstract:
A system and method which provide a general-purpose pressure-fitting receptacle (or "clamp") suitable for coupling microcomponentsare disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure it with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a "preloaded" receptacle that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded receptacle suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides an "expansion" receptacle that is suitable for performing general assembly of microcomponents. Such pressure-fitting receptacles may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone receptacles.
Abstract:
PROBLEM TO BE SOLVED: To manufacture a plurality of microstructures having uniform height in a substrate and achieve a stable adhesive property.SOLUTION: On the first substrate 12A, a first structure 14A having a first height h1 and a second structure 16A having a second height h2 higher than the first height h1 are provided. The second substrate 12B is laminated on the first substrate 12A. The second structures 16A and 16B are contracted in the direction of height. While the second structures 16A and 16B are deformed to a structure 18 having a height prescribed by the first structures 14A and 14B, the substrates are bonded to each other. The second structures 16A and 16B are, for instance, porous structures made of metal particles as materials. The first structures 14A and 14B are formed with a material having a smaller amount of deformation under the same pressure than that of the second structures 16A and 16B.
Abstract:
The present invention relates to modular system for micro-nano manipulation of samples. The modular system of the present invention comprises changeable tool tips which may be provided in an array, and a tool body. Each changeable tool tip comprises an end effector connected to a base having mating structures. The tool body includes an arm having slits having dimensions and being disposed on the arm so as to detachably couple with the mating structures of the tool tip. The slits may include an opening with rounded corners for receiving the mating structures, and tapered side walls for frictionally fitting the mating structures. The present invention relates also to a connection system for connecting a micro-dimensional tool body to a changeable micro-dimensional tool tip and to a manipulation tool for use with changeable tool tips of the present invention.
Abstract:
The invention provides droplet actuators with droplet operations surfaces for manipulating droplets, e.g., by conducting droplet operations. The droplet operations surfaces are typically exposed to a droplet operations gap. One or more regions of a droplet operation surface may include patterned topographic features. The invention also provides a droplet actuator in which one or both gap-facing droplet operations surfaces is formed using a removable film. The removable film may, in various embodiments, also include other components ordinarily associated with the droplet actuator substrate, such as the dielectric layer and the electrodes. Further, the invention provides droplet actuator devices and methods for coupling and/or sealing substrates of a droplet actuator, such as techniques for self-aligning assembly of droplet actuator substrates. The invention provides droplet actuators and methods of disassembling the droplet actuator in order to provide access for cleaning and/or recycling of droplet actuator surfaces.
Abstract:
A system and method for storing potential energy in a microcomponent is disclosed comprising a multi-stable element having two or more equilibrium states and a stopper to restrict the multi-stable element from entering at least one of the two or more equilibrium states. The pre-charged microcomponent may then preferably be transported to another location and use the stored potential energy to perform some action.
Abstract:
The present invention provides microfluidic devices, systems and methods for using the same, which facilitate the introduction of fluid to and from a microfluidic channel located within the microfluidic devices.