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    MODULAR FLOORING ASSEMBLIES
    41.
    发明申请
    MODULAR FLOORING ASSEMBLIES 审中-公开
    模块化地板装配

    公开(公告)号：WO2017044739A1

    公开(公告)日：2017-03-16

    申请号：PCT/US2016/050940

    申请日：2016-09-09

    Applicant: COMC, LLC ,  MCINTOSH, Jonathan ,  HEIB, Rick ,  WURTELE, Chris ,  NEUBAUM, Steve

    Inventor： MCINTOSH, Jonathan ,  HEIB, Rick ,  WURTELE, Chris ,  NEUBAUM, Steve

    IPC: E04F15/022 ,  E04F15/04 ,  E04F15/08 ,  E04F15/02

    CPC classification number: E04F15/02194 ,  E04F15/043 ,  E04F15/087 ,  E04F2201/0138 ,  E04F2201/022

    Abstract: Disclosed herein is a modular flooring assembly including a flooring component adhered to a first tray substrate and a second tray substrate which are interconnected to form an assembled tray substrate. The assembled tray substrate may be interconnected with additional assembled tray substrates to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Conventional fill-in grout or a snap-in grout may be used with the modular flooring assemblies.

    Abstract translation: 本文公开了一种模块化地板组件，其包括粘附到第一托盘基板的地板部件和互连以形成组装的托盘基板的第二托盘基板。 组装的托盘基板可以与附加的组装的托盘基板互连以形成适合于大多数地板应用的模块化地板。 地板部件可以是地板应用中通常使用的瓷砖或木材或其他材料。 常规的填充式灌浆或卡入式灌浆可与模块化地板组件一起使用。

    JOINT FOR CONNECTING WOOD MEMBERS
    42.
    发明申请
    JOINT FOR CONNECTING WOOD MEMBERS 审中-公开
    联系木材会员

    公开(公告)号：WO2008137339A1

    公开(公告)日：2008-11-13

    申请号：PCT/US2008/061523

    申请日：2008-04-25

    Applicant: SILL, Gary

    Inventor： SILL, Gary

    IPC: B27F1/16

    CPC classification number: B27M3/002 ,  E04B2001/262 ,  E04F15/04 ,  E04F2201/022 ,  E04F2201/025 ,  E04F2201/028 ,  Y10T403/473

    Abstract: A joint for joining one board to another board comprises a plurality of alternating top and bottom fingers. The top fingers each have a top surface and a sloped surface. The top surfaces of the top fingers are level and contiguous with the top surface of the board, and the sloped surfaces angle from the outer ends of the top fingers inward and downward to the bottom surface of the board. The bottom fingers each have a bottom surface and a sloped surface. The bottom surfaces of the bottom fingers are level and contiguous with the bottom surface of the board, and the sloped surfaces angle from the outer ends of the bottom fingers inward and upward to the top surface of the board. When two boards having such joints are joined, the top fingers of each board interlace and the bottom fingers of each board interlace.

    Abstract translation: 用于将一个板连接到另一个板的接头包括多个交替的顶部和底部指状物。 顶部的手指各具有顶面和倾斜的表面。 顶部指状物的顶表面与板的顶表面平齐并邻接，并且倾斜表面从顶部指状物的外端向内和向下到板的底部表面成角度。 底部手指各具有底面和倾斜表面。 底部指状物的底部表面与板的底部表面平齐并且邻接，并且倾斜表面从底部指状物的外端向内和向上到板的顶部表面成角度。 当具有这种关节的两个板连接时，每个板的顶部手指交错和每个板的底部指状物交织。

    IMPACT DAMPING MAT, EQUIPMENT ACCESSORY AND FLOORING SYSTEM
    47.
    发明申请
    IMPACT DAMPING MAT, EQUIPMENT ACCESSORY AND FLOORING SYSTEM 有权
    冲击垫，设备附件和地板系统

    公开(公告)号：US20160375296A1

    公开(公告)日：2016-12-29

    申请号：US14954185

    申请日：2015-11-30

    Applicant: Pliteq Inc.

    Inventor： Paul Downey ,  Paul Gartenburg

    IPC: A63B21/00 ,  E04F15/10 ,  E04F15/22

    CPC classification number: A63B21/4037 ,  A63B6/00 ,  A63B21/072 ,  A63C19/04 ,  E04F15/107 ,  E04F15/225 ,  E04F2201/0138 ,  E04F2201/022 ,  E04F2290/044

    Abstract: An impact damping mat comprises a base layer having a base surface with a plurality of protuberances, a damping layer overlying the base layer, a load distribution layer overlying the damping layer and an upper layer overlying the load distribution layer and having a planar top surface. The materials and dimensions of the layers cooperate to provide a selected rebound characteristic and a selected sound reduction characteristic.

    Abstract translation: 冲击阻尼垫包括具有多个突起的基底表面的基底层，覆盖基底层的阻尼层，覆盖阻尼层的载荷分布层和覆盖载荷分布层并具有平坦顶面的上层。 这些层的材料和尺寸相配合以提供所选择的回弹特性和选定的声音降低特性。

    Interlocking modular floor tile
    49.
    发明授权
    Interlocking modular floor tile 有权
    联锁模块地板砖

    公开(公告)号：US09499979B2

    公开(公告)日：2016-11-22

    申请号：US13519063

    申请日：2010-08-27

    Applicant: Huanwen Huang

    Inventor： Huanwen Huang

    IPC: E04F13/00 ,  E04B5/02

    CPC classification number: E04F15/02038 ,  E04B5/02 ,  E04F15/02194 ,  E04F2201/0138 ,  E04F2201/0153 ,  E04F2201/022 ,  E04F2201/043

    Abstract: Aspects relate to improved floor boards. Certain embodiments may be laid and fixed without the need for fixing with adhesive or nails. In one embodiment, a floor board includes a four-sided surface board connected to a four-sided base board. Further example floor boards include staggered tongue-shaped hooking tongues for connection of multiple floor boards.

    Abstract translation: 方面涉及改进的地板。 某些实施例可以铺设和固定，而不需要用粘合剂或钉子固定。 在一个实施例中，地板包括连接到四面基板的四面表面板。 进一步的示例性地板包括用于连接多个地板的交错的舌形钩舌。

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