Abstract:
Disclosed is a halogen-free epoxy resin composition for integrated circuit packaging, and the resin composition includes a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing a curing agent, an inorganic filler, a curing accelerator and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade.
Abstract:
The present invention discloses the use in rotomolding or slush molding applications of a composition comprising a polyolefin, a processing aid and optionally a UV-stabilizer.
Abstract:
There is provided herein an antimony trioxide-free flame-retarded styrenic thermoplastic polymer composition comprising: (a) at least one styrenic thermoplastic polymer; (b) at least one brominated flame retardant, (c) at least one metal phosphonate; and, (d) at least one antidripping agent. There is also provided a method of making said flame retarded styrenic thermoplastic polymer composition; and, an article comprising the styrenic thermoplastic polymer composition.
Abstract:
A thermoplastic moulding compound that has proved to be extremely weather-resistant and low-emission containing the following components: A) 3-77% by weight of one or more styrene copolymers, component A; B) 15-89% by weight of one or more polyamides, component B; C) 5-50% by weight of two or more graft rubbers without olefinic double bonds in the rubber phase, component C; D) 1-25% by weight of a terpolymer of styrene, acrylonitrile and maleic anhydride, component D; E) 2-30% by weight of rubber based on olefinic monomers, component E; F) 0-50% by weight of fibrous or particulate filler or mixtures thereof, component F; G) 0-40% by weight of further additives, component G.
Abstract:
The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.
Abstract:
Provided is a vibration-insulating rubber composition and a crosslinked vibration-insulating rubber composition which are excellent in low dynamic-to-static modulus ratio, elongation fatigue resistance, low temperature characteristics, and processability, and a vibration-insulating rubber using the vibration-insulating rubber composition and the crosslinked vibration-insulating rubber composition. The vibration-insulating rubber composition of the present invention includes: a rubber component having a conjugated diene compound/non-conjugated olefin copolymer, and a non-conjugated diene-based polymer; a vulcanizing agent having a bismaleimide compound; and N-phenyl-N-(trichloromethylthio)benzenesulfonamide.
Abstract:
This invention relates to a biodegradable polymer composition which is particularly suitable for use in the manufacture of articles having a high heat deflection temperature (HDT) by injection moulding and thermoforming.
Abstract:
A polyester resin composition containing a polyester resin, and a fine cellulose fiber composite having an average fiber diameter of from 0.1 to 200 nm, wherein the fine cellulose fiber composite contains fine cellulose fibers and hydrocarbon groups being connected thereto via an amide bond. The polyester resin composition of the present invention can be worked into a molded article by thermoforming or injection-molding, and is suitably used for various industrial applications, such as daily sundries, household electric appliance parts, packaging materials for household electric appliance parts, and automobile parts. In addition, the fine cellulose fiber composite has high dispersibility against various resins and can exhibit thickening effects, so that it is suitable as various thickeners or the like.
Abstract:
Provided is a maleimide copolymer which exhibits an excellent hue, an effect of imparting high heat resistance, and excellent kneadability. Specifically provided is a maleimide copolymer which comprises 50 to 60 mass % of a styrene monomer unit, 30 to 50 mass % of a maleimide monomer unit, and 0 to 10 mass % of an unsaturated dicarboxylic anhydride monomer unit, and which has a weight-average molecular weight (Mw) of 90,000 to 130,000 and a residual maleimide monomer content of 300 ppm or lower.
Abstract:
Polyamide-filled EVA copolymer compositions comprising a continuous EVA copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with peroxide curatives the polyamide-filled EVA copolymer compositions exhibit enhanced resistance to heat aging compared to EVA elastomer compositions reinforced with carbon black or other inorganic fillers.