公开(公告)号：US12129358B2

公开(公告)日：2024-10-29

申请号：US17184298

申请日：2021-02-24

Applicant: PMC Organometallix, Inc.

Inventor： Kevin John Ross ,  Gene Kelly Norris

IPC: C08K5/57 ,  C08L27/06 ,  C08L27/24

CPC classification number: C08K5/57 ,  C08L27/06 ,  C08L27/24 ,  C08L2201/08 ,  C08K5/57 ,  C08L27/06

Abstract: The present invention relates to stabilizer composition for halogen-containing polymer. It has recently been found that tin-based thermal stabilizers with a bridging alkyl group between two tin centers are effective stabilizers while having effectively double the molecular weight of the corresponding non-alkyl bridged stabilizer. It is expected that ongoing experimentation will confirm that the alkyl bridged stabilizers have much lower volatility which leads to greater retention of the stabilizer in the finished article.

公开(公告)号：US12129337B2

公开(公告)日：2024-10-29

申请号：US17297854

申请日：2020-02-10

Applicant: LG CHEM, LTD.

Inventor： Jinyoung Park ,  Chan Hyo Park ,  Danbi Choi

IPC: C08J5/18 ,  C08G73/10 ,  C08L79/08

CPC classification number: C08G73/101 ,  C08G73/1067 ,  C08J5/18 ,  C08L79/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20

Abstract: The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics.

公开(公告)号：US12122904B2

公开(公告)日：2024-10-22

申请号：US17789005

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayong Fan ,  Zengbiao Huang ,  Yongjing Xu

IPC: C08L47/00 ,  B32B15/20 ,  C08J5/04 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14

CPC classification number: C08L47/00 ,  B32B15/20 ,  C08J5/043 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2457/08 ,  C08J2345/00 ,  C08J2347/00 ,  C08J2445/00 ,  C08J2447/00 ,  C08J2471/12 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03

Abstract: Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

公开(公告)号：US12116506B2

公开(公告)日：2024-10-15

申请号：US17262501

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/14 ,  C08G59/24 ,  C08G59/40 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08

CPC classification number: C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/4825 ,  C08G18/6715 ,  C08G18/755 ,  C08G59/14 ,  C08G59/245 ,  C08G59/4021 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/18 ,  C08L2207/53 ,  C09J2301/30 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2475/00

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US12110396B2

公开(公告)日：2024-10-08

申请号：US17378510

申请日：2021-07-16

Applicant: UNIGEL IP LIMITED ,  UNIGEL LIMITED

Inventor： Scott Allen ,  Adrian Chisholm ,  Mukhtiar Singh Sohal ,  Ivan Tory

IPC: C08L91/00 ,  C08J3/09 ,  C08J3/11 ,  G02B6/44

CPC classification number: C08L91/00 ,  C08J3/091 ,  C08J3/11 ,  G02B6/443 ,  C08L2201/08 ,  C08L2201/56 ,  C08L2205/03 ,  C08L2205/20

Abstract: This invention relates to gel compositions for filling cables, such as communication cables, in particular to gel compositions containing microspheres, to cables comprising said gels, and to methods of preparing such gel.

公开(公告)号：US20240327635A1

公开(公告)日：2024-10-03

申请号：US18703755

申请日：2022-11-03

Applicant: Covestro Deutschland AG

Inventor： Kevin Gu ,  George Wang

IPC: C08L67/02 ,  C08K3/04

CPC classification number: C08L67/02 ,  C08K3/041 ,  C08L2201/08 ,  C08L2203/20

Abstract: The present application relates to a heat-resistant thermoplastic electrostatic dissipative composition and shaped articles made therefrom. The composition comprises the following components: an aromatic polycarbonate, a polyalkylene terephthalate, a carbon nanotube and a reinforcement material. The shaped article made from the composition according to the present invention has a good combination of heat-resistance, semi-conductivity and dimensional stability.

公开(公告)号：US20240327629A1

公开(公告)日：2024-10-03

申请号：US18194316

申请日：2023-03-31

Applicant: Toray Plastics (America), Inc.

Inventor： Jesse Jude BALDWIN ,  Tyler Austin BOWMAN ,  Pawel SIERADZKI

IPC: C08L23/06 ,  B32B5/18 ,  B32B5/32 ,  B32B25/04 ,  B32B27/06 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/40 ,  C08J9/00 ,  C08J9/10 ,  C09J7/26 ,  C09J7/38

CPC classification number: C08L23/06 ,  B32B5/18 ,  B32B5/32 ,  B32B25/045 ,  B32B27/065 ,  B32B27/283 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  C08J9/0061 ,  C08J9/103 ,  C09J7/26 ,  C09J7/38 ,  B32B5/022 ,  B32B5/245 ,  B32B9/025 ,  B32B9/046 ,  B32B27/304 ,  B32B2262/0253 ,  B32B2262/0276 ,  B32B2266/025 ,  B32B2266/08 ,  B32B2274/00 ,  B32B2307/72 ,  B32B2307/7376 ,  B32B2405/00 ,  C08J2203/04 ,  C08J2205/044 ,  C08J2205/052 ,  C08J2323/06 ,  C08J2423/06 ,  C08J2453/00 ,  C08L2201/08 ,  C08L2203/14 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/06 ,  C08L2207/066 ,  C08L2310/00 ,  C09J2301/124 ,  C09J2301/302 ,  C09J2301/414 ,  C09J2423/006 ,  C09J2453/006

Abstract: Described herein are physically crosslinked, closed cell continuous foam structures comprising low density polyethylene (LDPE), linear low density polyethylene (LLDPE), or a combination of LDPE and LLDPE, and olefin block copolymer (OBC). The foam structure can be obtained by extruding a foam composition comprising LDPE, LLDPE, or a combination of LDPE and LLDPE, and OBC, irradiating the composition with ionizing radiation, and foaming the composition.

公开(公告)号：US20240327623A1

公开(公告)日：2024-10-03

申请号：US18617958

申请日：2024-03-27

Applicant: SEIKO EPSON CORPORATION

Inventor： Shinobu YOKOKAWA ,  Shintaro ASAI ,  Hirofumi HOKARI ,  Atsushi YAMADA

IPC: C08L1/32 ,  C08B3/08 ,  C08J5/04 ,  C08K5/00

CPC classification number: C08L1/32 ,  C08B3/08 ,  C08J5/046 ,  C08K5/005 ,  C08K5/0066 ,  C08J2301/02 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2205/025

Abstract: The molding material of the present disclosure includes a cellulose fiber and a specific cellulose derivative in which a part of the hydrogen atoms constituting the hydroxy groups of cellulose is substituted with a chemical structure represented by the following formula (1) or (3) and another part of the hydrogen atoms is substituted with a chemical structure represented by the following formula (2) or (4), wherein the content of the cellulose fiber is 50 mass % or more and 70 mass % or less.


—RA  (1)



—RC3—(ORC2)m—ORC1  (2)



—(C═O)RB  (3)



—(C═O)RC4—(ORC2)n—ORC1  (4)

公开(公告)号：US12104061B2

公开(公告)日：2024-10-01

申请号：US18219833

申请日：2023-07-10

Applicant: DuPont Specialty Materials Korea Ltd. ,  DuPont Electronic Materials International, LLC ,  DuPont Toray Specialty Materials Kabushiki Kaisha

Inventor： Shunya Takeuchi ,  Anna Ya Ching Feng ,  Yutaka Oka ,  Jung Hye Chae

IPC: C08L83/04 ,  C08G77/00 ,  C08G77/20 ,  C08G77/28 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397

CPC classification number: C08L83/04 ,  C08G77/20 ,  C08G77/28 ,  C08G77/80 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2312/06

Abstract: A UV curable silicone composition has exceptional curability by ultraviolet irradiation. The UV curable silicone composition includes (A) an organopolysiloxane composition selected from the following: (A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule, (A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or (A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and (B) a silicone-compatible photo-initiator comprising a compound selected from the following: (B-1) an alpha-hydroxyacetophenone, (B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or (B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.

公开(公告)号：US12098241B2

公开(公告)日：2024-09-24

申请号：US17288767

申请日：2019-11-25

Applicant: MITSUBISHI CHEMICAL CORPORATION

Inventor： Fumihiro Muto

IPC: C08G63/183 ,  C08K3/26 ,  C08K3/34 ,  C08K5/00 ,  C08K7/06 ,  C08K7/14 ,  C08L25/06 ,  C08L25/10 ,  C08L25/14 ,  C08L69/00

CPC classification number: C08G63/183 ,  C08K3/26 ,  C08K3/34 ,  C08K5/0066 ,  C08K7/06 ,  C08K7/14 ,  C08L25/06 ,  C08L25/10 ,  C08L25/14 ,  C08L69/00 ,  C08K2003/265 ,  C08K2201/003 ,  C08K2201/016 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  C08L2205/03

Abstract: A thermoplastic resin composition that contains, based on 100 mass parts for a total of (A) and (B), at least 20 mass parts but less than 50 mass parts of (A) a polyalkylene terephthalate resin and more than 50 mass parts and not more than 80 mass parts of (B) a polystyrene resin or a rubber-reinforced polystyrene resin, wherein an intrinsic viscosity (IVA) of the polyalkylene terephthalate resin (A) is 0.3 to 0.8 dl/g and a melt viscosity (ηB) of the polystyrene resin or rubber-reinforced polystyrene resin (B) at 250° C. and 912 sec−1 is at least 80 Pa·sec.