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公开(公告)号：JPWO2013047678A1
公开(公告)日：2015-03-26
申请号：JP2013536392
申请日：2012-09-27
Applicant: 株式会社安永
CPC classification number: B24B27/0633 , B24B55/12 , B24B57/00 , B28D5/007 , B28D5/04 , C01B33/02 , Y02P70/179
Abstract: 砥粒が固着された固定砥粒ワイヤ(2)と、被加工物(10)を支持する支持ユニット(8)と、クーラント液を供給するクーラント液供給ユニット(9)とを備えた切削又は磨砕装置(1)を用い、クーラント液を供給しながら固定砥粒ワイヤ(2)又は被加工物(10)を相対的に往復又は旋回運動させて被加工物(10)を切削又は磨砕する微細化工程と、被加工物(10)の切削又は磨砕により微細粒子(11)を形成し、クーラント液とともにスラリーとして回収する回収工程と、このスラリーからサブミクロンを粒径の平均値とする正規分布を有する微細粒子を取り出す取り出し工程とを備えた。
Abstract translation: 固定磨料线磨粒是固定的（2）中，一个支撑单元，用于支撑所述工件（10）（8），切割或研磨和冷却剂流体供给单元用于供给冷却液（9） 磨削使用（1），切割或磨削的工件（10）与冷却剂装置固着磨料线（2）或由相对往复或轨道运动的工件（10）而供给 微粉化步骤，以形成细颗粒通过所述工件（10）（11）的切割或研磨，并回收与制冷剂液，从浆料中的亚微米的平均粒度的浆液的回收步骤 和取出具有正态分布的微细颗粒的取出工序。
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53.发明专利Austempering continuous treatment process for cast-iron camshaft 审中-公开用于CAST-IRON CAMSHAFT的连续连续处理方法
公开(公告)号：JP2014181356A
公开(公告)日：2014-09-29
申请号：JP2013054956
申请日：2013-03-18
Applicant: Yasunaga Corp , 株式会社安永 , Nagato:Kk , 株式会社ナガト
Inventor： UMEZAWA YUSUKE , KUWATA SHUN
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus which enables a continuous treatment by arranging, between a casting molding step and a processing step, a treatment technique for improving durability of a graphite spherical cast-iron article used in a mechanical element of an apparatus in a part in contact with an element of another apparatus which receives high resistance, pressure and/or load, e.g. the cam lobe surface of a cam shaft of a vehicle.SOLUTION: An austempering treatment technique comprises austenitizing the matrix of the surface of a cam lobe 3 temporarily by subjecting a cast-iron cam shaft to a partial austempering treatment and then converting the austenite to a bainite to minimize residual austenite so as to form such a cam surface that withstands high stress applied to the cast-iron surface and has high resistance to wear due to periodic stress. An apparatus which applies the austempering treatment technique to selected parts of a cast-iron cam shaft and allows a continuous treatment is also provided.
Abstract translation: 要解决的问题：提供一种能够通过在铸造成型步骤和加工步骤之间布置用于提高用于机器的机械元件中的石墨球形铸铁制品的耐久性的处理技术来进行连续处理的设备 与接收高电阻，压力和/或负载的另一装置的元件接触的部分，例如， 车辆的凸轮轴的凸轮凸角表面。解决方案：奥氏体处理技术包括通过对铸铁凸轮轴进行部分奥氏体淬火处理，然后将奥氏体转变为奥氏体，将奥氏体化暂时地凸起凸轮凸缘3的表面的基体 使残留奥氏体最小化的贝氏体，以形成能够承受施加到铸铁表面的高应力的凸轮表面，并且由于周期性应力而具有高耐磨性。 还提供了一种将奥氏体淬火处理技术应用于铸铁凸轮轴的选定部件并允许连续处理的装置。
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公开(公告)号：JP2014079830A
公开(公告)日：2014-05-08
申请号：JP2012228434
申请日：2012-10-15
Applicant: Yasunaga Corp , 株式会社安永
Inventor： YOSHIMATSU TAKAHIRO
IPC: B24B27/06 , B28D5/04 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a wire saw device which does not drop a wire engaged into an engaging groove when an auxiliary roller whose engaging groove is worn out is replaced.SOLUTION: A wire saw device has: main rollers 100 which are arranged in axial directions at a predetermined interval so that mutual axial directions become parallel with each other, and spiral wire engagement grooves are continuously formed; wires W which are engaged into the respective wire engaging grooves so that many pieces are bridged in parallel with one another between the respective main rollers and form a wire row by a plurality of wires W at predetermined intervals to one another between the respective main rollers; a wire feeding part and wire winding part 200 which feed and wind the wire; and an auxiliary roller 300 which is arranged between the wire feeding part and wire winding part 200 and the main rollers, and rotates at a state that the wire is hooked, when the auxiliary roller is replaced resulting from wear out of the wire engaging grooves near the auxiliary roller, a wire temporary placing roller 500 which temporarily places a wire at this part is provided in the vicinity of the auxiliary roller.
Abstract translation: 要解决的问题：提供一种线锯装置，其在接合槽被磨损的辅助辊被更换时，不会将接合到接合槽中的线材掉落。解决方案：线锯装置具有：主辊100，其布置在 以相互轴向互相平行的规定间隔，连续地形成螺旋状线接合槽， 电线W，其接合到相应的电线接合槽中，使得许多件在相应的主辊之间彼此平行地桥接，并且通过多个电线W在相应主辊之间以预定的间隔彼此形成电线排; 线材供给部和线缠绕部200，其供给和缠绕线; 以及辅助辊300，其布置在送丝部和线卷绕部200和主辊之间，并且当辅助辊由于接合处的线接合槽的磨损而被更换时，在线被钩住的状态下旋转 在辅助辊附近设置有辅助辊，在该部分临时放置线的线暂时放置辊500。
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公开(公告)号：JP2013111674A
公开(公告)日：2013-06-10
申请号：JP2011257848
申请日：2011-11-25
Applicant: Jfe Steel Corp , Jfeスチール株式会社 , Yasunaga Corp , 株式会社安永
Inventor： HARA KAZUAKI , ISHIKAWA YOSHIZO , OSANAI HISASHI , TANAKA YOSHIAKI
IPC: B24B27/06 , B28D5/04 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a machining method using a fixed abrasive wire saw, configured to properly control wire tension at a cutting position in cutting a workpiece using the fixed abrasive wire saw, and to provide a wafer manufactured in the machining method.SOLUTION: In the fixed abrasive wire saw 1, a wire row 20 formed by winding one fixed abrasive wire 10 on main rollers 18A, 18B multiple turns at a fixed pitch reciprocates in the longitudinal direction, and the workpiece 50 is pushed against the reciprocating wire row 20 so as to be cut at a plurality of positions simultaneously to form a plurality of wafers. The travelling direction is reversed when a travel distance of a wire portion located at a preset reference position on the wire pay-out side becomes equal to or larger than the length of the wire wound on the main rollers 18A, 18B.
Abstract translation: 要解决的问题：提供一种使用固定的研磨线锯的加工方法，其被配置为在使用固定的研磨线锯切割工件时在切割位置适当地控制线张力，并且提供在加工中制造的晶片 方法。 解决方案：在固定研磨线锯1中，通过以固定间距将一根固定磨料线10卷绕在主辊18A，18B上的多个匝形成的线排20在纵向方向上往复运动，并且将工件50推压 往复排列20，以便在多个位置同时切割以形成多个晶片。 当位于线出线侧的预设基准位置的线部分的行进距离变得等于或大于缠绕在主辊18A，18B上的线的长度时，行进方向相反。 版权所有（C）2013，JPO＆INPIT
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Patent Agency Ranking56.发明专利
公开(公告)号：JP2013107162A
公开(公告)日：2013-06-06
申请号：JP2011253163
申请日：2011-11-18
Applicant: Jfe Steel Corp , Jfeスチール株式会社 , Yasunaga Corp , 株式会社安永
Inventor： HARA KAZUAKI , ISHIKAWA YOSHIZO , OSANAI HISASHI , TANAKA YOSHIAKI
IPC: B24B27/06 , B28D5/04 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a cutting device and a method of manufacturing a substrate, facilitating manufacture of the substrate with small waviness, and a semiconductor wafer.SOLUTION: In a wire saw 100, a wire 20 is wound across a pair of rollers 10 to constitute a wire train 21, and, under a condition in which the wire train 21 is moved between the pair of rollers 10, an ingot 1 is pressed against the wire train 21 for cutting the ingot 1. The wire saw includes an auxiliary roller 60. The auxiliary roller 60, under a condition in which no load is applied from the ingot 1 to the wire train 21, is caused to abut with the wire train 21 to increase tension thereof.
Abstract translation: 要解决的问题：提供切割装置和制造基板的方法，便于制造具有小波纹度的基板和半导体晶片。 解决方案：在线锯100中，线20缠绕在一对辊子10上以构成线列21，并且在线列21在一对辊子10之间移动的条件下， 铸块1被压在钢丝绳21上以切割钢锭1.线锯包括辅助辊60.辅助辊60在从锭1向钢丝绳21施加负载的条件下被引起 与线列21抵接以增加其张力。 版权所有（C）2013，JPO＆INPIT
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57.发明专利Semiconductor ingot cutting method, fixed abrasive grain wire saw, and wafer 审中-公开半导体激光切割方法，固定磨粒电磁线和波形
公开(公告)号：JP2013099795A
公开(公告)日：2013-05-23
申请号：JP2011243472
申请日：2011-11-07
Applicant: Jfe Steel Corp , Jfeスチール株式会社 , Yasunaga Corp , 株式会社安永
Inventor： HARA KAZUAKI , ISHIKAWA YOSHIZO , OSANAI HISASHI , TANAKA YOSHIAKI
IPC: B24B27/06 , B28D5/04 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor ingot cutting method and a fixed abrasive grain wire saw which are suitable for improving efficiency in cutting a semiconductor ingot while using a fixed abrasive grain wire saw.SOLUTION: A wire row 20 is configured by winding and hanging a fixed abrasive grain wire 10 around main rollers 18A, 18B several times. The wire row is made to travel in its longitudinal direction and a semiconductor ingot 50 is pressed against the traveling wire row 20 to be processed into a plurality of wafers by simultaneously cutting the semiconductor ingot 50 at several locations. The wire row is configured to set a wire traveling speed Vw when cutting the semiconductor ingot to a speed within a range of 100[m/min]
Abstract translation: 要解决的问题：提供一种半导体锭切割方法和固定的磨粒线锯，其适用于在使用固定的磨粒线锯时提高切割半导体锭的效率。 解决方案：电线排20通过将固定的磨粒线10卷绕并悬挂在主辊18A，18B周围几次而构成。 使线排在其纵向方向上行进，并且半导体块50被压靠行进的线排20以通过在几个位置同时切割半导体块50而被加工成多个晶片。 该线列被配置为在将半导体锭切割成100 [m / min]
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公开(公告)号：JP2010253638A
公开(公告)日：2010-11-11
申请号：JP2009108218
申请日：2009-04-27
Applicant: Yasunaga Corp , 株式会社安永
Inventor： NAKAGAWA KIYOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a grinding wheel capable of preventing generation of sagging of an outer peripheral part with a simple structure and a grinding device using the grinding wheel.
SOLUTION: This circular annular shaped grinding wheel 1 has a grinding surface 2 for grinding an object to be ground on one side. Grinding area abutting on the object to be ground in an inner peripheral part 4 of the grinding surface 2 is narrower than grinding area in the outer peripheral part 5 of the grinding surface 2. As a result, workload per unit area in the inner peripheral part 4 is increased, and thereby when the grinding wheel 1 is applied to a double head plane grinding device, wear of the outer peripheral part 5 and the inner peripheral part 4 can be made uniform.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供一种能够以简单的结构防止外周部的下垂产生的砂轮和使用该砂轮的研磨装置。 解决方案：该圆形环形砂轮1具有用于在一侧研磨待研磨物体的研磨表面2。 在研磨面2的内周部4中与研磨对象物抵接的研磨面比研磨面2的外周部5的研磨面窄。因此，内周部的单位面积的工作量 因此，当将砂轮1施加到双头平面研磨装置时，能够使外周部5和内周部4的磨损均匀。 版权所有（C）2011，JPO＆INPIT
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60.发明专利Method for forming fracture start section of ductile metallic component consisting of forged material 审中-公开用于形成硬质材料的金属部件断裂开始部分的方法
公开(公告)号：JP2010076087A
公开(公告)日：2010-04-08
申请号：JP2009080722
申请日：2009-03-28
Applicant: Yasunaga Corp , 株式会社安永
Inventor： NAKAOKA ISAO
IPC: B23P13/00
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a fracture start section of a ductile metallic component consisting of a forged material at low cost.
SOLUTION: In the method for forming the fracture start section of the ductile metallic component consisting of the forged material comprising a first step of forming a groove part 11 in a part corresponding to the fracture start section of the ductile metallic component consisting of the forged material, and a second step of executing the hardening of at least a bottom portion of the groove part 11, the fracture start section of the ductile metallic component consisting of the forged material is formed at low cost without using any expensive laser beam apparatus or an exclusive broaching machine.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 解决的问题：提供一种以低成本形成由锻造材料构成的延性金属部件的断裂起始部分的方法。 ＆lt; P＆gt;解决方案：在由锻造材料构成的延性金属部件的断裂起始部分的形成方法中，包括在对应于延性金属部件的断裂起始部分的部分中形成槽部11的第一步骤，该部分由 锻造材料，以及执行槽部11的至少底部的硬化的第二步骤，由锻造材料构成的延性金属部件的断裂开始部分以低成本形成，而不使用任何昂贵的激光束装置 或独家拉床。 版权所有（C）2010，JPO＆INPIT
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