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公开(公告)号：EP3904580A1
公开(公告)日：2021-11-03
申请号：EP19903551.0
申请日：2019-12-18
Inventor： HAYASHI, Kohei , OBATA, Soichi , SHIROTANI, Yasuhiro , NITANI, Masashi , UNO, Mayumi , MAEDA, Kazuki
Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 µm.
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公开(公告)号：EP3892400A1
公开(公告)日：2021-10-13
申请号：EP19892899.6
申请日：2019-11-29
Inventor： KATAYAMA Daisuke , NAKAZAWA Masato , IGAMI Kaori , SUGAHARA Takahiro , NAKAMOTO Takayuki , MIKI Takao , UCHIDA Sohei
Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 µm or more and 150 µm or less, containing copper oxide in an amount of 0.10 g/m 2 or more and 7.0 g/m 2 or less per unit surface area and 0.5 mass% or more and 9.4 mass% or less per unit mass.
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53.发明公开
公开(公告)号：EP3778564A1
公开(公告)日：2021-02-17
申请号：EP19777518.2
申请日：2019-03-18
Inventor： SUZUKI, Youji , KAKEHASHI, Rie , TOKAI, Naoji
IPC: C07C291/04 , C07C231/08 , C07C233/36 , C09K3/00 , C07C231/02
Abstract: Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R 1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R 2 and R 3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R 4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R 5 and R 6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group; L 1 to L 3 represent an amide bond; in a case where L 1 and L 3 are -CONH-, L 2 is -NHCO-, and in a case where L 1 and L 3 are -NHCO-, L 2 is -CONH-.
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54.发明公开
公开(公告)号：EP3742870A1
公开(公告)日：2020-11-25
申请号：EP18899044.4
申请日：2018-12-25
Inventor： UNO, Mayumi , MAEDA, Kazuki , NITANI, Masashi , CHA, Busang , TAKEYA, Junichi
Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
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公开(公告)号：EP4242267A1
公开(公告)日：2023-09-13
申请号：EP21889269.3
申请日：2021-11-05
Inventor： KATO, Atsutaka , YAMAMOTO, Mari , TAKAHASHI, Masanari , UTSUNO, Futoshi , HIGUCHI, Hiroyuki
IPC: C08L101/00 , H01M4/13 , H01M4/62 , H01B1/06 , C08K3/32 , H01M10/052 , H01M10/0562
Abstract: A resin composition comprising a compound including phosphorus and sulfur as constituent elements and having a disulfide bond, and a thermoplastic resin.
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Patent Agency Ranking
公开(公告)号：EP3401365A8
公开(公告)日：2019-03-13
申请号：EP16883829.0
申请日：2016-12-26
Applicant: Sumitomo Seika Chemicals Co., Ltd. , Osaka Research Institute of Industrial Science and Technology
Inventor： NISHIOKA, Kiyoshi , MAEDA, Hiroki , ISHIKURA, Kei , MATSUKAWA, Kimihiro , KASHIWAGI, Yukiyasu , SAITOH, Masashi
Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.
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公开(公告)号：EP3425006A1
公开(公告)日：2019-01-09
申请号：EP17760053.3
申请日：2017-02-28
Inventor： FUJIWARA, Takeshi , HATTORI, Takayuki , INAGAKI, Jyunichi , KUNINOBU, Takafumi , TAKIZAWA, Kazuhiro , AGARI, Yasuyuki , HIRANO, Hiroshi , KADOTA, Joji , OKADA, Akinori
Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent 11 and the other end of the second coupling agent 12 are each bonded to a bifunctional or higher silsesquioxane 21 by a curing treatment, as illustrated in Fig. 2 , for example; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent 13 and the other end of the second coupling agent 12 are bonded together as illustrated in Fig. 3 , for example.
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公开(公告)号：EP3425004A1
公开(公告)日：2019-01-09
申请号：EP17760051.7
申请日：2017-02-28
Inventor： FUJIWARA,Takeshi , INAGAKI, Jyunichi , AGARI, Yasuyuki , HIRANO, Hiroshi , KADOTA, Joji , OKADA, Akinori
Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler 1 that is bonded to one end of a first coupling agent 11; and a heat conductive second inorganic filler 2 that is bonded to one end of a second coupling agent 12. This composition for low thermal expansion members is also characterized in that the first inorganic filler 1 and the second inorganic filler 2 are bonded to each other via the first coupling agent 11 and the second coupling agent 12 by means of a curing treatment.
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59.发明公开
公开(公告)号：EP3315229A1
公开(公告)日：2018-05-02
申请号：EP17198275.4
申请日：2017-10-25
Inventor： Tsubota, Ryusuke , Oka, Yohei , Okamoto, Akira , Nakamoto, Takayuki , Sugahara, Takahiro , Shinomiya, Naruaki , Takemura, Mamoru , Uchida, Sohei
CPC classification number: B22F3/1055 , B22F3/24 , B22F2003/248 , B22F2998/10 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C22C1/0425 , C22C9/00 , C22C9/06 , C22F1/08 , Y02P10/295
Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass% and not more than 2.80 mass% of chromium, and a balance of copper.
Abstract translation: 铜合金粉末是用于增材制造的铜合金粉末。 铜合金粉末含有超过1.00质量％且不超过2.80质量％的铬，其余为铜。
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公开(公告)号：EP4269673A1
公开(公告)日：2023-11-01
申请号：EP21911001.2
申请日：2021-12-23
Applicant: Asahi Kasei Advance Corporation , Osaka Research Institute of Industrial Science and Technology , Kaji Nylon .Inc
Inventor： UNO, Mayumi , OMORI, Mariko , MORITA, Shigeru , YOSHIMURA, Kansei
IPC: D02G3/04 , D02G3/26 , D02G3/38 , D02G3/44 , G01L1/14 , G01L1/20 , H01G5/16 , H01G4/16 , G01L5/00 , D03D15/20 , D03D15/37
Abstract: Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric yarn) for which a conventional piezoelectric material is used. This sensing fiber member has at least two covering yarns for which covering is achieved by wrapping an insulating fiber serving as a covering material in one directionaround a linear conductor constituting a core material, two of the covering yarns being arranged close to each other. The sensing fiber member is characterized by reading changes in resistance and/or changes in capacitance between the linear conductors of the two covering yarns arranged close to each other.
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