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公开(公告)号:US09356207B2
公开(公告)日:2016-05-31
申请号:US14720267
申请日:2015-05-22
Applicant: POSCO LED COMPANY LTD.
Inventor: Kyung-Rye Kim , Ji Eun Kook , Jung Hwa Kim , Jing Jong Kim , Min Uk Yoo , Dae Won Kim , Seong Bok Yoon
IPC: H01L33/00 , H01L33/54 , H01L33/50 , H01L25/075 , H01L23/00
CPC classification number: H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/507 , H01L33/508 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2924/00
Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.
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公开(公告)号:US20150184836A1
公开(公告)日:2015-07-02
申请号:US14656313
申请日:2015-03-12
Applicant: Posco LED Company Ltd.
Inventor: Ji Wan KIM , Min Uk YOO , Min Su KIM , Jung Hwa KIM
CPC classification number: F21V17/005 , F21V7/0083 , F21V17/007 , F21V23/008 , F21V23/023 , F21V29/15 , F21V29/773 , F21V31/005 , F21Y2115/10
Abstract: A heat sink unit including a plurality of fins disposed on a top surface of a base thereof and a plurality of light emitting modules disposed on a bottom surface thereof. A reflector having an inclined surface is formed along an inside edge of the heat sink unit.
Abstract translation: 一种散热器单元,包括设置在其底部的顶表面上的多个翅片和设置在其底表面上的多个发光模块。 具有倾斜表面的反射器沿着散热器单元的内边缘形成。
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公开(公告)号:US20150062914A1
公开(公告)日:2015-03-05
申请号:US14538624
申请日:2014-11-11
Applicant: Posco Led Company Ltd.
Inventor: Dong Soo KIM , Seok Jin Kang , Kyoo Seok Kim , Yoon Gil Jang , Dong Hee Kim , Seong Bok Yoon , Jung Hwa Kim
CPC classification number: F21V15/011 , F21V17/005 , F21V29/2231 , F21V29/2293 , F21V29/507 , F21V29/70 , F21V29/773 , F21V29/83 , F21Y2105/10 , F21Y2115/10
Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.
Abstract translation: 在散热单元的形成方向上形成的第一散热路径,其放置在安装有发光模块的壳体内。 沿着发光模块的边缘形成第二散热路径。 通过提供其中包括发光模块,光学构件和散热单元并且底表面从一侧逐渐变宽到另一侧的光引擎概念,光半导体照明装置可以减少 产品可以通过引入自然对流进一步提高散热效率,产品组装安装简单,维护方便,通过提高单位面积半导体光学器件的布置效率,可以提供高可靠性的产品。
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公开(公告)号:USD718892S1
公开(公告)日:2014-12-02
申请号:US29434583
申请日:2012-10-15
Applicant: POSCO LED Company Ltd.
Designer: Dong Soo Kim , Seok Jin Kang , Kyoo Seok Kim , Yoon Gill Jang , Dong Hee Kim
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公开(公告)号:US20140306242A1
公开(公告)日:2014-10-16
申请号:US13903621
申请日:2013-05-28
Applicant: POSCO LED COMPANY LTD.
Inventor: Kyung-Rye Kim , Ji Eun Kook , Jung Hwa Kim , Jing Jong Kim , Min Uk Yoo , Dae Won Kim , Seong Bok Yoon
CPC classification number: H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/507 , H01L33/508 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2924/00
Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.
Abstract translation: 一种光学半导体照明装置,包括:设置单个LED芯片或多个LED芯片的基板; 设置在所述基板上以覆盖所述多个LED芯片的第一模具部分; 以及从所述第一模具部分的边缘延伸并设置在所述基板上的第二模具部分。 相应的LED芯片可以通过第一和第二模具部分提高相对于基板的粘合强度。 可以通过第一和第二模具部分来防止由透湿引起的剥离,表面开裂和损坏。 包括在第二模具部分中的荧光材料可以提高波长转换率。
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56.
公开(公告)号:US20140203718A1
公开(公告)日:2014-07-24
申请号:US14223072
申请日:2014-03-24
Applicant: Posco Led Company Ltd.
Inventor: Seong Bok YOON , Dae Won KIM , Jong-Bum KIM
IPC: H05B33/08
CPC classification number: H05B33/083 , H05B33/0806 , H05B33/0824 , H05B33/0887 , H05B37/02
Abstract: Exemplary embodiments of the present invention disclose an alternating current (AC) light emitting diode (LED) lighting apparatus including a rectification unit configured to receive an AC voltage and output a DC rectified voltage, an LED unit connected to the rectification unit, the LED unit comprising at least two light emitting groups, each light emitting group comprising at least one LED, and an LED driving control unit connected to the rectification unit, the LED driving control unit configured to establish a series or parallel connection between the light emitting groups, by comparing a voltage level of the rectified voltage with a reference voltage. The LED driving control unit is configured to calculate a reference voltage adjustment value in order to compensate for a signal processing delay of the LED driving control unit.
Abstract translation: 本发明的示例性实施例公开了一种交流(AC)发光二极管(LED)照明装置,包括:被配置为接收AC电压并输出DC整流电压的整流单元,连接到整流单元的LED单元,LED单元 包括至少两个发光组,每个发光组包括至少一个LED,以及连接到整流单元的LED驱动控制单元,所述LED驱动控制单元被配置为在所述发光组之间建立串联或并联连接,所述LED驱动控制单元通过 将整流电压的电压与参考电压进行比较。 LED驱动控制单元被配置为计算参考电压调整值,以便补偿LED驱动控制单元的信号处理延迟。
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公开(公告)号:USD705471S1
公开(公告)日:2014-05-20
申请号:US29465954
申请日:2013-09-03
Applicant: Posco LED Company Ltd.
Designer: Ji Wan Kim , Min Su Kim , Yun Ha Kim
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公开(公告)号:US20140043827A1
公开(公告)日:2014-02-13
申请号:US13919328
申请日:2013-06-17
Applicant: POSCO LED COMPANY LTD.
Inventor: Jin Jong Kim , Jae Young Choi , Jung Hwa Kim , Ji Wan Kim , Hyun-Ku Park , Sun Min Park
IPC: F21K99/00
CPC classification number: F21S8/026 , F21S8/033 , F21V3/0625 , F21V23/023 , F21V29/507 , F21V29/89 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10
Abstract: An exemplary embodiment of the present invention discloses a light emitting diode (LED) lighting apparatus with a housing, a lighting module and a diffusion cover. The lighting module includes a circuit board combined with the housing, and a plurality of light emitting diodes mounted on the circuit board to generate light, the light emitting diodes in a first region being arranged with a first distance and the light emitting diodes in a second region being arranged with a second distance that is greater than the first distance. The diffusion cover is combined with the housing such that the diffusion cover covers the lighting module. The diffusion cover has a groove portion at a region corresponding to the second region.
Abstract translation: 本发明的示例性实施例公开了一种具有壳体,照明模块和扩散罩的发光二极管(LED)照明装置。 照明模块包括与壳体组合的电路板和安装在电路板上以产生光的多个发光二极管,第一区域中的发光二极管布置成第一距离,并且发光二极管在第二 区域被布置成具有大于第一距离的第二距离。 扩散盖与壳体组合,使得扩散盖覆盖照明模块。 扩散罩在对应于第二区域的区域具有凹槽部分。
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59.
公开(公告)号:US20130313593A1
公开(公告)日:2013-11-28
申请号:US13868571
申请日:2013-04-23
Applicant: POSCO LED COMPANY LTD.
Inventor: Jung Hwa KIM , Sun Hwa LEE , Jae Young KIM , Won Kuk SON
CPC classification number: H01L33/505 , H01L25/0753 , H01L33/483 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/642 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/0075 , H01L2924/00
Abstract: A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor.
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公开(公告)号:USD687585S1
公开(公告)日:2013-08-06
申请号:US29433858
申请日:2012-10-05
Applicant: Posco Led Company Ltd.
Designer: Ji Wan Kim , Min Su Kim
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