Abstract:
The process is an arc jet CVD diamond deposition process with very low methane, less than 0.07%, and the addition of water. The resulting material has is characterized by a narrow Raman peak, a relatively large lattice constant, and a charge carrier collection distance of at least 25 microns. Also disclosed is a particle detector device which makes use of the diamond material according to the invention.
Abstract:
Described is a vertical rack or boat assembly for supporting and carrying semi-conductor material wafers in a vertical diffusion furnace, the assembly being made up of a rack or boat (1) and wafer support rings (5) which fit into the boat (1).
Abstract:
Strong and durable silicon nitride filtration membranes with effective separating layers having effective pore diameters less than about 1 µm are produced by depositing a source of silicon onto a porous microfilter support, removing any liquid used in the depositing, and subjecting the silicon source to nitridation conditions. Suitable sources of silicon include silicon per se and silica. When silica is used, a suitable reducing agent is deposited therewith to reduce the silica to silicon in situ .
Abstract:
A technique for producing diamond film, including the following steps: providing a substrate having a Young's modulus of less than 50 GPa; providing a coating material comprising a binder and diamond grit; applying the coating material to the substrate; and depositing diamond film on the coating by chemical vapor deposition. In a disclosed embodiment, the binder comprises a glass-forming oxide. In a most preferred embodiment, the glass forming oxide portion of the coating includes both silicon dioxide and aluminum oxide. A deposition target medium for use in fabrication of diamond film by chemical vapor deposition technique is also disclosed.
Abstract:
Methods of making a scintillation crystal having reduced afterglow include preparing a crystal melt according to the Czochralsky technique and doping the melt with an element or a compound which reduces afterglow without significantly reducing the luminescence light output of the crystal grown in the melt. Experiments have shown that doping the melt with any one of calcium, cobalt, germanium, niobium, sodium, and chromium significantly reduces afterglow without unduly reducing the luminescence light output of the crystal. The presently preferred dopant is cobalt, which is added to the melt in concentrations of approximately 10ppm to 50ppm. Crystals made according to the method of the invention exhibit significantly less afterglow than crystals made from the same raw materials without doping. By choice of the proper concentration of dopant, the light output of the crystal during luminescence is not adversely affected.
Abstract:
In a Hall-Heroult cell for aluminum production, a cryolite-resistant liner comprising: a) between about 75 weight percent w/o and about 95 w/o alumina-silica refractory grain, and b) between about 2 w/o and about 10 w/o of a sealant selected from the group consisting of zinc borate; sulfur; R1 Al/x/2 Siy/2 Oz/2, R2(OH)2, R2CO3, R2SO4: 2H2O, and R2SiO3; wherein: i) R1 is selected from the group consisting of Na, K, and Li, and mixtures thereof, ii) x, y and z are integers between 1 and 16, inclusive, and iii) R2 is selected from the group consisting of Ca, Sr and Mg.
Abstract:
A method for ablating a synthetic diamond having a pitted surface includes applying a colloidal graphite to the surface of the diamond and subjecting it to an oxygen plasma so that preferably approximately 50 microns are removed from the surface of the synthetic diamond. The resulting surface of the diamond is virtually pit free. Preferably, the diamond is then mechanically lapped for finishing.
Abstract:
A JEDEC IC package comprising: a) an integrated circuit, b) a lead frame having a plurality of legs in electrical connection with the integrated circuit, and c) a diamond film, wherein the diamond film in is intimate thermal contact with both the integrated circuit and the plurality of legs of the lead frame.
Abstract:
The present invention relates to an unsiliconized or siliconized wafer consisting essentially of recrystallized silicon carbide, the wafer having a diameter of at least 150 mm and a thickness of between 0.5 and 2 mm, and having a porosity or free silicon content between 15 v/o and 43 v/o.
Abstract:
This invention relates to a disk substrate for use in a disk drive, the disk substrate consisting essentially of partially stabilized zirconia and having a surface roughness (Ra) of no more than 10 angstroms.