公开(公告)号：US20180294248A1

公开(公告)日：2018-10-11

申请号：US15947178

申请日：2018-04-06

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L23/00 ,  H01L21/683 ,  H01L33/00 ,  H01L25/00

Abstract: A method of batch transferring micro semiconductor structures is provided for effectively and efficiently picking up a batch of or a large amount of micro structures and transferring them to a target substrate, so it can be widely applied in transferring a lot of various micro semiconductor structures. The method includes steps of: attaching an adhesive material to a plurality of array-type micro semiconductor structures; and providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate. The array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.

公开(公告)号：US09831228B2

公开(公告)日：2017-11-28

申请号：US15379962

申请日：2016-12-15

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Yung-Yu Yen

IPC: H01L33/00 ,  H01L25/00 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/50 ,  H01L24/83 ,  H01L24/97 ,  H01L25/167 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/62 ,  H01L2224/83139 ,  H01L2224/83851 ,  H01L2224/83951 ,  H01L2224/95001 ,  H01L2224/95136 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/1515 ,  H01L2933/0066

Abstract: An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.