公开(公告)号：US20220279286A1

公开(公告)日：2022-09-01

申请号：US17747454

申请日：2022-05-18

Applicant: Vesper Technologies, Inc.

Inventor： Robert Littrell ,  Ronald Gagnon

IPC: H04R19/04 ,  H04R3/00 ,  H04R17/02 ,  H04R1/04 ,  H04R19/00

Abstract: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

公开(公告)号：US20220199893A1

公开(公告)日：2022-06-23

申请号：US17567719

申请日：2022-01-03

Applicant: Vesper Technologies Inc.

Inventor： Robert J. Littrell

IPC: H01L41/083 ,  H01L41/27 ,  H01L41/04 ,  B81B3/00 ,  B81C1/00 ,  C23C14/06 ,  C23C14/14 ,  C23C14/34 ,  C23C14/54 ,  H01L41/113 ,  H01L41/316 ,  H04R7/06 ,  H04R17/02 ,  H04R31/00

Abstract: A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second piezoelectric layer is a more compressive layer with an average stress that is less than or more compressive than an average stress of the first piezoelectric layer.

公开(公告)号：US11217741B2

公开(公告)日：2022-01-04

申请号：US15568553

申请日：2016-04-22

Applicant: Vesper Technologies Inc.

Inventor： Robert Littrell

IPC: H01L41/083 ,  H01L41/27 ,  H01L41/04 ,  B81B3/00 ,  B81C1/00 ,  C23C14/06 ,  C23C14/14 ,  C23C14/34 ,  C23C14/54 ,  H01L41/113 ,  H01L41/316 ,  H04R7/06 ,  H04R17/02 ,  H04R31/00

Abstract: A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second piezoelectric layer is a more compressive layer with an average stress that is less than or more compressive than an average stress of the first piezoelectric layer.

公开(公告)号：US20210383824A1

公开(公告)日：2021-12-09

申请号：US17339709

申请日：2021-06-04

Applicant: Vesper Technologies Inc.

Inventor： Roberto Condorelli ,  Lorenzo Ponzanelli ,  Shin Nagpal

IPC: G10L25/78 ,  G10L15/22 ,  H03G3/34

Abstract: Techniques for automatically muting or unmuting an acoustic transducer include receiving a signal representing an output by a voice accelerometer of a device, determining whether the signal is indicative of a presence or absence of voice activity by a user of the device, and generating a control signal that causes an acoustic transducer to be muted responsive to determining that the signal is indicative of an absence of voice activity by the user, or that causes the acoustic transducer to be unmuted response to determining that the signal is indicative of a presence of voice activity by the user.

公开(公告)号：US20210211809A1

公开(公告)日：2021-07-08

申请号：US17143934

申请日：2021-01-07

Applicant: Vesper Technologies, Inc.

Inventor： Craig Core ,  Hamid Basaeri ,  Robert Littrell

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/04 ,  H04R7/06

Abstract: A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

公开(公告)号：US10566517B1

公开(公告)日：2020-02-18

申请号：US14851560

申请日：2015-09-11

Applicant: Vesper Technologies Inc.

Inventor： Robert J. Littrell ,  Karl Grosh

IPC: H01L41/083 ,  H01L41/047 ,  B06B1/06 ,  H01L21/02

Abstract: A transducer comprising: at least one piezoelectric layer; a first patterned conductive layer that is patterned with a first opening; a second patterned conductive layer that is patterned with a second opening; wherein at least one piezoelectric layer is between the first and the second patterned conductive layers in a stack; and wherein a position of the first opening is staggered relative to a position of the second opening in the stack to mitigate an occurrence of crack propagation through the layers.

公开(公告)号：US20190289405A1

公开(公告)日：2019-09-19

申请号：US16353589

申请日：2019-03-14

Applicant: Vesper Technologies, Inc.

Inventor： Robert Littrell ,  Ronald Gagnon

IPC: H04R19/04 ,  H04R3/00 ,  H04R19/00 ,  H04R17/02 ,  H04R1/04

Abstract: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

公开(公告)号：US20190110132A1

公开(公告)日：2019-04-11

申请号：US15760868

申请日：2016-09-19

Applicant: Vesper Technologies Inc.

Inventor： Robert J Littrell

IPC: H04R17/02 ,  H01L41/27

Abstract: A transducer and method for processing a MEMS transducer. In one aspect, the MEMS transducer includes a first plate and a second plate. The MEMS transducer can also include a spring substantially between the first plate and the second plate, the spring including first and second spring arms dimensioned to decrease vertical deflection mismatch between the first and second plates, relative to vertical deflection mismatch of the first and second plates independent of the spring.

公开(公告)号：US20190098417A1

公开(公告)日：2019-03-28

申请号：US16081015

申请日：2017-02-28

Applicant: Vesper Technologies Inc.

Inventor： Robert J. Littrell ,  Ronald Gagnon ,  Karl Grosh

IPC: H04R17/02 ,  H04R3/04

Abstract: A device comprising: a sensor; and a first circuit configured to detect when an input stimulus to the sensor satisfies one or more detection criteria, and further configured to produce a signal upon detection that causes adjustment of performance of the device; and a second circuit for processing input following detection, wherein the second circuit is configured to increase its power level following detection, relative to a power level of the second circuit prior to detection.

公开(公告)号：US20170150248A1

公开(公告)日：2017-05-25

申请号：US15357075

申请日：2016-11-21

Applicant: Vesper Technologies Inc.

Inventor： Robert J. Littrell

IPC: H04R1/22 ,  H04R31/00

Abstract: A package comprises: a transducer; a substrate comprising an acoustic port, with the transducer attached to a surface of the substrate and over or adjacent to the acoustic port; and a venting mechanism for venting air or sound pressure from a device comprising the package, with the venting mechanism being affixed to the substrate and partially surrounding the acoustic port, and with the venting mechanism being dimensioned to filter out audio frequencies.