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公开(公告)号:US20170094390A1
公开(公告)日:2017-03-30
申请号:US15273683
申请日:2016-09-22
Applicant: Apple Inc.
Inventor: Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
CPC classification number: H04R1/1016 , A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , A45C2011/001 , A45C2013/026 , B65D25/02 , B65D43/16 , F16B2001/0035 , H01R13/521 , H02J7/0044 , H02J7/0047 , H02J7/025 , H02J7/027 , H02J2007/0096 , H04B1/385 , H04B1/3888 , H04B5/0037 , H04M1/6033 , H04R1/02 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/2857 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号:US11979703B2
公开(公告)日:2024-05-07
申请号:US17992332
申请日:2022-11-22
Applicant: APPLE INC.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , G01V3/08 , H01F7/02 , H04B1/38 , H04B1/3827 , H04R1/02 , H05K5/00 , H05K5/02 , H05K5/03
CPC classification number: H04R1/1016 , A45C11/00 , A45C13/005 , E05F1/1261 , E05F3/20 , G01V3/081 , H01F7/02 , H04R1/023 , H04R1/1041 , H04R1/1058 , H04R1/1091 , H05K5/0086 , H05K5/0217 , H05K5/0226 , H05K5/03 , A45C2011/001 , E05Y2201/224 , E05Y2900/602 , H04B1/38 , H04B2001/3866 , H04R1/1025 , H04R2400/11 , H04R2420/07 , H04R2460/11
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US20230301408A1
公开(公告)日:2023-09-28
申请号:US18197646
申请日:2023-05-15
Applicant: APPLE INC.
Inventor: Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H04R1/10 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00
CPC classification number: A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , B65D25/02 , B65D43/16 , H01R13/521 , H02J7/0044 , H02J50/10 , H04B1/3888 , H04B5/0037 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , A45C2011/001 , A45C2013/026 , H02J7/00034 , H04B1/385 , H04R2420/07 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号:US20230269509A1
公开(公告)日:2023-08-24
申请号:US17895025
申请日:2022-08-24
Applicant: APPLE INC.
Inventor: Benjamin A. Cousins , Robert Chun , Priyanka Venkatesh , Thanh P. Hua , Jarrett Lagler , Hanchi Chen
IPC: H04R1/10
CPC classification number: H04R1/1016 , H04R1/1058 , H04R2420/07
Abstract: A deformable ear tip comprising: an annular inner ear tip body having a sidewall extending between first and second opposing ends thereby defining a sound channel through the ear tip; an annular outer flange integrally formed with and surrounding the first end of the inner ear tip body and extending towards the inner ear tip second end forming an air gap between the annular inner ear tip body and the annular outer flange along a portion of a length of the ear tip, wherein the outer flange comprises a first material having a first durometer and is sized and shaped to be inserted into a human ear canal; and an inner flange integrally formed with the inner ear tip body and comprising a second material having a second durometer less than the first durometer, the inner flange body extending from a location along the inner ear tip body between the first and second ends towards an inner surface of the outer flange body.
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公开(公告)号:US11690428B2
公开(公告)日:2023-07-04
申请号:US17131610
申请日:2020-12-22
Applicant: Apple Inc.
Inventor: Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H04R1/10 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
CPC classification number: A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , B65D25/02 , B65D43/16 , H01R13/521 , H02J7/0044 , H02J50/10 , H04B1/3888 , H04B5/0037 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , A45C2011/001 , A45C2013/026 , F16B2001/0035 , H02J7/00034 , H04B1/385 , H04M1/6033 , H04R1/2857 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号:US20230088030A1
公开(公告)日:2023-03-23
申请号:US17992332
申请日:2022-11-22
Applicant: APPLE INC.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US20220103930A1
公开(公告)日:2022-03-31
申请号:US17242182
申请日:2021-04-27
Applicant: Apple Inc.
Inventor: Mei Zhang , Benjamin A. Cousins , Mohammad Soroush Ghahri Sarabi , Phillip Qian , Sean T. McIntosh , Michael B. Minerbi , Lee M. Panecki
IPC: H04R1/10
Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
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公开(公告)号:US11206472B2
公开(公告)日:2021-12-21
申请号:US16584920
申请日:2019-09-26
Applicant: Apple Inc.
Inventor: Benjamin A. Cousins , Esge Andersen , Mei Zhang , Brian R. Twehues , Ethan L. Huwe , Thanh P. Hua
IPC: H04R1/10 , H04R1/02 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04B1/38 , H04B1/3827
Abstract: Embodiments describe an acoustic shielding component including a stiffener formed of a rigid material providing structural integrity to the acoustic shielding component, a cosmetic mesh comprising a plurality of interlaced wires, and an acoustic mesh disposed between the stiffener and the cosmetic mesh. The stiffener includes first and second walls extending along a length of the stiffener and a plurality of ribs spaced apart from each other and extending between the first and second walls. The cosmetic mesh includes a mesh cover disposed over the stiffener and having an outer surface and an inner surface, and a mesh wall extending from an outer periphery of the inner surface of the mesh cover and defining a tab.
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公开(公告)号:US20210211796A1
公开(公告)日:2021-07-08
申请号:US17207497
申请日:2021-03-19
Applicant: Apple Inc.
Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
IPC: H04R1/10 , G01V3/08 , A45C11/00 , A45C13/00 , E05F1/12 , E05F3/20 , H01F7/02 , H05K5/00 , H05K5/02 , H05K5/03 , H04R1/02
Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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公开(公告)号:US10944156B2
公开(公告)日:2021-03-09
申请号:US15721532
申请日:2017-09-29
Applicant: Apple Inc.
Inventor: Benjamin A. Cousins , Carlo Di Nallo , Ethan L. Huwe , Jerzy S. Guterman , Joachim S. Hammerschmidt , Mattia Pascolini , Ruben Caballero , Samuel G. Parker
Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
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