公开(公告)号：US20210211796A1

公开(公告)日：2021-07-08

申请号：US17207497

申请日：2021-03-19

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20210099778A1

公开(公告)日：2021-04-01

申请号：US16901937

申请日：2020-06-15

Applicant: Apple Inc.

Inventor： Thanh P. Hua ,  Jarrett B. Lagler ,  Brian R. Twehues ,  Ethan L. Huwe ,  Mei Zhang

IPC: H04R1/02

Abstract: An acoustic mesh comprising a first portion that is acoustically closed; and a second portion that surrounds the first portion and is acoustically open, wherein a surface area of the second portion is at least one percent a total surface area of the acoustic mesh.

公开(公告)号：US10944156B2

公开(公告)日：2021-03-09

申请号：US15721532

申请日：2017-09-29

Applicant: Apple Inc.

Inventor： Benjamin A. Cousins ,  Carlo Di Nallo ,  Ethan L. Huwe ,  Jerzy S. Guterman ,  Joachim S. Hammerschmidt ,  Mattia Pascolini ,  Ruben Caballero ,  Samuel G. Parker

IPC: H01Q1/27 ,  H01Q9/04 ,  H04B1/3827 ,  H04R1/10 ,  H01Q9/42 ,  H01Q21/30 ,  H01Q7/00

Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.

公开(公告)号：US10834497B2

公开(公告)日：2020-11-10

申请号：US15613079

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Ethan L. Huwe ,  Glenn K. Trainer

IPC: H04R25/00 ,  H04R1/28 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20200314519A1

公开(公告)日：2020-10-01

申请号：US16584940

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US10771879B2

公开(公告)日：2020-09-08

申请号：US16780881

申请日：2020-02-03

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/00 ,  H04R1/10

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US10728652B2

公开(公告)日：2020-07-28

申请号：US16375735

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Jason C. Della Rosa ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Erik L. Wang ,  Christopher J. Stringer ,  Molly J. Anderson

IPC: H04R1/28 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US10694276B2

公开(公告)日：2020-06-23

申请号：US16748464

申请日：2020-01-21

Applicant: Apple Inc.

Inventor： Glenn K. Trainer ,  Scott C. Grinker ,  Ethan L. Huwe ,  Craig M. Stanley

IPC: H04R1/00 ,  H04R1/10 ,  G10K11/178 ,  H04R11/02 ,  H04R5/04 ,  H04R1/26 ,  H04R5/033

Abstract: A low-profile earbud is disclosed that sits securely within an ear of a user. The earbud includes a protruding portion that passes through a channel defined by the tragus and anti-tragus of the ear. In some embodiments, the protruding portion can take the form of a cable configured to supply power and transfer data to the earbud. In some embodiments, the protruding portion can provide additional space for electrical components and sensors supporting the earbud.

公开(公告)号：US10595113B2

公开(公告)日：2020-03-17

申请号：US16148552

申请日：2018-10-01

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

IPC: H04R1/00 ,  H04R1/10

Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

公开(公告)号：US10587950B2

公开(公告)日：2020-03-10

申请号：US15613060

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Ethan L. Huwe ,  John H. Sheerin ,  Glenn K. Trainer

IPC: H04R1/28 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.