Receptacle for connecting to flexible circuit board

    公开(公告)号:US09888571B2

    公开(公告)日:2018-02-06

    申请号:US14641316

    申请日:2015-03-07

    Applicant: Apple Inc.

    Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.

    Electronic device structures joined using shrinking and expanding attachment structures
    52.
    发明授权
    Electronic device structures joined using shrinking and expanding attachment structures 有权
    使用收缩和扩展的附接结构连接的电子装置结构

    公开(公告)号:US09454188B2

    公开(公告)日:2016-09-27

    申请号:US14295051

    申请日:2014-06-03

    Applicant: Apple Inc.

    Abstract: An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.

    Abstract translation: 电子设备具有使用附接结构组装的结构。 附件结构改变形状以帮助将电子设备结构连接在一起。 可以连接在一起的结构可以包括电子设备外壳结构,显示结构,内部设备部件,电气部件以及电子设备的其它部分。 附接结构可以包括热激活附着结构,使用其他类型的施加能量激活的结构,以及由于施加化学物质或其它处理而改变形状的结构。

    Head mountable display
    53.
    发明授权

    公开(公告)号:US12238909B2

    公开(公告)日:2025-02-25

    申请号:US18478596

    申请日:2023-09-29

    Applicant: Apple Inc.

    Abstract: An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.

    WIRE LOCK SYSTEM
    54.
    发明申请

    公开(公告)号:US20240427375A1

    公开(公告)日:2024-12-26

    申请号:US18510500

    申请日:2023-11-15

    Applicant: Apple Inc.

    Abstract: A wearable apparatus includes a head-mountable display frame, a first mechanical stop, a cover glass, a second mechanical stop, and a cable. The head-mountable display frame includes a first interface portion defining a first channel. The first mechanical stop is defined by the head-mountable display frame. The cover glass is attachable to the head-mountable display frame and includes a second interface portion defining a second channel. The second mechanical stop is defined by the cover glass, and is positionable against the first mechanical stop when the first interface portion is mated to the second interface portion, and the first interface portion and the second interface portion define a lumen. The cable is disposed along at least a portion of the lumen.

    Head-mounted electronic device
    57.
    发明授权

    公开(公告)号:US12140770B2

    公开(公告)日:2024-11-12

    申请号:US18480958

    申请日:2023-10-04

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.

    Integrated fan and heat sink for head-mountable device

    公开(公告)号:US11716829B1

    公开(公告)日:2023-08-01

    申请号:US17165763

    申请日:2021-02-02

    Applicant: Apple Inc.

    CPC classification number: H05K7/20136 H05K7/2039

    Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

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