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    Integrated fan and heat sink for head-mountable device
    54.
    发明授权
    Integrated fan and heat sink for head-mountable device 有权

    公开(公告)号：US11716829B1

    公开(公告)日：2023-08-01

    申请号：US17165763

    申请日：2021-02-02

    Applicant: Apple Inc.

    Inventor： Cheng P. Tan ,  Sivesh Selvakumar ,  Jesse T. Dybenko ,  Enoch Mylabathula ,  Jason C. Sauers ,  Phil M. Hobson ,  Laura M. Campo ,  Dragos Moroianu

    IPC: H05K7/20

    CPC classification number: H05K7/20136 ,  H05K7/2039

    Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

    Cooling and noise control for head-mounted device
    55.
    发明授权
    Cooling and noise control for head-mounted device 有权

    公开(公告)号：US11218824B1

    公开(公告)日：2022-01-04

    申请号：US16752508

    申请日：2020-01-24

    Applicant: Apple Inc.

    Inventor： Edward S. Huo ,  Trevor J. Ness ,  Sivesh Selvakumar ,  Anna V. Mirabella ,  Phil M. Hobson

    IPC: H04R29/00 ,  H04R1/08 ,  H04R1/10 ,  G10L25/21 ,  G06F3/16 ,  H05K7/20 ,  G10L25/51

    Abstract: A head-mounted device can effectively manage heat while also managing noise output levels in a manner that preserves the user's desired experience with the head-mounted device. The head-mounted device can manage sound levels of a cooling system based on detected a sound level of ambient noise in a vicinity of the head-mounted device. For example, the head-mounted device can operate a fan at a speed that produces noise at a sound level that is low enough to be masked by the ambient noise perceived by the user. By further example, the sound level of a cooling system can be based on a sound level of a speaker of the head-mounted device providing audio to the user. By further example, other operational parameters of a cooling system can be controlled to manage noise at a sound level that is sufficiently low.

    Electronic Devices with Antennas and Optical Components
    56.
    发明申请
    Electronic Devices with Antennas and Optical Components 有权

    公开(公告)号：US20210333823A1

    公开(公告)日：2021-10-28

    申请号：US17206010

    申请日：2021-03-18

    Applicant: Apple Inc.

    Inventor： Ivan S. Maric ,  Anthony S. Montevirgen ,  Evan D. Christensen ,  Lijun Zhang ,  Phil M. Hobson ,  Samuel A. Resnick ,  Yi Jiang

    IPC: G06F1/16 ,  H04N5/247 ,  H04N5/225 ,  H01Q1/40 ,  H01Q1/38 ,  G02B7/12

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a frame with left and right openings that receive respective left and right optical modules that present images to a user's eyes. Each optical module may have a lens and display that presents an image through the lens. Camera support members may be coupled to respective left and right peripheral portions of the frame. Each camera support member may have openings configured to receive cameras. Antennas may be formed on a camera support member. The antennas may have metal traces on a surface of the camera support member, may have conductive structures embedded within the camera support member, and/or may have patterned metal traces on printed circuits attached to or embedded in the camera support member. The cameras may operate through portions of a display cover layer that covers an outwardly-facing display on the head-mounted housing.

    Head-Mounted Electronic Device
    57.
    发明申请
    Head-Mounted Electronic Device 有权

    公开(公告)号：US20210325680A1

    公开(公告)日：2021-10-21

    申请号：US17185715

    申请日：2021-02-25

    Applicant: Apple Inc.

    Inventor： Ivan S. Maric ,  Aidan N. Zimmerman ,  Brian Baillargeon ,  Evan D. Christensen ,  Jason C. Sauers ,  Jia Tao ,  Phil M. Hobson ,  Sivesh Selvakumar

    IPC: G02B27/01 ,  G02C5/02 ,  G02C9/00

    Abstract: A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.

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