Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming insulated films having low dielectric constants and excellent mechanical strengths and used for interlayer films for electronic devices and the like, to provide a method for producing the same, to provide an interlayer insulated film for an electronic device and obtained from the composition, and to provide an electronic device using the insulated film as a layer-constituting layer. SOLUTION: This method for producing a carbon-carbon triple bond-having compound is characterized by polymerizing the compound in a reaction process including (1) a process for heating a reaction solution containing the carbon-carbon triple bond-having compound at least at a radical-generating temperature of the radical-generating agent and (2) a process for adding a liquid containing a radical-generating agent to the reaction solution. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a resin for photosensitive composition, from which high molecular weight component is removed, by a simple method and to provide a resin for resist produced by the method and a resist composition in which development defect and pattern collapse are improved by using the resin for resist and to provide a pattern-forming method using the resin for resist. SOLUTION: The method for producing the resin for photosensitive composition comprises a step for depositing a high-molecular weight component of the resin by bringing a resin solution in which the resin is dissolved in a solvent into contact with a solvent having low ability to dissolve the resin and removing the high-molecular weight component to provide the resin solution from which the high-molecular weight component is removed. The resin for resist is produced by the above method. The resist composition improved in development defect and pattern collapse is obtained by using the resin for resist produced by the method. The pattern-forming method is obtained by using the resist composition. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for efficiently producing a resin for resist without reducing resist properties, to provide the resin for the resist produced by the production method, to provide a resist composition having improved resolution and exposure latitude, and to provide a method for forming a pattern by using the resist composition. SOLUTION: The method for producing the resin for the resist involves a step for adding a solvent having a lower capacity for dissolving the resin to a resin solution to precipitate the powdery resin and collecting the powdery resin. The resin for the resist produced by the production method, the resist composition containing the resin for the resist, and the method for forming the pattern by using the resist are also provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photosensitive composition that is used for processes of manufacturing semiconductors such as an IC, manufacturing circuit boards of liquid crystals, thermal heads or the like and for other photofabrication processes, and to provide a patterning method that uses the composition, wherein superior line width roughness (LWR) performance can be obtained. SOLUTION: The positive photosensitive composition comprises (A) a compound which generates acid by the irradiation of active rays or radiation; (B1) a resin, having a repeating unit having a polycyclic aliphatic group which is decomposed by acid to generate an alkali soluble group; and (B2) a resin, having a repeating unit that has a predetermined lactone structure and a repeating unit, having a monocyclic aliphatic group which is decomposed by acid and generates an alkali soluble group. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition for use in the production process of a semiconductor, such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern forming method, using the positive resist composition, which are a positive resist composition capable of satisfying both of improvement of exposure latitude (EL) and pattern collapse and scum-preventing properties on a high level and a pattern-forming method by using the positive resist composition. SOLUTION: The positive resist composition comprises (A) a resin comprising at least two kinds of repeating units, having a cyano group, at least one of which is a repeating unit (A1) further having a lactone structure, and, having solubility in an alkali developer, increased by the action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The pattern forming method using the positive resist composition is also provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method achieving excellent sensitivity, resolving power, LWR (line width roughness) and a pattern shape in forming a fine pattern having a line width of 60 nm or less, and to provide a composition kit, a resist film using the kit, a method for manufacturing an electronic device, and an electronic device.SOLUTION: The pattern forming method includes the steps of: (1) forming a film on a substrate by using an electron beam-sensitive or extreme ultraviolet ray-sensitive resin composition; (2) forming a topcoat layer on the above film by using a topcoat composition comprising a resin (T) having at least one of repeating units expressed by general formulae (I-1) to (I-5) shown below; (3) exposing the film with the topcoat layer by using an electron beam or an extreme ultraviolet ray; and (4) developing the film with the topcoat layer after exposure to form a pattern.
Abstract:
PROBLEM TO BE SOLVED: To provide: an actinic ray-sensitive or radiation-sensitive resin composition excellent in DOF and pattern roughness characteristics such as LWR without much deterioration in performance over time; an actinic ray-sensitive or radiation-sensitive film and a pattern formation method which use the composition; and an electronic device manufacturing method and an electronic device.SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin whose solubility in an alkaline developer is increased by the action of an acid, (B) a compound which is represented by the specified general formula (1) and generates an acid upon exposure to an actinic ray or radiation, and (C) a low molecular weight compound having on a nitrogen atom a group leaving by the action of an acid. (The meaning of each symbol in the formula is described in the claims.)
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition, capable of forming a resist film that is excellent in a pattern cross-sectional shape and in suppressing occurrence of pattern collapse and defects attributed to residual water and is never deteriorated in performance of suppressing occurrence of the defects attributed to residual water and obtaining the excellent pattern cross-sectional shape even when the resist film is produced by using a resist solution left to stand for a certain time, to provide a resist film formed by using the composition, a pattern forming method using the composition, and to provide a method for manufacturing an electronic device and an electronic device.SOLUTION: There is provided an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin having a repeating unit expressed by general formula (1) and a repeating unit that is decomposed by an action of an acid to generate an alkali-soluble group; (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) a resin having at least any of a fluorine atom and a silicon atom. In general formula (1), L represents a single bond or a divalent connecting group, and Z represents a cyclic acid anhydride group.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition allowing formation of a resist pattern showing further excellent development defect prevention performance compared to a conventional composition, fewer blob defects and an excellent profile, and to provide a resist film, a pattern forming method, a method for manufacturing an electronic device and an electronic device using the composition.SOLUTION: The actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin having a cyclic carbonic acid ester structure, and decomposed by an action of an acid to increase the solubility with an alkali developing solution, and (B) a compound expressed by following general formula (B-I), generating an acid by irradiation with actinic rays or radiation. The composition is used for the resist film, the pattern forming method, the method for manufacturing an electronic device, and the electronic device. In general formula (B-I), Rrepresents a monovalent substituent having carbon number of one or more; and Mrepresents a sulfonium cation or an iodonium cation.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray sensitive or radiation sensitive resin composition that is highly sensitive, capable of suppressing a pattern collapse after development and has a large residual film ratio, and to provide a resist film, a pattern forming method, a method for manufacturing an electronic device, and an electronic device using the same.SOLUTION: There is provided a pattern forming method including the steps of: (1) forming a film using an electron beam sensitive or extreme ultraviolet ray sensitive resin composition including, (A) a resin including a repeating unit having a partial structure represented by the following general formula (A0) in which a solubility of the resin in a developer having an organic solvent is decreased by an action of an acid, and (B) a compound that generates an acid by irradiation with an electron beam or an extreme ultraviolet ray; (2) exposing the film using the electron beam or the extreme ultraviolet ray; and (4) developing the exposed film using a developer having an organic solvent after exposure to form a negative pattern. In the general formula, Ar represents an aromatic ring group that links with a main chain of the resin (A) directly or indirectly, and, Rrepresents a hydrogen atom or a group to be eliminated by an action of an acid.