TURBINE COMPONENT SURFACE COOLING SYSTEM WITH PASSIVE FLOW MODULATION
    51.
    发明申请
    TURBINE COMPONENT SURFACE COOLING SYSTEM WITH PASSIVE FLOW MODULATION 审中-公开
    具有被动流量调节的涡轮组件表面冷却系统

    公开(公告)号:US20170044914A1

    公开(公告)日:2017-02-16

    申请号:US14825553

    申请日:2015-08-13

    Abstract: A system according to various embodiments includes: a cooling network within a turbine component, the cooling network including at least one passageway fluidly connected with a surface of the turbine component; a cooling fluid source for providing a cooling fluid to the cooling network; and a temperature-actuated flow modulating device fluidly connected with the cooling fluid source and the cooling network, the temperature-actuated flow modulating device configured to: detect an ambient air temperature proximate the turbine component; and control a flow of the cooling fluid to the cooling network based upon the detected ambient air temperature.

    Abstract translation: 根据各种实施例的系统包括:在涡轮机部件内的冷却网络,所述冷却网络包括与涡轮机部件的表面流体连接的至少一个通道; 用于向冷却网络提供冷却流体的冷却流体源; 温度致动的流量调节装置,其被配置为:检测靠近所述涡轮机部件的环境空气温度;以及温度致动的流量调节装置,其与所述冷却流体源和所述冷却网络流体连接。 并且基于检测到的环境空气温度来控制冷却流体流向冷却网络的流动。

    HOT GAS PATH COMPONENT HAVING CAST-IN FEATURES FOR NEAR WALL COOLING
    52.
    发明申请
    HOT GAS PATH COMPONENT HAVING CAST-IN FEATURES FOR NEAR WALL COOLING 有权
    具有连接墙壁冷却功能的热气路径组件

    公开(公告)号:US20160363053A1

    公开(公告)日:2016-12-15

    申请号:US14739791

    申请日:2015-06-15

    Abstract: A hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface of the substrate defines at least one interior space. At least a portion of the outer surface of the substrate includes a recess formed therein. The recess includes a bottom surface and a groove extending at least partially along the bottom surface of the recess. A cover is disposed within the recess and covers at least a portion of the groove. The groove is configured to channel a cooling fluid therethrough to cool the cover.

    Abstract translation: 热气体路径部件包括具有外表面和内表面的基板。 衬底的内表面限定至少一个内部空间。 衬底的外表面的至少一部分包括形成在其中的凹部。 凹部包括底面和至少部分地沿着凹部的底表面延伸的凹槽。 盖子设置在凹槽内并覆盖凹槽的至少一部分。 凹槽构造成将冷却流体通过其中以冷却盖。

    Method of forming a microchannel cooled component
    58.
    发明授权
    Method of forming a microchannel cooled component 有权
    形成微通道冷却部件的方法

    公开(公告)号:US09015944B2

    公开(公告)日:2015-04-28

    申请号:US13774275

    申请日:2013-02-22

    Abstract: A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate.

    Abstract translation: 提供了形成微通道冷却部件的方法。 该方法包括在相对平面的板的表面内形成至少一个微通道。 该方法还包括将相对平坦的覆盖部件放置在其上形成有至少一个微通道的表面上。 该方法还包括将相对平坦的盖构件粘附到相对平面的板上。 该方法还包括通过用相对平面的覆盖构件将成形部件按压至少一部分将相对平面的盖构件粘附到相对平面的板的时间段来弯曲微通道冷却部件。

    TURBINE COMPONENT WITH HEATED STRUCTURE TO REDUCE THERMAL STRESS

    公开(公告)号:US20230399959A1

    公开(公告)日:2023-12-14

    申请号:US17806317

    申请日:2022-06-10

    CPC classification number: F01D25/08 F01D5/12 F05D2220/30 F05D2260/941

    Abstract: A turbine component includes a first structure exposed to a hot gas path and a second structure integral with the first structure but isolated from the hot gas path. A first fluid passage in the first structure delivers a thermal transfer fluid, e.g., air, through the first structure to cool the first structure. A second fluid passage is defined within the second structure and is in fluid communication with the first fluid passage. After heat transfer in the first structure, the thermal transfer fluid is hotter than a temperature of the second structure and thus increases the temperature of the second structure. The heat transfer to the second structure reduces a temperature difference between the first structure and the second structure that would, without heating, cause thermal stress between the structures. The heating of the second structure reduces the need for early maintenance and lengthens the lifespan of the component.

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