公开(公告)号：DE10058861A1

公开(公告)日：2002-06-13

申请号：DE10058861

申请日：2000-11-27

Applicant: SIEMENS AG ,  INFINEON TECHNOLOGIES AG

Inventor： RAINER DR ,  KOLB STEFAN ,  PITZER DANA ,  PRIMIG ROBERT ,  SCHREITER MATTHIAS ,  WINKLER BERNHARD

IPC: H01L27/146 ,  B81B1/00 ,  G02B26/08 ,  H01L31/09 ,  H01L37/00 ,  H04N1/00

公开(公告)号：DE10058864A1

公开(公告)日：2002-06-06

申请号：DE10058864

申请日：2000-11-27

Applicant: SIEMENS AG ,  INFINEON TECHNOLOGIES AG

Inventor： RAINER DR ,  KOLB STEFAN ,  PITZER DANA ,  PRIMIG ROBERT ,  SCHREITER MATTHIAS ,  WINKLER BERNHARD

IPC: B81B3/00 ,  B81C1/00 ,  B81B7/00 ,  H01L31/09 ,  H01L37/00

Abstract: Production of a micromechanical structure comprises preparing a substrate (1) having evaluation electronics or their components and provided with contact surfaces (2); applying an auxiliary layer (4) and a membrane (5) as a layer sequence to the substrate to cover the contact surfaces; inserting metal structures (6a) into the auxiliary layer so that they touch the contact surfaces; and selectively etching the auxiliary layer. An Independent claim is also included for the micromechanical structure produced. Preferred Features: A passivating layer (3) is applied to the substrate before the auxiliary layer is applied. A contact hole (5a) is etched through the layer sequence. The metal structures are made from tungsten.