Abstract:
There is provided a method of manufacturing a group-III nitride crystal in which a nitrogen plasma is brought into contact with a melt containing a group-III element and an alkali metal to grow the group-III nitride crystal. Furthermore, there is also provided a method of manufacturing a group-III nitride crystal in which the group-III nitride crystal is grown on a substrate placed in a melt containing a group-III element and an alkali metal, with a minimal distance between a surface of the melt and a surface of the substrate set to be at most 50 mm.
Abstract:
A Si3N4 composite substrate which manifests no generation of cracking on the substrate even by mechanical shock or thermal shock, and is excellent in heat radiation property and heat-cycle-resistance property is obtained by using a Si3N4 substrate as a ceramic substrate. A Si3N4 substrate having a thermal conductivity of 90 W/m·K or more and a three-point flexural strength of 700 MPa or more is used, and the thickness tm of a metal layer connected on one major surface of the substrate and the thickness tc of the Si3N4 substrate are controlled so as to satisfy the relation formula: 2 tm≦tc≦20 tm. When metal layers are connected to both major surfaces of the Si3N4 substrate, the thickness tc and the total thickness ttm of the metal layers on both major surfaces are controlled so as to satisfy the relation formula: ttm≦tc≦10 ttm.
Abstract translation:通过使用Si 3 N 4基板作为陶瓷基板,可以获得表现出在机械冲击或热冲击下也不会在基板上产生裂纹的Si 3 N 4复合基板,并且具有优异的散热性和耐热循环性。 使用热导率为90W / mK以上,三点弯曲强度为700MPa以上的Si 3 N 4基板,连接在基板的一个主表面上的金属层的厚度tm和厚度tc 控制Si 3 N 4衬底以满足关系式:2tm <= tc <= 20tm。 当金属层连接到Si3N4基板的两个主表面时,控制两个主表面上的金属层的厚度tc和总厚度ttm,以满足关系式:ttm <= tc <= 10ttm。
Abstract:
As a wavelength conversion crystal whose double refraction index is controllable, a crystal represented by a formula (I), M1xM21−xCa4O(BL3)3, where each of M1 and M2 represents one or more types of different rare earth elements and 0
Abstract:
A feed pipe 26 for a sealing water is connected to a housing of the pump to communicate with an enclosed chamber which is defined between a position in which a helical seal line of screw rotors 17 isolates the enclosed chamber from a suction port 15 of the pump and another position in which the enclosed chamber begins to open to a discharge port 24. Alternatively, a feed pipe for the sealing water is connected to the suction port 15 of the vacuum pump, and the feed pipe 26 is provided with a valve V which opens when the suction pressure of the sealing water becomes lower than −380 mmHg.
Abstract:
A discharge side housing 3 has a third cooling water chamber 19 communicating with a first cooling water chamber 7 of a main housing 1 through a cooling water passage 26. The third cooling water chamber 19 is connected to a cooling water outlet pipe 27 which is connected to an inlet port 28a of a three-way valve 28. The three-way valve 28 has a switching port 28b which can communicate with a pipe line 29 connected to the first cooling water chamber 7. The three-way valve 28 has an outlet 28c connected to a pipe line 30 which communicates with a second cooling water chamber 22 of a suction side housing 2. The second cooling water chamber 22 is connected to a cooling water discharge line 31 provided with a flow control valve 32 allowing a back pressure for a cooling water flowing thereinto.
Abstract:
There are provided a process for forming a silicon nitride sintered body, encompassing a sialon sintered body, by making much of the superplasticity of the sintered body intact as a simple material without formation thereof into a composite material, and a formed sintered body produced by the foregoing process. A silicon nitride sintered body (encompassing a sialon sintered body) having a relative density of at least 95% and a linear density of 120 to 250 in terms of the number of grains per 50 .mu.m in length in a two-dimensional cross section of the sintered body is formed through plastic deformation thereof at a strain rate of at most 10.sup.-1 /sec under a tensile or compressive pressure at a temperature of 1,300 to 1,700.degree. C. The formed sintered body has a degree of orientation of 5 to 80% as examined according to a method specified by Saltykov, a linear density of 80 to 200, and excellent mechanical properties especially at ordinary temperatures.
Abstract:
The strength of a composite sintered body including yttrium oxide is improved. A composite ceramics sintered body includes a matrix of yttrium oxide and silicon carbide particles dispersed within the matrix. A compound oxide phase including yttrium and silicon is present at the surface of the sintered body. A sintered body is obtained by compression-molding mixed powder including yttrium oxide powder and silicon carbide powder in an inert gas atmosphere of at least 1550.degree. C. The sintered body is subjected to a heat treatment for at least 0.5 hour and not more than 12 hours in an atmosphere including oxygen gas in the range of at least 900.degree. C. and less than 1200.degree. C.
Abstract:
A production method is provided in which Group-III-element nitride single crystals that have a lower dislocation density and a uniform thickness and are transparent, high quality, large, and bulk crystals can be produced with a high yield. The method for producing Group-III-element nitride single crystals includes: heating a reaction vessel containing at least one metal element selected from the group consisting of an alkali metal and an alkaline-earth metal and at least one Group III element selected from the group consisting of gallium (Ga), aluminum (Al), and indium (In) to prepare a flux of the metal element; and feeding nitrogen-containing gas into the reaction vessel and thereby allowing the Group III element and nitrogen to react with each other in the flux to grow Group-III-element nitride single crystals, wherein the single crystals are grown, with the flux being stirred by rocking the reaction vessel, for instance.
Abstract:
A method of manufacturing group III-nitride semiconductor crystal includes the steps of accommodating an alloy containing at least a group III-metal element and an alkali metal element in a reactor, introducing a nitrogen-containing substance in the reactor, dissolving the nitrogen-containing substance in an alloy melt in which the alloy has been melted, and growing group III-nitride semiconductor crystal is provided. The group III-nitride semiconductor crystal attaining a small absorption coefficient and an efficient method of manufacturing the same, as well as a group III-nitride semiconductor device attaining high light emission intensity can thus be provided.
Abstract:
There is provided a transparent polycrystalline spinel substrate characterized in having a transmittance of 0.005% or less in a crossed Nicol system at a thickness of 1 mm and a wavelength of 450 nm, which does not generate image blurring or light-dark change when used in optical products. There is also provided a method for producing the transparent polycrystalline spinel substrate comprising a step for preparing a spinel powder, a step for molding the spinel powder and producing a spinel formed body, a step for sintering the spinel formed body and producing a spinel sintered body, and a step for subjecting the spinel sintered body to hot isostatic pressing (HIP) and producing a spinel polycrystalline body. There is further provided a liquid crystal projector and a receiver for rear-projection television having the aforementioned transparent polycrystalline spinel substrate.