Abstract:
PURPOSE:To provide a growth method for a p-type II-VI compound semiconductor whose p-type controllability is good and doping concentration, that is, acceptor concentration of sodium, etc., as acceptor impurities is enough high by using p-type dopant consisting of sodium dipivaloylmethanate, etc. CONSTITUTION:Since sodium dipivaloylmethanate, potassium di- pivaloylmethanate or lithium dipivaloylmethanate used as p-type dopant can acquire enough high vapor pressure by sublimation even at a temperature
Abstract:
PURPOSE:To provide a growth method for a p-type II-IV compound semiconductor whose acceptor concentration is enough high. CONSTITUTION:When a p-type II-VI compound semiconductor such as p-type ZnSe is formed by a metal organic chemical vapor deposition or a molecular beam epitaxy using raw gas material, organic compound such as diisopropyl amine wherein at least one nitrogen atom is contained and at least two groups whose molar weight is at least 12, properly larger than 36 are bonded to the nitrogen atom is used as p-type dopant.
Abstract:
PURPOSE:To grow p or n type II-VI group compound semiconductor in sufficiently high acceptor or donor concentration. CONSTITUTION:A p type ZnSe layer can be grown by alternately repeating the following two steps i.e., the first step of simultaneously feeding Zn material as II group element, Se material as VI group material and N dopant as an acceptor impurities to a reaction tube of an MOCVD device alltogether to form ZnSe:N layer 24 and the second step of forming the Zn and N adsorbed layer 23 when the feeding of Se material is stopped while the feeding of Zn material and N dopant is being kept on.
Abstract:
PURPOSE:To provide a semiconductor laser which has reduced astigmatism or is free from astigmatism, a semiconductor laser which can condense projected laser light outside the semiconductor laser or a semiconductor laser which can emits laser light without directivity. CONSTITUTION:The device is provided with a first resonator edge face 14 consisting of a projection surface and a second resonator edge face 16 consisting of a recessed surface or a plane provided to both ends of an active layer 10. In the device, a length of the first resonator edge face parallel to the active layer is made longer than that of the second resonator edge face parallel to the active layer.
Abstract:
PROBLEM TO BE SOLVED: To solve problems caused from a thick optical lens constituted integrally with a solid imaging apparatus.SOLUTION: Compared to the optical length (lens length), a relatively thin alternate arrangement layer 2 includes a high refractive index layer 21 having a larger refractive index and a low refractive index layer 20 having a smaller refractive index arranged alternately in a lateral direction with respect to an optical axis. The width of the high refractive index layer 21 and the low refractive index layer 20 is set to be equal to or less than a wavelength order of an incident light. The high refractive index layers 21 are disposed densely in a mechanical central area of the alternate arrangement layer 2A and gets sparsely as away from the center; or the lower refractive index layer 20 are dispose sparsely in a mechanical central area of the alternate arrangement layer 2A and gets densely as away from the center symmetric laterally to form a convex lens. Since the alternate arrangement layer 2A is shorter than the optical length, the alternate arrangement layer 2A can be formed thinner than a refraction type lens structure utilizing the Snell's law. The problems which occur on conventional lenses having relatively thick structure can be reduced or eliminated.
Abstract:
PROBLEM TO BE SOLVED: To provide a solid state image pickup device and an electronic apparatus, capable of easily providing reduced size and preventing generation of noise to suppress an occurrence of failures such as deterioration in an image quality of a picked-up image.SOLUTION: A photoelectric conversion film 13 formed to shield incident light H is provided to be closer to a side where the incident light H enters than a readout circuit 51 and n-type impurity regions 12, 411 in a silicon substrate 11. Thereby, the incident light H entering the readout circuit 51 and the n-type impurity regions 12, 411 is shielded by the photoelectric conversion film 13.
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state imaging device that suppresses a dark current and has increased sensitivity by having a photoelectric conversion film with good crystallinity and a high coefficient of light absorption. SOLUTION: A solid-state imaging device includes, on a silicon substrate 11, the photoelectric conversion film 13 composed of a chalcopyrite-based compound semiconductor comprising: a lattice-matched copper-aluminum-gallium-indium-sulfur-selenium(CuAlGaInSSe)-based mixed crystal; or a copper-aluminum-gallium-indium-zinc-sulfur-selenium(CuAlGaInZnSSe)-based mixed crystal. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state imaging device, capable of improving the efficiency of production or the like, and capable of enhancing the image quality of a sensed image, to provide a method of manufacturing the solid-state imaging device, and to provide an electronic apparatus. SOLUTION: A microlens 140 is formed so that a vertical section (an xz surface) as a vertical surface to an imaging surface (an xy surface) is formed in a rectangular shape. A first refractive-index layer 141 is formed of a material having a high refractive index (such as n1=1.7) in the microlens 140 in this case. A second refractive-index layer 142 is formed of the material having a low refractive index (such as n2=1.45) different from the first refractive-index layer 141. In the vertical section (the xz surface) of the microlens 140, an interface between the first refractive-index layer 141 and the second refractive-index layer 142 is formed along the vertical direction (z) to the imaging surface (the xy surface). COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve the effect of a correcting operation process for improving sensitivity and improving color reproduction using components on the long wavelength side. SOLUTION: In a solid-state imaging apparatus, the effective region of an infrared detection pixel is formed to a place deeper than the effective region of a visible light detection pixel. In the effective region of pixels in the depth direction from the surface of an N type semiconductor substrate, modulation doping is executed so that the concentration of N type dopants becomes lower as getting deeper from the surface side of the semiconductor substrate. P type dopants are executed so that the peak position of the concentration of the P type dopants becomes deeper than the peak position of the concentration of the N type dopants. In the solid-state imaging apparatus, since light reception sensitivity on the long wavelength side is improved, a sufficient correction result using the components on the long wavelength side is obtained to improve sensitivity and color reproduction. COPYRIGHT: (C)2009,JPO&INPIT