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公开(公告)号：JP2003006602A
公开(公告)日：2003-01-10
申请号：JP2001190239
申请日：2001-06-22
Applicant: Toppan Forms Co Ltd , トッパン・フォームズ株式会社
Inventor： MARUYAMA TORU , ENDO YASUHIRO , NAOI SHINGO
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming RF-ID media, with which an electric connection is not cut off even when external forces are concentrated to a conductive part for connection by strongly conducting and bonding an interposer with packaged IC chip and an antenna holder.
SOLUTION: A base material is provided with a conductive pattern equipped with the conductive part for connection at least, the interposer with packaged IC chip is formed by packaging an IC chip in the conductive part for connection, and the antenna holder is formed by providing the base material with the conductive pattern composed of an antenna conducting part and the conductive part for connection positioned at the terminal part of this antenna conducting part. Then, an insulating adhesive agent is applied to an area except the conductive part for connection, the interposer and the antenna holder are overlapped so that the respective conductive parts for connection can face each other, and the interposer and the antenna holder are conducted and bonded by using the insulating adhesive agent.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种用于形成RF-ID介质的方法，即使外部力集中到用于连接的导电部分的电连接也不会被切断，通过强力导通和将具有封装的IC芯片的插入件和 天线架。 解决方案：至少配置有配备有用于连接的导电部件的导电图案的基材，具有封装IC芯片的插入件通过将IC芯片封装在用于连接的导电部件中而形成，并且天线保持器通过提供 基底材料，其导电图案由天线导电部件和用于连接的导电部件构成，该导电部件位于该天线导电部件的端子部分。 然后，将绝缘粘合剂施加到除了用于连接的导电部分之外的区域，插入器和天线保持器重叠，使得各个用于连接的导电部件可以彼此面对，并且插入器和天线保持器被导通和接合 通过使用绝缘粘合剂。
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公开(公告)号：JP2003006595A
公开(公告)日：2003-01-10
申请号：JP2001190231
申请日：2001-06-22
Applicant: Toppan Forms Co Ltd , トッパン・フォームズ株式会社
Inventor： MARUYAMA TORU , ENDO YASUHIRO , NAOI SHINGO
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide a formation method of an RF-ID medium for which electric connection is not interrupted even when external force is concentrated on a conductive part for connection by strongly conducting and joining an IC chip mounted interposer and an antenna holding body.
SOLUTION: The IC chip mounted interposer is formed by providing a conductive pattern provided with at least the conductive part for the connection on a base material and mounting an IC chip on the conductive part for the connection and the antenna holding body is formed by providing the conductive pattern composed of an antenna conductive part and the conductive part for the connection positioned at the end part of the antenna conductive part on the base material. An adhesive material layer is provided on the part to be joined of the interposer and/or the antenna holding body, the interposer and the antenna holding body are piled up so as to face each other at the respective conductive parts for the connection, ultrasonic waves are applied to the part to be joined and the interposer and the antenna holding body are conducted and joined.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：为了提供RF-ID介质的形成方法，即使外部力集中在用于连接的导电部分上也不中断电连接的RF-ID介质，通过强电导和连接IC芯片安装的插入器和天线保持体 。 解决方案：IC芯片安装的内插器通过提供至少在基材上设置用于连接的导电部分的导电图案并将IC芯片安装在用于连接的导电部件上而形成，并且天线保持体通过提供 导电图案由天线导电部分和用于连接的导电部分构成，位于基材上的天线导电部分的端部。 在内插件和/或天线保持体，插入件和天线保持体的待接合部分上设置粘合材料层，以在相应的导电部分彼此面对连接，超声波 被施加到要接合的部分，并且插入器和天线保持体被导通和接合。
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公开(公告)号：JP2002298109A
公开(公告)日：2002-10-11
申请号：JP2001101129
申请日：2001-03-30
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/02 , B42D15/10 , G06K19/07 , G06K19/077 , H01L25/00
Abstract: PROBLEM TO BE SOLVED: To easily manufacture a contactless IC medium at a low cost using a sheet type base material made of paper or synthetic resin such as PVC or PET without need of heat resistance. SOLUTION: Thermosetting conductive ink is printed and cured on a release sheet 1 with high heat resistance to form an antenna part 3 in a plurally wound coil shape and lands 2a, 2b, 5. Thermosetting insulation ink is printed and cured so as to cross over the antenna 3 to form a resist part 6. Thermosetting conductive ink is printed and cured so as to cross on the resist part 6 and connect the lands 5 with 2a to form a jumper part 8. An IC chip 9 is mounted so as to be connected with the lands 2a, 5. A low-cost adhesive sheet 11 with low heat resistance is closely contacted with the sheet 1 and torn off again, and the antenna part 3, the lands 2a, 2b, 5, the resist part 6, the IC chip 9 are integrally transferred to an adhesive face of the adhesive sheet 11.
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公开(公告)号：JP2002231759A
公开(公告)日：2002-08-16
申请号：JP2001024164
申请日：2001-01-31
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/10 , G06K19/07 , G06K19/077 , H01L21/60
Abstract: PROBLEM TO BE SOLVED: To provide the mounting method of an IC chip by which the IC chip is surely mounted without using an expensive thermocompression device and without letting the IC chip shift from a prescribed mounting position. SOLUTION: A pair of the terminals of an antenna formed on a base material are formed by using a conductive adhesive material, the IC chip is adhered and set between the terminals and the IC chip is mounted. As the conductive adhesive material, a tacky electron beam setting type conductive adhesive material containing conductive powder and electron beam setting type components containing a compound to be set by electron beams is used. After the IC chip is adhered to a prescribed position, it is set by irradiating it with the electron beams and is mounted.
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公开(公告)号：JP2002231758A
公开(公告)日：2002-08-16
申请号：JP2001024158
申请日：2001-01-31
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO
IPC: B42D15/10 , G06K19/07 , G06K19/077 , H01L21/60 , H05K3/32
Abstract: PROBLEM TO BE SOLVED: To provide the mounting method of an IC chip by which the IC chip is surely mounted without using an expensive thermocompression device and without letting the IC chip shift from a prescribed mounting position. SOLUTION: An electron beam setting type conductive adhesive material layer is formed on a pair of the terminals of an antenna formed on a base material, and the bump of the IC chip is pierced from the upper part of the terminals, made sticky and disposed at the prescribed mounting position. Then, the conductive adhesive material is set by irradiating it with electron beams and the IC chip is mounted. As the conductive adhesive material, a tacky electron beam setting type conductive adhesive material containing conductive powder and adhesive elastomer to be set by the electron beams is used.
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Patent Agency Ranking
公开(公告)号：JP2002189999A
公开(公告)日：2002-07-05
申请号：JP2000388761
申请日：2000-12-21
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO , MARUYAMA TORU
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To provide a method capable of mass-producing an IC medium at a low cost, whose base material is not deformed or deteriorated at a low cost. SOLUTION: This method for manufacturing the IC medium where other parts of the base material or another base material are laminated on the base material on which an antenna with an IC chip mounted thereon is formed by using an adhesive, uses an electron radiation curing adhesive including a compound cured by an electron radiation as the adhesive and cures the other parts or the other base material by emitting electron radiation to laminate the other parts or the other base material.
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公开(公告)号：JP2002140671A
公开(公告)日：2002-05-17
申请号：JP2000333776
申请日：2000-10-31
Applicant: TOPPAN FORMS CO LTD
Inventor： KODAMA KAZUNARI , YAMAGAMI TAKESHI , SAITO MITSUGI , ENDO YASUHIRO
IPC: B42D15/10 , G06K19/07 , G06K19/077 , H01L21/60
Abstract: PROBLEM TO BE SOLVED: To improve the reliability of fixing of an IC chip by easily spreading adhesive resin for forming a resin layer at the time of supplying it and suppressing the containment of bubbles. SOLUTION: After forming an insulating layer 7 at least between antenna wires 4 excluding an antenna wire terminal part 6 in the IC chip fitting area 3 of the an IC chip bridge type antenna 2, an adhesive layer 8 is formed on the fitting area 3 and then an IC chip is packaged on the adhesive layer 8.
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公开(公告)号：JP2002140659A
公开(公告)日：2002-05-17
申请号：JP2000333753
申请日：2000-10-31
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a sheet or the like having a barcode displaying part where a barcode can be rewritten. SOLUTION: The sheet 1 having a rewritable barcode displaying part 2 has the barcode displaying part 2 provided with a microcapsule layer 4 formed by scattering microcapsules where two-color electrophoretic particle being black and white are enclosed in a binder and displays a barcode on the displaying part 2 by controlling the collection and distribution of the two-color particles by applying voltage to the microcapsule layer 43.
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公开(公告)号：JP2002109959A
公开(公告)日：2002-04-12
申请号：JP2000299391
申请日：2000-09-29
Applicant: TOPPAN FORMS CO LTD
Inventor： ENDO YASUHIRO , MARUYAMA TORU
Abstract: PROBLEM TO BE SOLVED: To provide a non-solvent type conductive paste which enables to carry out various printings using the conductive paste without influencing the atmosphere. SOLUTION: The conductive paste contains conductive powder, a cation hardening resin component, a coating property and bending property improving material, and a dispersion property improving material as indispensable materials.
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公开(公告)号：JP2002074311A
公开(公告)日：2002-03-15
申请号：JP2000264696
申请日：2000-08-31
Applicant: TOPPAN FORMS CO LTD
Inventor： MARUYAMA TORU , ENDO YASUHIRO , KAGAMI YASUO
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To suppress discoloration due to heat while usefulness that paper is made to be a base material is secured and to appropriately form a conduction pattern, especially the antenna of a non-contact IC media. SOLUTION: Thermosetting conductive ink printed on the base material constituted of flame resistant paper is irradiated with infrared rays and the conduction pattern is formed on the base material.
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