公开(公告)号：JP2006301897A

公开(公告)日：2006-11-02

申请号：JP2005121897

申请日：2005-04-20

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a contactless data reception and transmission body which is excellent in durability to external force and in chemical resistance and can be miniaturized. SOLUTION: The manufacturing method of the contactless data reception and transmission body is provided with; a process in which an inlet 14 is accommodated in a concave part 20c by using a base material 20, a part of which forms the concave part 20c; and a process in which the concave part 20c is filled with a resin so that the inlet 14 may be covered. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种对外力和耐化学性优异的非接触数据接收和传输体的制造方法，并且可以小型化。

解决方案：提供非接触式数据接收和传输体的制造方法; 通过使用一部分形成凹部20c的基材20将入口14容纳在凹部20c中的工序; 以及凹部20c填充树脂使得入口14可以被覆盖的过程。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006227788A

公开(公告)日：2006-08-31

申请号：JP2005038963

申请日：2005-02-16

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07 ,  H04B5/02

Abstract: PROBLEM TO BE SOLVED: To provide a contactless data receiver and transmitter which suppresses the increase of a thickness in the contactless data receiver and transmitter, has excellent flexibility, and can be used by inducing electromotive force which fully exceeds the operation electromotive force of an IC chip even when contacting an article containing at least metal. SOLUTION: The contactless data receiver and transmitter 10 comprises: a base material 11; and an inlet 14 which is arranged on one surface 11a of the base material, having an antenna 12 and an IC chip 13 which are mutually connected. The antenna 12 has a coil shape via the IC chip 13. A magnetic material layer 15 is arranged on the base material 11 to cover the antenna 12 and the IC chip 13, excluding both the end parts 12c, 12c of the antenna and its neighbor area. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供抑制非接触数据接收机和发送机中的厚度增加的非接触数据接收机和发送机，具有优异的灵活性，并且可以通过感应充分超过操作电动势的电动势来使用 即使在接触至少含有金属的制品时也是如此。 非接触式数据接收机和发射机10包括：基材11; 以及配置在基材的一个面11a上的入口14，其具有相互连接的天线12和IC芯片13。 天线12经由IC芯片13具有线圈形状。磁性材料层15布置在基材11上以覆盖天线12和IC芯片13，不包括天线的端部12c，12c及其邻近 区。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006157540A

公开(公告)日：2006-06-15

申请号：JP2004345879

申请日：2004-11-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: H01Q1/40

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board which is used for an information reading/writing device and can induce electromotive force fully exceeding the operational electromotive force of an IC chip, even if the device contacts with parts including at least metal, while suppressing an increase in the thickness of an antenna for the information reading/writing device.
SOLUTION: At a circuit board 20 used for an information reading/writing device 10 constituting an RFID system, a magnetic layer 23 is arranged to cover a base substrate 21 and an antenna 22 provided on one plane 21a of the base substrate 21.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供用于信息读/写装置的电路板，并且可以感应充分超过IC芯片的工作电动势的电动势，即使该装置与至少包括金属的部件接触 同时抑制用于信息读/写装置的天线的厚度的增加。 解决方案：在用于构成RFID系统的信息读/写装置10的电路板20上，设置有磁性层23，以覆盖设置在基底基板21的一个平面21a上的基底基板21和天线22 （C）2006年，JPO＆NCIPI

公开(公告)号：JP2006127125A

公开(公告)日：2006-05-18

申请号：JP2004314055

申请日：2004-10-28

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI ,  NAKAMURA YUICHI

IPC: G06F13/00 ,  G06K17/00 ,  G06Q30/02 ,  G06Q30/06 ,  G06Q50/00 ,  G06Q50/26

Abstract: PROBLEM TO BE SOLVED: To provide an IC information delivery system enabling a provider to give various pieces of information to a specific user without needing a complicated work, and instantaneously provide information only to the specific user while surely grasping the specific user. SOLUTION: This IC information delivery system comprises an IC tag TG1 in which a unique ID of data or equipment belonging to an individual such as the user (e.g., M1) is coded, an information display means S for the provider P, a reading means R for the IC tag connected to the information display means, an information retaining means DB connected to the information display means and retaining data or ID of the IC tag, and a user terminal T1 connected to the information retaining means. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种IC信息传递系统，使得提供商能够向特定用户提供各种信息，而不需要复杂的工作，并且在确定地抓住特定用户的同时立即向特定用户提供信息。 解决方案：该IC信息传递系统包括其中编码属于用户（例如，M1）的个人的数据或设备的唯一ID的IC标签TG1，用于提供商P的信息显示装置S， 连接到信息显示装置的IC标签的读取装置R，连接到信息显示装置并保留IC标签的数据或ID的信息保持装置DB，以及连接到信息保持装置的用户终端T1。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006059146A

公开(公告)日：2006-03-02

申请号：JP2004240646

申请日：2004-08-20

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  G06K19/07 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component and its manufacturing method, by which individual semiconductor chips can be rearranged on prescribed positions of a desired base material without extracting each semiconductor chip from a substrate or the like. SOLUTION: The semiconductor component 10 is provided with the base material 11, antennas 12, 12... arranged on one face 11a of the base material 11 at an equal interval and semiconductor chips 13, 13... electrically connected to respective antennas 12, 12.... COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供半导体元件及其制造方法，通过该半导体元件及其制造方法，可以将各个半导体芯片重新布置在所需基材的规定位置上，而不从基板等中提取每个半导体芯片。 解决方案：半导体部件10设置有以相等间隔布置在基材11的一个面11a上的基材11，天线12,12 ...和电连接到 各个天线12,12 ...。版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005353642A

公开(公告)日：2005-12-22

申请号：JP2004169594

申请日：2004-06-08

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI ,  ONO HIROKI

IPC: H01L21/52

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component where individual semiconductor chips can be rearranged so that they are in prescribed positions with respect to a desired substrate without taking them from the substrate, and to provide a manufacturing method of the component.
SOLUTION: In the mounting method of the semiconductor component 20, the semiconductor component 20 is heated where at least a part of the semiconductor chip 12 is brought into contact with the substrate 11 formed of synthetic resin. A part of or the whole substrate 11 is liquefied. The semiconductor component 20 formed of the semiconductor chip 12 and of a part of or the whole substrate 11 in a liquefied state is ejected to an adherend 40. A part of or the whole liquefied substrate 11 is used and the semiconductor component 20 is made to adhere to the adherend 40.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种半导体部件，其中各个半导体芯片可以重新排列，使得它们相对于期望的基板处于规定位置而不从基板取出，并提供该部件的制造方法。 解决方案：在半导体部件20的安装方法中，半导体部件20被加热，半导体芯片12的至少一部分与由合成树脂形成的基板11接触。 一部分或整个基板11被液化。 由半导体芯片12形成的半导体部件20和液晶状态的一部分或全部基板11被喷射到被粘物40.使用部分或全部液化基板11，将半导体部件20制成 坚持被粘物40.版权所有（C）2006年，JPO＆NCIPI

公开(公告)号：JP2005353639A

公开(公告)日：2005-12-22

申请号：JP2004169591

申请日：2004-06-08

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI ,  ONO HIROKI

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component where individual semiconductor chips can be rearranged so that they are in prescribed positions with respect to a desired substrate without taking them from the substrate, and to provide a manufacturing method of the component.
SOLUTION: In the semiconductor component 30, at least a part of the semiconductor chip 12 is brought into contact with the substrate 11 formed of first synthetic resin. In the semiconductor component 30, at least a part where the semiconductor chip 12 is exposed is coated with a coating material 13 formed of second synthetic resin whose melting point is lower than that of first synthetic resin constituted of the substrate 11. First synthetic resin and/or second synthetic resin is not liquefied in a storage temperature atmosphere.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种半导体部件，其中各个半导体芯片可以重新排列，使得它们相对于期望的基板处于规定位置而不从基板取出，并提供该部件的制造方法。 解决方案：在半导体部件30中，半导体芯片12的至少一部分与由第一合成树脂形成的基板11接触。 在半导体部件30中，半导体芯片12的露出部分的至少一部分涂覆有由比由基板11构成的第一合成树脂的熔点低的第二合成树脂形成的涂层材料13.第一合成树脂和 /或第二合成树脂在储存温度气氛中不液化。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005345394A

公开(公告)日：2005-12-15

申请号：JP2004167779

申请日：2004-06-04

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G01P15/02 ,  B42D11/00 ,  G01P15/09 ,  G06K17/00 ,  G06K19/00 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide an impulse detecting sheet for grasping the history of the impulse, for instance, which is easily attached a delivery matter such as precision equipment, without incorporating a battery. SOLUTION: The impulse detecting sheet (1) comprises an impulse sensor (2) generating voltage, in response to the impulse received, a non-contact IC module (3) for recording the impulse information detected with the impulsion sensor, by using voltage output from the impulse sensor and current generated from the voltage, and a sheet-like board (5) providing the impulse sensor and the IC module. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于抓住脉冲的历史的脉冲检测片，例如，其容易地附接诸如精密设备的传送物质，而不需要并入电池。 脉冲检测片（1）包括：脉冲传感器（2），响应于所接收的脉冲产生电压，用于记录用脉冲传感器检测到的脉冲信息的非接触IC模块（3），通过 使用来自脉冲传感器的电压输出和从电压产生的电流，以及提供脉冲传感器和IC模块的片状板（5）。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004094534A

公开(公告)日：2004-03-25

申请号：JP2002254037

申请日：2002-08-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ISEYA YUKIHIKO ,  KAGAYA HITOSHI

IPC: G06K19/00 ,  G06F17/30 ,  G06K17/00 ,  G06K19/07 ,  G06Q50/00 ,  G06Q50/26 ,  G06F17/60

Abstract: PROBLEM TO BE SOLVED: To easily retrieve a lost article. SOLUTION: In this retrieval system for retrieving the article 10 by applying a label 20 onto the article 20, a circuit part is built in the label 20 to write and read information under a non-contact condition, and an information writing/reading device 30 constituted to read the information written in the circuit part under a non-contact condition is provided to output prescribed information when reading information based on an assignment from an outside out of the circuit part. COPYRIGHT: (C)2004,JPO