公开(公告)号：US20050181658A1

公开(公告)日：2005-08-18

申请号：US10778460

申请日：2004-02-13

Applicant: Kenneth Tsui ,  Aaron Geisberger ,  George Skidmore

Inventor： Kenneth Tsui ,  Aaron Geisberger ,  George Skidmore

IPC: B81B3/00 ,  B81B7/00 ,  B81C3/00 ,  H01R11/30 ,  H01R13/627 ,  H01R24/00 ,  H01R43/00

CPC classification number: B81C99/002 ,  B81B2201/13 ,  B81C3/008

Abstract: A MEMS microconnector including a compliant handle and a deflectable connection member. The compliant handle is configured to frictionally engage a manipulation probe. The deflectable connection member includes a first end coupled to the handle and a second end configured to deflect and thereby engage a receptacle in response to disengagement of the manipulation probe from the handle.

Abstract translation: 一种MEMS微连接器，其包括柔性手柄和可偏转连接构件。 顺应手柄被配置为摩擦地接合操纵探针。 可偏转连接构件包括联接到手柄的第一端和构造成响应于操纵探针与手柄的分离而偏转并因此接合插座的第二端。

公开(公告)号：US06893885B2

公开(公告)日：2005-05-17

申请号：US10342906

申请日：2003-01-15

Applicant: David F. Lemmerhirt ,  Kensall D. Wise

Inventor： David F. Lemmerhirt ,  Kensall D. Wise

IPC: B81B7/00 ,  H01L21/60 ,  H01L21/66 ,  H01L23/544 ,  H05B3/00 ,  H05K3/34

CPC classification number: B81C3/008 ,  B81B2201/13 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/83234 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/3011 ,  H05K3/3421 ,  H01L2924/00

Abstract: A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

Abstract translation: 提供了一种用于局部连接由此形成的微观结构和器件的方法和系统，其中局部焊接在微型柔性电缆和硅微系统平台之间产生的微结构对之间形成结合。 自动检测到焊盘的多引脚接触，触发嵌入式加热器或加热器启动焊料熔化。 这种方法使精细的微结构与现场的微系统平台连接和断开，并且通过与电路的单片集成兼容的过程来实现。

公开(公告)号：US20040017078A1

公开(公告)日：2004-01-29

申请号：US10405078

申请日：2003-03-31

Inventor： Christoph D. Karp ,  Eugene Dantsker

IPC: F16L003/04

CPC classification number: B81B7/00 ,  B81B2201/13

Abstract: A connector for a stencil-based microfluidic device is provided. A planar substrate is affixed to the stencil-based microfluidic structure. A nipple is formed in the substrate. The tip of the nipple is flush with or recessed from the surface of the substrate to avoid interference with fabrication tools and processes.

Abstract translation: 提供了一种用于基于丝网的微流体装置的连接器。 平面基板固定在基于模板的微流体结构上。 在基材中形成乳头。 乳头的尖端与衬底的表面齐平或凹陷，以避免制造工具和工艺的干扰。

公开(公告)号：US06599436B1

公开(公告)日：2003-07-29

申请号：US10016956

申请日：2001-12-06

Applicant: Carolyn M. Matzke ,  Carol I. H. Ashby ,  Leonardo Griego

Inventor： Carolyn M. Matzke ,  Carol I. H. Ashby ,  Leonardo Griego

IPC: H01L2100

CPC classification number: B81B1/006 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00804 ,  B01J2219/00813 ,  B01J2219/00819 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/565 ,  B01L2200/027 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0838 ,  B81B2201/058 ,  B81B2201/13 ,  C03C27/06

Abstract: A method is disclosed to form external interconnections to a microfluidic device for coupling of a fluid or light or both into a microchannel of the device. This method can be used to form optical or fluidic interconnections to microchannels previously formed on a substrate, or to form both the interconnections and microchannels during the same process steps. The optical and fluidic interconnections are formed parallel to the plane of the substrate, and are fluid tight.

Abstract translation: 公开了一种形成与微流体装置的外部互连的方法，用于将流体或光或二者耦合到装置的微通道中。 该方法可以用于形成先前形成在衬底上的微通道的光学或流体互连，或者在相同的工艺步骤期间形成互连和微通道。 光学和流体互连平行于基板的平面形成，并且是流体密封的。

公开(公告)号：US06561725B1

公开(公告)日：2003-05-13

申请号：US09643011

申请日：2000-08-21

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: H01R16627

CPC classification number: B81C3/008 ,  B81B2201/13 ,  Y10T24/42 ,  Y10T24/45581 ,  Y10T403/60 ,  Y10T403/606

Abstract: A system and method which provide a general-purpose pressure-fitting receptacle (or “clamp”) suitable for coupling microcomponents are disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure fit with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a “preloaded” receptacle that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded receptacle suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides an “expansion” receptacle that is suitable for performing general assembly of microcomponents. Such pressure-fitting receptacles may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone receptacles.

Abstract translation: 公开了一种提供适合于耦合微型部件的通用压力接头（或“夹具”）的系统和方法。 公开了一种适于执行总体组装的压力容器，包括微组件的平面外的3-D组装，其中这种微组件可以牢固地连接在一起。 也就是说，公开了一种压配合容器，其使得能够以限制耦合部件相对于彼此的不希望的运动的方式耦合微部件。 优选地，这样的容器可以以限制配合部件相对于容器的平移和旋转自由度的方式与配合部件（或其部分）压配合。 优选的实施例提供了一种可用于执行微型部件的总体组装的“预加载”插座。 一个替代实施例提供了一种非预加载的插座，其适于执行微型部件的总体组装。 另一个替代实施例提供了一种适于执行微型部件的总体组装的“扩展”插座。 这种压力插座可以实现为微型部件的一体部分，或者它们可以被实现为单独的独立插座。

公开(公告)号：US20020191944A1

公开(公告)日：2002-12-19

申请号：US10149886

申请日：2002-06-14

Inventor： David Frank Moore ,  Richard Rodney Anthony Syms

IPC: G02B006/00

CPC classification number: B81B3/0054 ,  B81B2201/13 ,  B81B2203/0353 ,  B81C1/0019 ,  B81C3/008 ,  B81C99/002 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3672 ,  G02B6/3692

Abstract: A microlamp for holding a micropart in a desired position comprising a substrate (12) having an upper surface and a lower surface, and defining a throughhole (20) extending from the upper surface to the lower surface to have an upper opening and a lower opening; at least one first holding element (11, 15) secured to the substrate and provided at the upper end of the throughhole; and at least one second holding element (13, 14) secured to the substrate and provided at the lower end of the throughhole; the first and second holding elements arranged such that when, in use, the micropart is inserted into the throughhole it is held at least partially by the first and second holding elements such that it is located in the desired position along at least one direction perpendicular to the longitudinal axis of the hole.

Abstract translation: 一种用于将微粒保持在期望位置的微型灯，包括具有上表面和下表面的基底（12），并且限定了从上表面延伸到下表面的通孔（20），以具有上开口和下开口 ; 至少一个第一保持元件（11,15），其固定到所述基底并设置在所述通孔的上端; 和至少一个第二保持元件（13,14），其固定到所述基底并设置在所述通孔的下端; 第一和第二保持元件被布置成使得当使用时将微粒插入到通孔中时，其至少部分地被第一和第二保持元件保持，使得其沿着垂直于 孔的纵轴。

公开(公告)号：WO2012162798A1

公开(公告)日：2012-12-06

申请号：PCT/CA2012000508

申请日：2012-06-01

Applicant: UNIV TORONTO ,  SUN YU ,  CHEN KO LUN

Inventor： SUN YU ,  CHEN KO LUN

IPC: B25J7/00 ,  B25J15/04 ,  B81C99/00 ,  B82B3/00 ,  B82Y40/00

CPC classification number: B25J7/00 ,  B25J15/04 ,  B25J15/0491 ,  B25J15/12 ,  B81B2201/12 ,  B81B2201/13 ,  B81C3/008 ,  H01J37/20 ,  H01J2237/206 ,  H01J2237/208

Abstract: The present invention relates to modular system for micro-nano manipulation of samples. The modular system of the present invention comprises changeable tool tips which may be provided in an array, and a tool body. Each changeable tool tip comprises an end effector connected to a base having mating structures. The tool body includes an arm having slits having dimensions and being disposed on the arm so as to detachably couple with the mating structures of the tool tip. The slits may include an opening with rounded corners for receiving the mating structures, and tapered side walls for frictionally fitting the mating structures. The present invention relates also to a connection system for connecting a micro-dimensional tool body to a changeable micro-dimensional tool tip and to a manipulation tool for use with changeable tool tips of the present invention.

Abstract translation: 本发明涉及用于微纳米操作样品的模块化系统。 本发明的模块化系统包括可以设置在阵列中的可变工具尖端和工具主体。 每个可变的工具尖端包括连接到具有配合结构的底座的端部执行器。 工具主体包括具有尺寸的狭缝的臂，并且布置在臂上，以便可拆卸地与工具尖端的配合结构联接。 狭缝可以包括具有用于接收配合结构的圆角的开口和用于摩擦地配合配合结构的锥形侧壁。 本发明还涉及一种用于将微尺寸工具主体连接到可更换的微尺寸工具尖端的连接系统以及与本发明的可变工具尖端一起使用的操作工具。

公开(公告)号：WO02060582A2

公开(公告)日：2002-08-08

申请号：PCT/US0145256

申请日：2001-11-16

Applicant: FLUIDIGM CORP ,  CHOU HOU-PU ,  MANGER IAN DAVID ,  UNGER MARC A ,  YI YONG ,  FERNANDEZ DAVE

Inventor： CHOU HOU-PU ,  MANGER IAN DAVID ,  UNGER MARC A ,  YI YONG ,  FERNANDEZ DAVE

IPC: B01L3/00 ,  B01L3/02 ,  B29C65/00 ,  B29C65/48 ,  B81B1/00 ,  F15C5/00 ,  F16K99/00 ,  G01N1/00 ,  B01L

CPC classification number: B01L3/02 ,  B01L3/0268 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/0406 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/0655 ,  B01L2400/0688 ,  B29C65/006 ,  B29C65/48 ,  B29C66/112 ,  B29C66/1122 ,  B29C66/114 ,  B29C66/1222 ,  B29C66/1224 ,  B29C66/1226 ,  B29C66/532 ,  B29C66/54 ,  B29C66/71 ,  B29L2031/756 ,  B81B2201/13 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0017 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/008 ,  F16K2099/0084 ,  G01N1/14 ,  Y10T137/0318 ,  Y10T137/0396 ,  Y10T436/11 ,  Y10T436/118339 ,  Y10T436/119163 ,  B29K2021/00

Abstract: The present invention provides microfluidic devices, systems and methods for using the same, which facilitate the introduction of fluid to and from a microfluidic channel located within the microfluidic devices.

Abstract translation: 本发明提供了使用该流体装置的微流体装置，系统和方法，其有助于将流体引入到位于微流体装置内的微流体通道和从微流体通道中引入流体。

公开(公告)号：WO0216255A3

公开(公告)日：2002-07-11

申请号：PCT/US0124173

申请日：2001-08-01

Applicant: ZYVEX CORP

Inventor： ELLIS MATTEW D ,  SKIDMORE GEORGE D

IPC: B81B7/00 ,  F16B2/20

CPC classification number: B81C3/008 ,  B81B2201/13 ,  Y10T24/42 ,  Y10T24/45581 ,  Y10T403/60 ,  Y10T403/606

Abstract: A system and method which provide a general-purpose pressure-fitting receptacle (or "clamp") suitable for coupling microcomponentsare disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure it with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a "preloaded" receptacle that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded receptacle suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides an "expansion" receptacle that is suitable for performing general assembly of microcomponents. Such pressure-fitting receptacles may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone receptacles.

Abstract translation: 公开了一种提供适合于耦合微型部件的通用压力接头（或“夹具”）的系统和方法。 公开了一种适于执行总体组装的压力容器，包括微组件的平面外的3-D组装，其中这种微组件可以牢固地连接在一起。 也就是说，公开了一种压配合容器，其使得能够以限制耦合部件相对于彼此的不希望的运动的方式耦合微部件。 优选地，这样的容器可以以限制配合部件相对于容器的平移和旋转自由度的方式对配合部件（或其部分）进行加压。 优选的实施例提供了一种可用于执行微型部件的总体组装的“预加载”插座。 一个替代实施例提供了一种非预加载的插座，其适于执行微型部件的总体组装。 另一个替代实施例提供了一种适于执行微型部件的总体组装的“扩展”插座。 这种压力插座可以实现为微型部件的一体部分，或者它们可以被实现为单独的独立插座。

公开(公告)号：WO02040901A1

公开(公告)日：2002-05-23

申请号：PCT/US2001/040514

申请日：2001-04-12

IPC: B81B1/00 ,  B81C3/00 ,  F16J15/02

CPC classification number: B81B1/006 ,  B01J2219/00804 ,  B01L3/5027 ,  B01L3/565 ,  B01L2200/027 ,  B01L2300/0838 ,  B81B2201/058 ,  B81B2201/13 ,  F16J15/106

Abstract: A micromachined O-ring (208) is described. The O-ring can be formed for use in micromachined microfluidic devices.

Abstract translation: 描述了微加工O形环（208）。 O形环可以形成用于微加工微流体装置。