公开(公告)号：US11949832B2

公开(公告)日：2024-04-02

申请号：US17979871

申请日：2022-11-03

Applicant: Nippon Sheet Glass Company, Limited

Inventor： Shuya Ogi ,  Eiichi Nakaoka

IPC: H04N1/031 ,  H04N1/03

CPC classification number: H04N1/0312 ,  H04N1/0306 ,  H04N2201/02487

Abstract: There is provided a method of manufacturing an image sensor unit, the image sensor unit including: a linear light source that illuminates a document along a main scanning direction; a rod lens array that includes a plurality of rod lenses arranged in the main scanning direction and condenses a light reflected from the document; and a linear image sensor that receives a light condensed by the rod lens array. When a rod lens having an optically discontinuous portion on a surface and/or interior of the rod lens is included, the rod lens array is arranged such that the optically discontinuous portion is not located toward the document.

公开(公告)号：US20130265618A1

公开(公告)日：2013-10-10

申请号：US13852245

申请日：2013-03-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Hidekazu Kobayashi

IPC: H04N1/00 ,  B29C39/02

CPC classification number: H04N1/00557 ,  B29C39/02 ,  B29C45/2628 ,  B29L2011/0075 ,  H04N1/0318 ,  H04N2201/02487 ,  H04N2201/03125 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: A light guide inserted into an inclined groove is disposed so as to partially overlap with a lens unit that is fitted into a concave groove disposed parallel to the inclined groove when seen in a plan view, to regulate the separation of the lens unit from the concave groove and hold the lens unit in an insertion state by the light guide. Therefore, a fixing unit such as an adhesive agent is not required in fixedly disposing the light guide and the lens unit at a predetermined position of a frame, and a CIS module is assembled without using an adhesive agent, thereby allowing the CIS module that is easily disassembled when being discarded and that improves recycling efficiency to be provided.

Abstract translation: 插入到倾斜槽中的导光体设置成与平面图中看到的平行于倾斜槽配置的凹槽中的透镜单元部分地重叠，以调节透镜单元与凹部的分离 凹槽，并通过光导将透镜单元保持在插入状态。 因此，在将光导和透镜单元固定在框架的预定位置时，不需要诸如粘合剂的固定单元，并且在不使用粘合剂的情况下组装CIS模块，从而允许CIS模块 废弃时容易拆卸，提高了回收效率。

公开(公告)号：US07835039B2

公开(公告)日：2010-11-16

申请号：US12030947

申请日：2008-02-14

Applicant: Pen-Jung Lee ,  Chia-Wei Wang ,  Kun-Lin Tsai

Inventor： Pen-Jung Lee ,  Chia-Wei Wang ,  Kun-Lin Tsai

IPC: H04N1/04

CPC classification number: H04N1/0318 ,  H04N1/02835 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/02462 ,  H04N2201/02474 ,  H04N2201/02483 ,  H04N2201/02485 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03125 ,  H04N2201/03141 ,  H04N2201/03145 ,  H04N2201/03179

Abstract: An image reading apparatus includes a housing, a rod lens array, a light module and a sensor board. The housing accommodates the rod lens array, the light module and the sensor board. The sensor board includes a plurality of light sensor chips. The light module includes a light guide, a light source and guide terminals extending from the light source. The guide terminals are electrically connected to the sensor board with resilient contacts.

Abstract translation: 图像读取装置包括壳体，棒状透镜阵列，光模块和传感器板。 壳体容纳棒状透镜阵列，光模块和传感器板。 传感器板包括多个光传感器芯片。 光模块包括光导，光源和从光源延伸的引导端。 引导端子与弹性触点电连接到传感器板。

公开(公告)号：USRE41635E1

公开(公告)日：2010-09-07

申请号：US11229450

申请日：2005-09-16

Applicant: Po-Hua Fang

Inventor： Po-Hua Fang

IPC: G02B5/08

CPC classification number: H04N1/03 ,  G02B17/023 ,  H04N1/00538 ,  H04N1/02815 ,  H04N1/0303 ,  H04N1/0305 ,  H04N1/0402 ,  H04N1/0405 ,  H04N1/1017 ,  H04N1/193 ,  H04N2201/0246 ,  H04N2201/02487 ,  H04N2201/02495

Abstract: A modularized light-guiding apparatus and manufacturing method, which may make the light of a light source proceed at least twice light reflections of predetermined directions. The light-guiding apparatus includes a plurality of modularized reflection elements, which may be differentiated to several different types of reflection element. Each type of each reflection element all has substantially same adjoining device and edge size for providing to be adjoined and piled-up with another reflection element. But, the reflection element of different type individually has different number of reflection plane for providing the light to proceed different times of light reflection. It may determined the light reflection times and light-path length for the light-guiding apparatus, by choosing several different types of reflection element among plural reflection elements to proceed the piling-up for the light-guiding apparatus.

Abstract translation: 可以使光源的光进行至少两次预定方向的光反射的模块化导光装置和制造方法。 光引导装置包括多个模块化反射元件，其可以被区分成几种不同类型的反射元件。 每种类型的每个反射元件都具有基本上相同的邻接装置和边缘尺寸，用于提供与另一个反射元件邻接和堆叠。 但是，不同类型的反射元件分别具有不同数量的反射平面，用于提供光以进行不同时间的光反射。 可以通过在多个反射元件中选择若干种不同类型的反射元件来确定导光装置的光反射时间和光路长度，以进行导光装置的堆积。

公开(公告)号：US20080192306A1

公开(公告)日：2008-08-14

申请号：US12030947

申请日：2008-02-14

Applicant: Pen-Jung Lee ,  Chia-Wei Wang ,  Kun-Lin Tsai

Inventor： Pen-Jung Lee ,  Chia-Wei Wang ,  Kun-Lin Tsai

IPC: H04N1/04

CPC classification number: H04N1/0318 ,  H04N1/02835 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/02462 ,  H04N2201/02474 ,  H04N2201/02483 ,  H04N2201/02485 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03125 ,  H04N2201/03141 ,  H04N2201/03145 ,  H04N2201/03179

Abstract: An image reading apparatus includes a housing, a rod lens array, a light module and a sensor board. The housing accommodates the rod lens array, the light module and the sensor board. The sensor board includes a plurality of light sensor chips. The light module includes a light guide, a light source and guide terminals extending from the light source. The guide terminals are electrically connected to the sensor board with resilient contacts.

Abstract translation: 图像读取装置包括壳体，棒状透镜阵列，光模块和传感器板。 壳体容纳棒状透镜阵列，光模块和传感器板。 传感器板包括多个光传感器芯片。 光模块包括光导，光源和从光源延伸的引导端。 引导端子与弹性触点电连接到传感器板。

公开(公告)号：US06870275B2

公开(公告)日：2005-03-22

申请号：US10393973

申请日：2003-03-24

Applicant: Mitsuru Nakajima

Inventor： Mitsuru Nakajima

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H04N1/00 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US20040016982A1

公开(公告)日：2004-01-29

申请号：US10393973

申请日：2003-03-24

Inventor： Mitsuru Nakajima

IPC: H01L031/0203 ,  H01L023/495

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US20030117660A1

公开(公告)日：2003-06-26

申请号：US10159125

申请日：2002-06-03

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Toshio Matsumoto

IPC: H04N001/00

CPC classification number: H04N1/0318 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: A sensor frame for an image sensor is manufactured in the step of forming a sensor frame for an image sensor by extrusion molding so that a frame support portion for supporting the frame is formed above a lens array holding portion, and the step of removing the thus-formed sensor frame support portion by machining while leaving parts of the support portion located at the longitudinally corresponding to the upper ends of the lens array holding portion. Accordingly, machined surfaces subjected to the machining exist outside the hollow space where the sensor ICs are located.

Abstract translation: 在通过挤压成型形成用于图像传感器的传感器框架的步骤中制造用于图像传感器的传感器框架，从而在透镜阵列保持部分上方形成用于支撑框架的框架支撑部分，并且移除由此 形成的传感器框架支撑部分，同时留下位于与透镜阵列保持部分的上端纵向对应的支撑部分的部分。 因此，进行加工的加工表面存在于传感器IC所在的中空空间的外部。

公开(公告)号：US20010024300A1

公开(公告)日：2001-09-27

申请号：US09816081

申请日：2001-03-26

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kazuhiko Sasahara ,  Takeshi Mikura

IPC: H04N001/04

CPC classification number: H04N1/1934 ,  H01L25/042 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N1/03 ,  H04N2201/02487 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A sensor chip, an image reading sensor and an electronic device, which are capable of preventing poor image readings, are provided. The sensor chip is constructed such that the image reading sensor is constituted by mounting a plurality of sensor chips on a sensor substrate, and is provided with a notch at a lower corner of an end portion which faces with other sensor chip. The image reading sensor is constituted by mounting a plurality of sensor chips on a sensor substrate, and each sensor chip is provided with a notch at a lower corner of the end portion which faces other sensor chip. The electronic device contains the image reading sensor, which is constituted by mounting a plurality of sensor chips on a sensor substrate, and each sensor chip is provided with a notch at a lower corner of the end portion which faces other sensor chip.

Abstract translation: 提供能够防止差的图像读数的传感器芯片，图像读取传感器和电子设备。 传感器芯片被构造成使得图像读取传感器通过将多个传感器芯片安装在传感器基板上而构成，并且在与其他传感器芯片相对的端部的下角设置有凹口。 图像读取传感器通过将多个传感器芯片安装在传感器基板上而构成，并且每个传感器芯片在端部的与其他传感器芯片相对的下角设置有凹口。 电子装置包含图像读取传感器，其通过将多个传感器芯片安装在传感器基板上而构成，并且每个传感器芯片在面向其他传感器芯片的端部的下角设置有凹口。

公开(公告)号：US5383034A

公开(公告)日：1995-01-17

申请号：US945212

申请日：1992-09-15

Applicant: Masaya Imamura ,  Kensuke Sawase ,  Seiji Koshikawa

Inventor： Masaya Imamura ,  Kensuke Sawase ,  Seiji Koshikawa

IPC: H04N1/028 ,  H04N1/031 ,  H04N1/024

CPC classification number: H04N1/0312 ,  H04N1/0314 ,  H04N1/0315 ,  H04N1/0318 ,  H04N2201/02404 ,  H04N2201/02452 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03154 ,  H04N2201/0317

Abstract: An image sensor has a frame including a reading window formed therein at the top of the frame. The reading window is closed by a glass covering which is adhered to the frame through an adhesive. First and second grooves are provided in the frame to extend along the reading window. After the adhesive has been charged into the first groove, the glass covering is placed and pressed against the frame top so that the glass covering will be adhered to the frame top through the adhesive. At this time, any excess adhesive may be received and held by the second groove.

Abstract translation: 图像传感器具有在框架的顶部形成有读取窗口的框架。 阅读窗被玻璃罩封闭，玻璃罩通过粘合剂粘附到框架上。 第一和第二凹槽设置在框架中以沿着阅读窗口延伸。 在将粘合剂装入第一凹槽中之后，将玻璃盖放置并压靠在框架顶部上，使得玻璃覆盖物将通过粘合剂粘附到框架顶部。 此时，任何多余的粘合剂可以被第二槽容纳并保持。