公开(公告)号：US09583666B2

公开(公告)日：2017-02-28

申请号：US14668309

申请日：2015-03-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L31/16 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0232 ,  G01S17/02 ,  G01S7/481

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/02325 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.

Abstract translation: 接近传感器包括半导体管芯，发光组件，再分配层和封装层。 半导体管芯的表面包括传感器区域和接触焊盘。 透镜位于半导体管芯的传感器区域上方。 发光组件包括具有发光区域的发光器件，位于发光区域上方的透镜以及面向再分布层的接触焊盘。 再分布层的一侧包括接触垫。 电连接器使得半导体管芯的每个接触焊盘与再分配层的接触焊盘中的相应一个电连通。 封装层位于再分配层上，并且至少部分地封装半导体管芯，半导体管芯的传感器区域上的透镜以及发光组件。

公开(公告)号：US09529433B2

公开(公告)日：2016-12-27

申请号：US14586547

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Ravi Shankar ,  Olivier Leneel

IPC: G06F3/01 ,  G09G5/18

CPC classification number: G06F3/014 ,  G09G5/18 ,  G09G2370/16

Abstract: A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.

Abstract translation: 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。

公开(公告)号：US09337111B2

公开(公告)日：2016-05-10

申请号：US13853496

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yohanes Bintang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/66 ,  H01L23/31

CPC classification number: H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.

Abstract translation: 半导体封装包括位于第一管芯和附接到支撑衬底的第二管芯之间的RFID芯片。 RFID芯片没有与骰子和支撑基板的电连接。 RFID芯片的大小对应于插入板。 关于骰子的操作特性的数据在后端处理期间被存储到RFID芯片并从其读取，以确定异常并提高产量。 所述数据可以存储在与包装中的RFID芯片相对应的数据库中。 提供了一种制造具有位于晶片之间的RFID芯片的半导体封装的方法。 该包可以通过存储到RFID芯片和数据库的数据由客户追踪。

公开(公告)号：US09258467B2

公开(公告)日：2016-02-09

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H01L27/146 ,  B29L31/00

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US09257372B2

公开(公告)日：2016-02-09

申请号：US14032075

申请日：2013-09-19

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Kim-Yong Goh ,  Xueren Zhang ,  Kevin Formosa

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L23/31 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L23/49541 ,  G01P1/023 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2224/45099

Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.

Abstract translation: 半导体器件的表面贴装封装具有：封装，容纳至少一个包含半导体材料的管芯; 以及电接触引线，从封装凸出以电耦合到电路板的接触焊盘; 封装具有设计成面向电路板的顶表面的主面，该主面具有设计成用于机械耦合到电路板的耦合特征，以增加安装封装的谐振频率。 耦合特征设想至少一个第一耦合凹槽，其限定在从主面开始的封装内，被设计成由固定到电路板的对应耦合元件接合，从而限制安装的封装的移动。

公开(公告)号：US09176089B2

公开(公告)日：2015-11-03

申请号：US13853732

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L31/058 ,  G01N27/22 ,  H01L25/065 ,  H01L25/00 ,  G01L9/12 ,  G01K7/01 ,  H01L27/02 ,  H01L29/78 ,  G01K7/18 ,  G01K7/20

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。

公开(公告)号：US09171823B2

公开(公告)日：2015-10-27

申请号：US13341890

申请日：2011-12-30

Applicant: KahWee Gan ,  Yaohuang Huang

Inventor： KahWee Gan ,  Yaohuang Huang

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/053 ,  H05K1/00 ,  H05K1/11 ,  H01R43/00 ,  H05K3/30 ,  H01L25/03 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/03 ,  H01L21/561 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/24146 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/19103 ,  H01L2924/19104 ,  Y10T29/49117 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.

Abstract translation: 电路模块的实施例包括模块节点，第一子模块，第二子模块和导电结构。 第一子模块具有第一子模块节点，并且第二子模块设置在第一子模块上并且具有第二子模块节点。 导电结构将第一子模块节点耦合到模块节点之一，并将第二子模块节点耦合到模块节点之一。 电路模块的另一实施例包括模块节点，第一子模块，第二子模块和导电结构。 第一子模块具有第一子模块节点，第二子模块设置在第一子模块上并具有第二子模块节点。 导电结构将第一和第二子模块节点之一耦合到模块节点之一，并将第一子模块节点之一耦合到第二子模块节点之一。

公开(公告)号：US20150237245A1

公开(公告)日：2015-08-20

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/235 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

Abstract translation: 公开了一种用于微型照相机的低成本树脂透镜。 树脂透镜具有低外形，特别适用于诸如智能手机的消费产品。 树脂透镜安装到附接到标准四层基板的集成电路管芯上。 集成电路管芯包括用于支持数字图像捕获，传输和处理的电子和/或光电子电路。 图像校正软件调整图像以校正由树脂透镜引入的失真。

公开(公告)号：US20150145137A1

公开(公告)日：2015-05-28

申请号：US14090673

申请日：2013-11-26

Applicant: STMicroelectronics Pte. Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L23/31 ,  H01L27/06 ,  H01L23/528 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。

公开(公告)号：US20150138436A1

公开(公告)日：2015-05-21

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N5/225 ,  B29D11/00 ,  B29C65/48

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。