Abstract:
PROBLEM TO BE SOLVED: To provide methods and apparatus for defining a single structure (11) on a semiconductor wafer by spatial frequency components. SOLUTION: Some of the spatial frequency components (12-16) are derived by optical lithography and some by interferometric lithography techniques. Interferometric lithography images the high frequency components while optical lithography images the low frequency components. Optics collects many spatial frequencies and the interferometry shifts the spatial frequencies to high spatial frequencies. Thus, since the mask does not need to provide high spatial frequencies, the masks are configured to create only low frequency components, thereby allowing fabrication of simpler masks having larger structures. These methods and apparatus facilitate writing more complex repetitive as well as non-repetitive patterns in a single exposure with a resolution which is higher than that currently available using known optical lithography alone. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a material having composite particles. SOLUTION: There is provided the material having the composite particles including: an outside shell portion containing an element such as carbon, nitrogen, oxygen or sulfur; and an inside core portion made of a lithium alloy material such as tin, silicon, aluminum and/or germanium. When the outside shell portion is made of carbon, the outside shell portion of the composite particles has a mean thickness of less than 20 nm and the composite particles have a mean outside diameter of less than 100 nm. In some examples, the inside core portion is made of tin, tin binary alloy, tin ternary alloy or tin quarternary alloy. COPYRIGHT: (C)2010,JPO&INPIT