Abstract:
The present disclosure relates to the field of fabricating microelectronic devices. In at least one embodiment, the present disclosure relates to forming isolation structures in strained semiconductor bodies of non-planar transistors while maintaining strain in the semiconductor bodies.
Abstract:
A gaming bag including at least one outer wall defining a cavity, at least one light emitting source positioned adjacent the at least one outer wall, a filling material disposed within the cavity, and wherein the at least one light emitting source provides illumination. A method of lighting a gaming bag comprising the steps of providing a gaming bag comprising at least one outer wall defining a cavity, at least one light emitting source positioned adjacent the at least one wall, a shock sensor within the cavity, a filling material within the cavity, and wherein the at least one light emitting source provides illumination, tossing the gaming bag, measuring a force with the shock sensor upon impact with a surface, activating the light emitting source when the force is greater than the predetermined threshold, and deactivating the light emitting source after a predetermined amount of time.
Abstract:
A trigate device having an extended metal gate electrode comprises a semiconductor body having a top surface and opposing sidewalls formed on a substrate, an isolation layer formed on the substrate and around the semiconductor body, wherein a portion of the semiconductor body remains exposed above the isolation layer, and a gate stack formed on the top surface and opposing sidewalls of the semiconductor body, wherein the gate stack extends a depth into the isolation layer, thereby causing a bottom surface of the gate stack to be below a top surface of the isolation layer.
Abstract:
Various methods for forming a layer of strained silicon in a channel region of a device and devices constructed according to the disclosed methods. In one embodiment, a strain-inducing layer is formed, a relaxed layer is formed on the strain-inducing layer, a portion of the strain-inducing layer is removed, which allows the strain-inducing layer to relax and strain the relaxed layer.
Abstract:
An illuminated jewelry case comprising a base having a jewelry mounting location adapted for removably mounting a piece of jewelry; a lid pivotally connected to the base and movable between open and closed positions; at least one LED disposed on the lid for illuminating the jewelry mounting location when the lid is in the open position; and a ribbon cable in electrical communication with the at least one LED and a pair of battery contacts disposed on the base.
Abstract:
There is disclosed an apparatus including a substrate defining an interior of the apparatus, a device exterior to the substrate including a gate electrode, and a straining layer exterior to the gate electrode and exterior to the substrate.
Abstract:
A method and apparatus to form a high-concentration, indium-fluorine retrograde well within a substrate. The indium-fluorine retrograde well includes an indium concentration greater than about 3E18/cm3.
Abstract:
The invention relates to a method of removing a peripheral zone of adhesive while using a layer of adhesive in the process of assembling and transferring a layer of material from a source substrate to a support substrate. The method is remarkable in that it includes bonding the two substrates together by means of a curable adhesive so that an excess of adhesive is present. This assures proper bonding and provides a peripheral zone of adhesive outside of the joined substrates. Only that portion of adhesive is cured which is present in a connection zone between the substrates, and the peripheral zone of non-cured adhesive is removed prior to detaching the transferable layer. The invention is applicable to fabricating a composite substrate in the fields of electronics, opto-electronics, or optics.
Abstract:
A method of producing a substrate that has a transfer crystalline layer transferred from a donor wafer onto a support. The transfer layer can include one or more foreign species to modify its properties. In the preferred embodiment an atomic species is implanted into a zone of the donor wafer that is substantially free of foreign species to form an embrittlement or weakened zone below a bonding face thereof, with the weakened zone and the bonding face delimiting a transfer layer to be transferred. The donor wafer is preferably then bonded at the level of its bonding face to a support. Stresses are then preferably applied to produce a cleavage in the region of the weakened zone to obtain a substrate that includes the support and the transfer layer. Foreign species are preferably diffused into the thickness of the transfer layer prior to implantation or after cleavage to modify the properties of the transfer layer, preferably its electrical or optical properties. The preferred embodiment produces substrates with a thin InP layer rendered semi-insulating by iron diffusion.
Abstract:
A cap is provided for mounting a light fixture to a post having a longitudinal shaft of rectangular section extending therethrough. The cap includes a closure for the shaft bore having a drive cone secured to the closure and extending into the shaft interior. Fingers are mounted to the closure for transverse movement within the shaft. Each of the fingers has an inner edge abutting the cone and an outer edge adapted to engage the interior of the post when the finger is shifted outwardly. A drive screw extends through the closure and serves to drive the cone upwardly and hence the fingers outwardly.