Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor substrate in which occurrence of warp and crack can be suppressed effectively and stripping of each surface of a semiconductor layer can be prevented, and to provide a substrate for growing semiconductor crystal, a semiconductor device, an optical semiconductor device, and their manufacturing processes. SOLUTION: The semiconductor substrate (100) comprises a semiconductor crystal layer (2) grown on one surface of a substrate (1), and a stress relax layer (3) formed on the other surface and the side face of the substrate (1) and imparting a stress to the substrate (1) in the same direction as that of a stress being imparted to the substrate (1) by the semiconductor crystal layer (2). Since the stress being imparted to the substrate (1) by the semiconductor crystal layer (2) is offset, occurrence of warp and crack in the semiconductor substrate (100) is suppressed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a switching circuit which is superior in higher harmonic characteristics and insertion loss, a semiconductor device and to provide its manufacturing method. SOLUTION: This switching circuit is provided with a first FET (81) connected to either an input terminal (70) or an output terminal (72), whose conduction/non-conduction is controlled by a gate electrode connected to a control terminal (74), and second FETs (82, 83, 84) connected between either the input terminal (70) or the output terminal (72) and a first FET (81), whose conduction/non-conduction is controlled by the gate electrode connected to the control terminal (74). The gate reverse breakdown voltage of the first FET is set so as to be larger than that of the second FET, or the off-capacity of the first FET is set so as to be smaller than that of the second FET. A semiconductor device and its manufacturing method are provided as well. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an optical device which has wide design degree of freedom and is readily assembled and to provide a manufacturing method therefor. SOLUTION: The optical device is provided with a first optical component (10) having an end face (25) which is inclined with respect to the surface perpendicular to an optical axis, a second optical component (14) which is to be optically coupled to the first optical component and a lens (12) which is arranged between the first and the second optical components and is positioned so that a locus (17) of the focus of the first optical component is formed within an effective area (15) of the second optical component surface when the first and the second optical components are relatively rotated. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a laser device, a control device thereof, a control method thereof, control data thereof, a laser control method, and a wavelength switching method, capable of varying the optical intensity of a desired wavelength light, while efficiently outputting a desired wavelength. SOLUTION: A laser device 100 is provided with a resonator (10), comprising an optical amplifier (11), a wavelength selecting means (14) with which the transmission wavelength range can be varied, and a mirror (15); and a control means (50) for controlling the wavelength selecting means (14), so that the transmitting wavelength range of the wavelength selecting means (14) varies in the desired range. The control means (50) controls the wavelength selecting means (14) so that the optical intensity of a desired oscillation wavelength become a desired value, while a resonator (10) outputs the desired oscillation wavelength, after controlling a wavelength selecting means (14) so that a resonator (10) outputs the desired oscillation wavelength. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein no ohmic contact takes place, and to provide its manufacturing method. SOLUTION: An Al-containing ohmic electrode 2, a barrier metallic layer 5 made of TiWN, and an Au wire electrode 7 are sequentially formed on one side of a GaN group semiconductor layer 1. Since the barrier metal layer 5 made of the TiWN is formed between the Al-containing ohmic electrode 2 and the Au wire electrode 7, the reaction can be prevented between the Al in the Al-containing ohmic electrode 2 and the Au in the Au wire electrode 7. Thus, the deterioration can be prevented in the characteristic of the semiconductor device 100. Moreover, since the TiWN is excellent in the barrier performance even at a high temperature region, the reaction can be prevented between the Al in the Al-containing ohmic electrode 2 and the Au in the Au wire electrode 7 even when a high temperature anneal processing is applied to the semiconductor device 100. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To perform engagement/disengagement between a data link module resulting from modularizing a communication device or the like and a cage to/from which the data link module is inserted/removed, simultaneously with insertion/removal of the data link module. SOLUTION: When a handle (3) is raised (shown in B) in such a state that a data link module (1) is inserted to a cage (4) with a lock pin (122) locked by fitting to a lock hole (43) in an insertion state (shown in A), a T-shaped tongue piece (22) is pushed down by cam operation of a plate cam (31), and an I-shaped tongue piece (42) is pushed down in accordance with this push-down, and thus the lock hole (43) is disengaged from the lock pin (122) so that the data link module is removed (shown in C). COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a filter having a simple constitution and a high degree of freedom of design. SOLUTION: The filter comprises first and second line patterns (11, 12) each having a total length substantially equal to 1/2 the wavelength of a pass-band frequency and a resonator (13) located between the first and second line patterns to couple with them so as to function as an open stab which makes connection points between input/output terminals (15, 16) and the first and second line patterns like short-circuited as seen from both ends (14) of the first and the second line patterns. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an optical semiconductor device with which highly precise optical modulation is efficiently carried out, an optical phase control device, an optical intensity control device, and a method for manufacturing the optical semiconductor device. SOLUTION: An optical modulator 1A has isolation electrodes 2a, 2b and 2c, isolation electrodes 3a, 3b and 3c and conductive region 8 to form a modulation region on optical waveguides 5a and 5b on a substrate 1. The isolation electrodes 2a, 2b and 2c are mounted on a signal line 2 on the side opposite to a ground line 3 with the optical waveguides 5a and 5b interposed in between, and further, the signal line 2 is extended to the side of the ground line 3 on the substrate 1. As a result, a region (an overlap region 9) where the signal line 2 and the optical waveguides 5a and 5b overlap with one another is present. Consequently a conductive region 8 is formed on a region other than a region corresponding to the overlap region 9, that is, a region on the substrate 1 opposite to the signal line with the optical waveguides 5a and 5b interposed in between. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a wavelength measuring instrument, a light-receiving unit and a wavelength measuring method for capable of easily realizing high precision wavelength characteristics, in a desired wavelength range. SOLUTION: A temperature control means, including a Peltier element 20, controls the peak wavelength of the sensitivity curve in a photoreception chip 10 on the light receiving unit 1a side to the side of wavelength shorter than the desired wavelength region, and controls a peak wavelength of a sensitivity curve in the light receiving chip 10 in a light receiving unit 1b side to the side of wavelength longer than the desired wavelength range, by respectively temperature-controlling the light receiving unit 1a and the light receiving unit 1b independently. A wavelength specifying range is set thereby, to include the desired wavelength range, and the wavelength of measured light 3 is specified accurately in the wavelength range. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve ESD (Electro Static Discharge) breakdown voltage in a method of manufacturing a light emitting element. SOLUTION: A method of manufacturing a light emitting element includes a step of forming an MQW (Multi Quantum Well) active layer 24 that includes: the steps of forming a well layer 21 made of a nitride semiconductor; and forming a barrier layer 23 made of a nitride semiconductor on the well layer 21 at a growth temperature which is 130 to 150°C higher than the growth temperature of the well layer 21. The ESD breakdown voltage is improved by setting the difference in growth temperature between the barrier layer 23 and well layer 21 to not less than 130°C. COPYRIGHT: (C)2010,JPO&INPIT