放熱板及びその製造方法
    61.
    发明专利

    公开(公告)号:JP6462172B1

    公开(公告)日:2019-01-30

    申请号:JP2018145822

    申请日:2018-08-02

    Abstract: 【課題】Cu−Mo複合材とCu材のクラッド構造を有する低熱膨張率、高熱伝導率の放熱板を提供する。 【解決手段】板厚方向において、Cu層とCu−Mo複合体層が交互に積層することで3層以上のCu層と2層以上のCu−Mo複合体層で構成されるとともに、両面の最外層がCu層からなる放熱板であって、Cu−Mo複合体層は、Cuマトリクス中に扁平なMo相が分散した板厚断面組織を有する。板厚と密度が同じである3層クラッド構造の放熱板と較べて、低熱膨張率であり、且つ最外層のCu層の厚さが薄くなるため板厚方向の熱伝導率が高くなる。 【選択図】図1

    放熱板及びその製造方法
    62.
    发明专利

    公开(公告)号:JP6455896B1

    公开(公告)日:2019-01-23

    申请号:JP2017222337

    申请日:2017-11-18

    Abstract: 【課題】Cu−Mo複合材とCu材のクラッド構造を有する低熱膨張率、高熱伝導率の放熱板を提供する。 【解決手段】板厚方向において、Cu層とCu−Mo複合体層が交互に積層することで3層以上のCu層と2層以上のCu−Mo複合体層で構成されるとともに、両面の最外層がCu層からなる放熱板であって、Cu−Mo複合体層は、Cuマトリクス中に扁平なMo相が分散した板厚断面組織を有する。板厚と密度が同じである3層クラッド構造の放熱板と較べて、低熱膨張率であり、且つ最外層のCu層の厚さが薄くなるため板厚方向の熱伝導率が高くなる。 【選択図】図1

    Cr-Cu ALLOY FOR CONDUCTING MEMBER FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING Cr-Cu ALLOY, LEAD FRAME OR BUS BAR USING THE Cr-Cu ALLOY AND METHOD FOR PRODUCING THE SAME
    64.
    发明专利
    Cr-Cu ALLOY FOR CONDUCTING MEMBER FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING Cr-Cu ALLOY, LEAD FRAME OR BUS BAR USING THE Cr-Cu ALLOY AND METHOD FOR PRODUCING THE SAME 有权
    用于电子部件的导电构件的Cr-Cu合金,使用Cr-Cu合金制造Cr-Cu合金,引线框架或母线的方法及其制造方法

    公开(公告)号:JP2010163687A

    公开(公告)日:2010-07-29

    申请号:JP2009285320

    申请日:2009-12-16

    Abstract: PROBLEM TO BE SOLVED: To provide a Cr-Cu alloy for a conducting member for an electronic component having a low thermal expansion coefficient and high electric conductivity.
    SOLUTION: The Cr-Cu alloy having a flattened Cr phase has a composition comprising 30 to 80 mass% Cr, and in which the intrusion of O, N, C, Al and Si as inevitable impurities is suppressed to ≤0.08 mass% O, ≤0.03 mass% N, ≤0.03 mass% C, ≤0.05 mass% Al and ≤0.10 mass% Si, respectively, and further has a layered structure where the aspect ratio of the flattened Cr phase is >10, and also, the number density in the thickness direction of the Cr phase is 10 to 1,000 pieces/mm, and in which variation in electric conductivity is suppressed to ±10% as well.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于具有低热膨胀系数和高导电性的电子部件用导电部件的Cr-Cu合金。 解决方案:具有平坦的Cr相的Cr-Cu合金具有包含30〜80质量%的Cr的组成,其中O,N,C,Al和Si作为不可避免的杂质的侵入被抑制为≤0.08质量 %O,≤0.03质量%N,≤0.03质量%C,≤0.05质量%Al和≤0.10质量%Si,并且还具有其中平坦化Cr相的纵横比> 10的层状结构,并且还 ,Cr相的厚度方向的密度为10〜1000个/ mm,电导率的变化也抑制在±10%以下。 版权所有(C)2010,JPO&INPIT

    Cold temper rolling method for copper alloy sheet
    66.
    发明专利
    Cold temper rolling method for copper alloy sheet 有权
    铜合金薄板冷轧轧制方法

    公开(公告)号:JP2008142761A

    公开(公告)日:2008-06-26

    申请号:JP2006335552

    申请日:2006-12-13

    Abstract: PROBLEM TO BE SOLVED: To provide a method for inexpensively producing a copper alloy having a satisfactory flatness which is suitable as the stock for a heat radiation sheet having compatibility between a low thermal expansion coefficient and a high thermal conductivity rate, and also having excellent workability.
    SOLUTION: First cold rolling where the roll spacing between rolling rolls is set to a prescribed value, and a copper alloy sheet is subjected to thickness reduction is performed one time, and thereafter, first temper rolling is performed one or more times at the roll spacing same as that in the first cold rolling, and next, second cold rolling where the roll spacing is reduced and the copper alloy sheet is subjected to thickness reduction is performed for one time, and subsequently, second temper rolling is performed one or more times at the roll spacing same as that in the second cold rolling.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 解决的问题:提供一种廉价地制造具有令人满意的平坦度的铜合金的方法,其适合作为具有低热膨胀系数和高热导率之间相容性的散热片的原料,以及 具有优异的可加工性。 < P>解决方案:将轧制辊之间的辊间距设定为规定值,并对铜合金板进行厚度还原的第一次冷轧进行一次,然后在第一次轧制中进行一次或多次 辊间隔与第一次冷轧相同,接下来,进行辊间隔减小的第二次冷轧,并且对铜合金板进行厚度还原,进行一次,然后进行第二次轧制, 在与第二次冷轧相同的轧辊间距下更多次。 版权所有(C)2008,JPO&INPIT

    Cr-Cu ALLOY, MANUFACTURING METHOD THEREFOR, RADIATION PLATE FOR SEMICONDUCTOR AND RADIATION PARTS FOR SEMICONDUCTOR
    67.
    发明专利
    Cr-Cu ALLOY, MANUFACTURING METHOD THEREFOR, RADIATION PLATE FOR SEMICONDUCTOR AND RADIATION PARTS FOR SEMICONDUCTOR 有权
    Cr-Cu合金及其制造方法,半导体辐射板和半导体辐射部件

    公开(公告)号:JP2008057032A

    公开(公告)日:2008-03-13

    申请号:JP2007034405

    申请日:2007-02-15

    Abstract: PROBLEM TO BE SOLVED: To provide a Cr-Cu alloy which has a small coefficient of thermal expansion in a surface direction, has a large coefficient of thermal conductivity, further keeps a low coefficient of thermal expansion even after having been heated to a high temperature for bonding, and besides, has superior workability; a manufacturing method therefor; further a radiation plate with the use of the Cr-Cu alloy for a semiconductor; and radiation parts with the use of the Cr-Cu alloy for a semiconductor.
    SOLUTION: The Cr-Cu alloy comprises a Cu matrix and flat Cr phases; is obtained by powder metallurgy; and includes Cr of more than 30 mass% but 80 mass% or less. The flat Cr phases have an average aspect ratio of more than 1.0 but less than 100.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供在表面方向上具有小的热膨胀系数的Cr-Cu合金,具有大的导热系数,即使在被加热之后也保持低的热膨胀系数 用于粘合的高温,此外,具有优异的加工性; 其制造方法; 进一步使用Cr-Cu合金用于半导体的辐射板; 以及使用Cr-Cu合金用于半导体的辐射部件。 解决方案:Cr-Cu合金包含Cu基体和平坦的Cr相; 通过粉末冶金获得; 并且包含大于30质量%但为80质量%以下的Cr。 平坦的Cr相具有大于1.0但小于100的平均纵横比。版权所有(C)2008,JPO&INPIT

    Tool for shielding radiation
    68.
    发明专利
    Tool for shielding radiation 审中-公开
    屏蔽辐射工具

    公开(公告)号:JP2006258765A

    公开(公告)日:2006-09-28

    申请号:JP2005080604

    申请日:2005-03-18

    CPC classification number: A61M5/1785 A61M5/3129

    Abstract: PROBLEM TO BE SOLVED: To provide a tool for shielding a radiation such as a syringe for a radioactive chemical, a shielding container for a radioactive solution and a component for shielding the radiation, capable of holding surface grossiness for a long period even when contaminated with the chemical, a dirt from hands or the like.
    SOLUTION: This tool for shielding the radiation is formed of a powder sintered body constituted of components of tungsten, nickel and molybdenum, and containing 89-98 mass% of tungsten, to provide excellent radiation shielding ability and an excellent corrosion preventive effect.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供用于屏蔽辐射的工具,例如用于放射性化学品的注射器,放射性溶液用屏蔽容器和用于屏蔽辐射的部件,能够长时间保持表面粗糙度甚至 当被化学物质污染时,手上有污垢等。 解决方案:用于屏蔽辐射的工具由钨,镍和钼的组分构成的粉末烧结体形成,含有89-98质量%的钨,以提供优异的辐射屏蔽能力和优异的防腐蚀效果 。 版权所有(C)2006,JPO&NCIPI

    Cu-Cr ALLOY AND Cu-Cr ALLOY PRODUCTION METHOD
    69.
    发明专利
    Cu-Cr ALLOY AND Cu-Cr ALLOY PRODUCTION METHOD 有权
    Cu-Cr合金和Cu-Cr合金生产方法

    公开(公告)号:JP2005330583A

    公开(公告)日:2005-12-02

    申请号:JP2005119104

    申请日:2005-04-15

    Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive alloy material for heat radiation having a coefficient of thermal expansion similar to that of composite material, high thermal conductivity similar to that of pure copper, and also having excellent machinability, to provide a production method therefor, and further to provide a production method using a powder sintering process, in addition to the conventional dissolution process, by which alloy materials for heat radiation with various shapes can be supplied at a low production cost in order to meet particularly the need of various shapes as those of alloy materials for heat radiation.
    SOLUTION: The Cu-Cr alloy comprises, by mass, 0.3 to 80% C, and the balance Cu with inevitable impurities, and has a structure where a granular Cr phase having a major axis of ≤100 nm and an aspect ratio of 2 .
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:为了提供一种廉价的热辐射合金材料,其热膨胀系数类似于复合材料的热膨胀系数,与纯铜相似的高热导率,并且还具有优异的机械加工性,以提供生产 并且进一步提供使用粉末烧结工艺的生产方法,除了传统的溶解过程之外,可以以低的生产成本提供具有各种形状的用于散热的合金材料,以便特别地满足 各种形状,如用于散热的合金材料。 解决方案:Cu-Cr合金的质量含量为0.3〜80%,余量为不可避免的杂质,Cu具有长径为100nm以上的粒状Cr相和纵横比 小于10的析出物以≥20个/μm 2 的密度析出为≥100nm的Cr相以外的Cu基质。 版权所有(C)2006,JPO&NCIPI

    Vibration generating device and a method of manufacturing the same

    公开(公告)号:JP3701666B1

    公开(公告)日:2005-10-05

    申请号:JP2004330008

    申请日:2004-11-15

    CPC classification number: B06B1/16 H02K7/061 H02K15/02

    Abstract: 【課題】 振動子とモータ回転軸との高い接合強度が得られ、かつ製造作業性・生産性が良好で低コストに製造できる振動発生装置を提供する。
    【解決手段】 振動子本体3に突設された1対の軸受用突部間に形成された溝部内にモータの回転軸1を挿入した状態で、前記両軸受用突部を溝部内側方向に加締めることにより、回転軸1が加締め部6a,6bに拘束・固定された構造を有し、この加締め部6a,6bは、少なくともその頂部及びそれよりも外側部の上部外面が振動子幅方向で凸曲面状に構成され、好ましくは、下部外面が振動子幅方向で凹曲面状に構成されるとともに、上部外面と下部外面とが振動子幅方向で連続的な曲面を構成する。
    【選択図】 図2

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