公开(公告)号：AU2003227205B2

公开(公告)日：2007-11-01

申请号：AU2003227205

申请日：2003-03-26

Applicant: TOPPAN FORMS CO LTD

Inventor： HIRASAWA AKIRA

IPC: C09J4/00 ,  C09J4/06 ,  C09J7/02 ,  C09J11/08 ,  C09J107/00

Abstract: Adhesive composition contains natural rubber fine particles evenly dispersed in radiation curable compound. An independent claim is also included for the preparation of the composition.

公开(公告)号：DE60307563T2

公开(公告)日：2007-09-06

申请号：DE60307563

申请日：2003-03-26

Applicant: TOPPAN FORMS CO LTD

Inventor： HIRASAWA AKIRA

IPC: C09J4/00 ,  B42D15/02 ,  C09J4/06 ,  C09J7/02 ,  C09J11/08 ,  C09J107/00 ,  G09F3/00

Abstract: Adhesive composition contains natural rubber fine particles evenly dispersed in radiation curable compound. An independent claim is also included for the preparation of the composition.

公开(公告)号：HK1066980A1

公开(公告)日：2005-03-18

申请号：HK04110124

申请日：2004-12-21

Applicant: TOPPAN FORMS CO LTD

Inventor： HIRASAWA AKIRA

IPC: C09J20060101 ,  B42D20060101 ,  C09J4/00 ,  C09J4/06 ,  C09J7/02 ,  C09J11/08 ,  C09J107/00 ,  G09F20060101

Abstract: Adhesive composition contains natural rubber fine particles evenly dispersed in radiation curable compound. An independent claim is also included for the preparation of the composition.

公开(公告)号：CA2621213A1

公开(公告)日：2005-03-10

申请号：CA2621213

申请日：2004-08-30

Applicant: TOPPAN FORMS CO LTD

Inventor： OKADA TAKAAKI ,  ISETANI YUKIHIKO ,  FUKUDA YASUHIRO ,  IDE YOSHIAKI ,  SHIMIZU HIDEO ,  YAMAZAKI AKIRA ,  HANAZAWA FUMIHIRO ,  YAMAKAMI TAKESHI

IPC: G10K15/04 ,  B42D15/02 ,  H05K1/18

公开(公告)号：AU2004268861A1

公开(公告)日：2005-03-10

申请号：AU2004268861

申请日：2004-08-30

Applicant: TOPPAN FORMS CO LTD

Inventor： YAMAGAMI TAKESHI ,  YAMAZAKI AKIRA ,  ISETANI YUKIHIKO ,  IDE YOSHIAKI ,  HANAZAWA FUMIHIRO ,  OKADA TAKAAKI ,  SHIMIZU HIDEO ,  FUKUDA YASUHIRO

IPC: B42D15/02 ,  G09F1/02 ,  G09F1/04 ,  G09F3/00 ,  G09F25/00 ,  G10K15/04 ,  H01M2/10 ,  H01M2/20 ,  H01M6/40

Abstract: Sheet-like audio information recording/reproducing means capable of recording/reproducing audio information is sandwiched between two support sheets from front and back only in part of the area thereof and these two support sheets are further sandwiched between two surface sheets and the support sheets and surface sheets are bonded together.

公开(公告)号：AU2004207106A1

公开(公告)日：2004-08-12

申请号：AU2004207106

申请日：2004-01-27

Applicant: TOPPAN FORMS CO LTD

Inventor： OKUZAKI HIDENORI ,  ISHIHARA MASAYOSHI ,  ENDO YASUHIRO ,  TAKAHASHI YUYA

IPC: C08L65/00 ,  C08L101/00 ,  C09D5/24 ,  H01B1/12 ,  H01M4/86 ,  H01M4/88 ,  H01M4/92 ,  H01M8/10

Abstract: A conductive polymer gel contains water, as a main component, a conductive conjugated polymer, and a surfactant and/or an alcohol, and also it may contain an electrolyte. The conductive conjugated polymer may further be doped with a dopant. The conductive polymer gel is obtained by adding a surfactant and/or an alcohol to a conductive conjugated polymer colloidal dispersion and/or a conductive conjugated polymer solution and leaving the mixture to stand, thereby to gelatinize the mixture.

公开(公告)号：HK1026967A1

公开(公告)日：2000-12-29

申请号：HK00105666

申请日：2000-09-08

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO ,  MARUYAMA TORU ,  KAGAMI YASUO ,  KODAMA KAZUNARI

IPC: H01B1/20 ,  G06K19/077 ,  H05K1/09 ,  H05K3/46 ,  H05K ,  G06K

Abstract: There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m OMEGA /sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of che total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 mu m, a specific surface area of 0.5-5.0 m /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 mu m and a specific surface area of 0.5-5.0 m /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 - 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.

公开(公告)号：SG74754A1

公开(公告)日：2000-08-22

申请号：SG1999004861

申请日：1999-09-30

Applicant: TOPPAN FORMS CO LTD

Inventor： ENDO YASUHIRO ,  KAGAMI YASUO ,  MARUYAMA TORU ,  KODAMA KAZUNARI

IPC: H01B1/20 ,  G06K19/077 ,  H05K1/09 ,  H05K3/46 ,  G06K10/077 ,  C08K19/02

Abstract: There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m OMEGA /sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of che total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 mu m, a specific surface area of 0.5-5.0 m /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 mu m and a specific surface area of 0.5-5.0 m /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40 - 95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.

公开(公告)号：HK1210799A1

公开(公告)日：2016-05-06

申请号：HK15111611

申请日：2015-11-25

Applicant: TOPPAN FORMS CO LTD

Inventor： TAKUYA SEKIGUCHI ,  KEIKO OMATA

IPC: C09D20060101 ,  H01B20060101 ,  H05K20060101

公开(公告)号：HK1210311A1

公开(公告)日：2016-04-15

申请号：HK15110720

申请日：2015-10-29

Applicant: TOPPAN FORMS CO LTD

Inventor： OCHI YOSHINORI ,  KAWAMURA MAKOTO

IPC: G09F20060101

Abstract: According to the present invention, an adhesive layer for peelably affixing the region of an upper substrate corresponding to a delivery form and a lower substrate to each other is provided intermittently to each of a plurality of linear adhesion strips running in parallel from the side of the starting end toward the side of the completion end with regard to the peeling of the region of the upper substrate corresponding to the delivery form and the lower substrate from each other. On an arbitrary straight line orthogonal to the adhesion strips, the adhesive layer is absent on at least one of the adhesion strips.