公开(公告)号：KR1020090072936A

公开(公告)日：2009-07-02

申请号：KR1020080091047

申请日：2008-09-17

Applicant: 제일모직주식회사

Inventor： 이선애 ,  홍상현 ,  신경훈

IPC: C08K5/10 ,  C08K5/5373 ,  C08L101/00

CPC classification number: C08K5/49 ,  C08K3/016 ,  C08K5/0066 ,  C08K5/092 ,  C08L101/00 ,  C08L2201/02 ,  C09K21/04 ,  C09K21/12

Abstract: A flame retardant thermoplastic resin composition is provided to ensure excellent stability and fire retardant characteristic, to reduce raw material ratio, and to improve processability. A flame retardant thermoplastic resin composition comprises (A) a thermoplastic resin 100.0 parts by weight, (B) a sublimable filler 1~40 parts by weight, and (C) phosphate flame retardant 1~30 parts by weight. The thermoplastic resin(A) is selected from the group consisting of an aromatic vinyl-based resin, rubber-modified aromatic vinyl-based resin, polyphenyleneether-based resin, polycarbonate-based resin, polyester-based resin, methacrylate-based resin, polyarylene sulfide-based resin, polyamide-based resin, polyvinyl chloride-based resin, polyolefin-based resin and a mixture of two kinds of them.

Abstract translation: 提供阻燃热塑性树脂组合物，以确保优异的稳定性和阻燃特性，降低原料比，并提高加工性能。 阻燃性热塑性树脂组合物包含（A）100.0重量份的热塑性树脂，（B）1〜40重量份的升华填料和（C）1〜30重量份的磷酸酯阻燃剂。 热塑性树脂（A）选自芳族乙烯基类树脂，橡胶改性芳族乙烯基类树脂，聚苯醚类树脂，聚碳酸酯类树脂，聚酯类树脂，甲基丙烯酸酯系树脂，聚亚芳基 硫化物类树脂，聚酰胺类树脂，聚氯乙烯类树脂，聚烯烃类树脂及其两种混合物。

公开(公告)号：KR100778010B1

公开(公告)日：2007-11-28

申请号：KR1020060135848

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 이민수 ,  이선애 ,  이변근 ,  홍상현 ,  최진환

IPC: C08L25/06 ,  C08K5/49

Abstract: A nonhalogenated flame retardant styrene-based resin composition, a pellet obtained by extruding the composition, and an exterior material of an electronic device molded from the composition are provided to improve weather resistance, moldability and environmental friendliness by using no halogen-based flame retardant and reducing the amount of polyphenylene ether. A resin composition comprises 100 parts by weight of a base resin which comprises 80-95 wt% of a styrene-based resin and 5-20 wt% of a polyphenylene ether resin; 1-25 parts by weight of a pentaerythritol diphosphonate represented by the formula 1; and 1-25 parts by weight of an organic phosphorus-based compound, wherein R1 is a C1-C12 alkyl group, an aryl group, an alkyl-substituted aryl group, or an aralkyl group. The organic phosphorus-based compound is at least one selected from the group consisting of an alkyl phosphinic acid metal salt compound represented by the formula 2 (wherein R is a C1-C6 alkyl group, a cyclic alkyl group, or a C6-C10 aryl group; M is Al, Zn or Ca; and n is 2 or 3), an aromatic phosphate compound represented by the formula 3 (wherein R3, R4 and R5 are independently H or a C1-C4 alkyl group; X is a C6-C20 aryl group substituted or unsubstituted with an alkyl group derived from resorcinol, hydroquinol or bisphenol A; and n is 0-4), and a phosphazene compound represented by the formula 4 or 5.

Abstract translation: 提供非卤代阻燃苯乙烯基树脂组合物，通过挤出组合物获得的颗粒和由该组合物模制的电子器件的外部材料，以通过使用不含卤素阻燃剂来改善耐候性，成型性和环境友好性， 减少聚苯醚的用量。 树脂组合物包含100重量份的基础树脂，其包含80-95重量％的苯乙烯基树脂和5-20重量％的聚苯醚树脂; 1-25重量份由式1表示的季戊四醇二膦酸盐; 和1-25重量份的有机磷系化合物，其中R1是C1-C12烷基，芳基，烷基取代的芳基或芳烷基。 有机磷系化合物是选自由式2表示的烷基次膦酸金属盐化合物（其中R是C1-C6烷基，环状烷基或C6-C10芳基）的至少一种 基团; M为Al，Zn或Ca; n为2或3），由式3表示的芳族磷酸酯化合物（其中R3，R4和R5独立地为H或C1-C4烷基; X为C6- C20芳基取代或未取代，与衍生自间苯二酚，氢醌或双酚A的烷基，n为0-4）和由式4或5表示的磷腈化合物。