Abstract:
PROBLEM TO BE SOLVED: To provide a substrate holder in which a fixing force between the top face of the substrate holder and the rear of a substrate is out of the question. SOLUTION: A lithographic device contains an illumination system supplying the beams of a radiation, and an article supporter supporting a flat article arranged in the path of the beam of the radiation. The lithographic device further contains a back-fill gas supply arranged to the article supporter for supplying the rear of the article with a back-fill gas when the back-fill gas supply is supported by a supporting means and a clamp clamping the article to the article supporter during a projection. The device based on one mode has a controller adjusting the clamp and/or a back-fill supply pressure with the object of the release of the clamp before the back-fill gas supply pressure is reduced. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography system and a device manufacturing method in which a wafer chuck is thermally satisfactorily adjusted. SOLUTION: The lithography system is provided, comprising an illumination system for providing a radiation beam, and a support structure for supporting a pattern forming device. The pattern forming device functions to pattern a sectional face of the radiation beam. Also, the lithography system has a substrate table for holding a substrate, and a projection system for projecting a patterned beam on a target portion of the substrate. The lithography system further has a chuck for supporting a target object and a frame for supporting the chuck over other portion of the lithography system. The chuck is thermally separated from at least the frame. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a device manufacturing method, a lithographic apparatus, and a device manufactured by it. SOLUTION: The device manufacturing method includes the steps of supplying a substrate W, supplying a projection radiation beam PB by using an illumination system IL, using a patterning means MA so as to furnish a pattern to a cross-section of the projection beam PB, sequentially projecting the patterned radiation beam PB to some external target parts CO of the substrate W, prior to projecting the beam on an internal target part CI of the substrate W, and separating each of the continuous external target parts CO i+1 , by spaces from external target parts CO i that precede the continuous external parts CO i+1 . COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation:要解决的问题:提供一种器件制造方法,光刻设备及其制造的器件。 解决方案:器件制造方法包括以下步骤:使用图案形成装置MA提供衬底W,通过使用照明系统IL提供投影辐射束PB,以便向突起的横截面提供图案 在将光束投射到基板W的内部目标部分CI之前,将图案化的辐射束PB顺序地投影到基板W的一些外部目标部分CO,并且分离连续的外部目标部分CO i + 1 SB>,在外连续的外部部分CO i + 1之前的外部目标部分CO i SB>之间。 版权所有(C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide photolithographic equipment which solves the problem wherein supporting of a wafer becomes unequal near the border of a substrate holder, and flattens a substrate by a method controllable near the edge of the substrate. SOLUTION: The lithographic projection equipment comprises a radiation system for supplying a projection beam of radiation, a support structure member for supporting a patterning means which serves to patternize the projection beam according to a desired pattern, the substrate holder which has a plurality of projection forming the projection configurations of supplying mostly flat supporting face to support an almost flat substrate, and the projection system of projecting the beam patternized on the target section of the substrate. The substrate holder comprises at least one clamped electrode for generating electric field, in order to clamp the substrate against the substrate holder by the electric field; further, a peripheral supporting edge portion is arranged so that it touches the substrate. At least one electrode extends across the peripheral supporting edge portion. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography apparatus wherein although during processings in a lithography projection apparatus a wafer is clamped onto a wafer holder with retaining force such as vacuum, and although when the wafer is released from the wafer holder after the completion of the processings, releasing force is applied to the wafer by an exhaust pin, the wafer and/or the wafer holder might be damaged in the last step of the release of energy stored in the wafer due to distortion by the releasing force, so that such harmful energy is prevented from being left behind. SOLUTION: The wafer retained on the wafer holder is released by applying the releasing force by a discharge pin. Since the releasing force is weakened by a control device just before final release, the quantity of energy absorbed by the wafer is decreased, and hence the energy during the release is prevented from damaging the wafer and/or the wafer holder. Further, surplus energy may be absorbed by providing a protective rim on an outer periphery of protrusions forming the retaining surface of the wafer holder. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate holder which can clamp a concave substrate more securely. SOLUTION: A substrate holder 10 has burls 12 having a height of 100 μm or less and at least 10 vacuum ports arranged within a central region extending to a radius of two thirds the radius of the substrate. Thus, a concave wafer W' can be securely clamped by generating an initial vacuum in the central region which exerts a clamping force tending to flatten the wafer and allowing the initial vacuum to deepen so that the wafer is fully clamped. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic chuck, capable of suppressing a Johnson-Rahbek effect to a minimum and further increasing the throughput of a substrate. SOLUTION: In this device, an electrostatic chuck 10 is provided with a dielectric element 12, with a plurality of pins 16, having at least a conductive layer on the surface making contact with an article formed on a first surface. The article is secured at a fixed position on the chuck 10, by applying potential difference between an electrode 14 that is located on the surface of a dielectric member on a side opposite to the securing surface and an electrode 20, that is located on the securing surface of the article 18 to be secured. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To compensate disturbance on a mirror surface.SOLUTION: A lithographic apparatus includes a system for compensating the effect of heat strain of a substrate table WT on position measurement of the substrate table WT by using lateral mirrors 66 and 68 in the substrate table WT. The lithographic apparatus is calibrated by using various substrate table scan loci, and measurement of rotation and local position of the lateral mirrors 66 and 68 in the substrate table WT. A dual stage lithographic apparatus is so provided with an alignment mark for specifying geometric shape of the lateral mirrors 66 and 68 used only by an exposure station, as to measure the geometric shape of the lateral mirrors 66 and 68 in the case where the substrate table WT is at a measurement station.
Abstract:
PROBLEM TO BE SOLVED: To make liquid to be removed from a gap between the edge of an object and a substrate table on which the object is placed.SOLUTION: For example, in the embodiment of the drain pipe 10 of the lithographic projection apparatus, the inflow of gas into the drain pipe is reduced in a period the liquid is absent at all in a drain pipe 10. In an embodiment, a passive liquid removal mechanism is provided so that the gas pressure in the drain pipe is the same as the ambient gas pressure. In another embodiment, a flap is prepared to close a chamber during the removing of liquid is not needed.
Abstract:
PROBLEM TO BE SOLVED: To reduce effect of thermal expansion and thermal contraction in a liquid-immersion system using a supply system for supplying an immersion liquid to a substrate and/or a local area of a substrate table. SOLUTION: The lithographic apparatus includes a substrate table configured to support the substrate on a substrate supporting area and including a plurality of heaters 400 and/or temperature sensors 500 arranged adjacently to a center part of the substrate supporting area. The plurality of heaters and/or sensors are elongated in a parallel direction substantially, and extend over the substrate support area from one edge end part to an opposite edge end part. A time when they are under a projection system during a period of imaging becomes shorter than a case where an elongated direction of the heaters and/or sensors are perpendicularly oriented to a first direction. COPYRIGHT: (C)2011,JPO&INPIT